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    XPC850SEZT33

    Abstract: XPC850DHZT33A XPC850DCZT33A xpc850SRZT50A MOTOROLA D26 pb28 MPC850 AN1231 MOTOROLA d11 IPB1
    Text: 7/98 Advance Information MPC850 Mechanical Data and Ordering Information This document contains mechanical data and ordering information for the MPC850. Package Type Frequency MHz Temperature Order Number 256-Lead Plastic Ball Grid Array 0-33 Jct Temp: 0°C to 95°C


    Original     		MPC850 MPC850. 256-Lead XPC850ZT33 XPC850SEZT33 XPC850DCZT33A XPC850DEZT33A XPC850SEZT33 XPC850DHZT33A XPC850DCZT33A xpc850SRZT50A MOTOROLA D26 pb28 AN1231 MOTOROLA d11 IPB1 PDF

    XPC850SRZT50BT

    Abstract: XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 MPC850 XPC850SRCZT50B
    Text: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC850 XC Qualification in TSMC/WaferTech EFFECTIVE DATE: 30-SEPT-00 Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for


    Original     		MPC850 30-SEPT-00 MOS11 C850ZT66A, PPC850SRZT50A, SC530206ZT50B, XPC850CZT50A, XPC850SRZT50BT XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 XPC850SRCZT50B PDF