DSAUD0068115.pdf

Manufacturer Texas Instruments
Partial File Text PowerPADTM - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments,
Datasheet Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

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