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Catalog Datasheet	MFG & Type	PDF	Document Tags
Lead Free reflow soldering profile BGA Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile Text: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 v1.0 December 9, 2002 Summary The primary purpose of solder reflow process is to wet the surfaces to be joined to form a strong metallurgical bond between the component and the PC board.	Original	PDF	XAPP425 Lead Free reflow soldering profile BGA XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile

Catalog Datasheet

MFG & Type

PDF

Document Tags

Lead Free reflow soldering profile BGA

Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile
Text: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 v1.0 December 9, 2002 Summary The primary purpose of solder reflow process is to wet the surfaces to be joined to form a strong metallurgical bond between the component and the PC board.

Original

PDF

XAPP425 Lead Free reflow soldering profile BGA XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile