Untitled
Abstract: No abstract text available
Text: THIN FILM MULTI-TAP RESISTORS MSMT 116 SERIES LOG RESISTOR MECHANICAL DA TA DAT Rmax. SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.060" x 0.020" x 0.010" ±0.003" SILICON OR ALUMINA TANT ALUM NITRIDE ANTALUM 25,000 Å MINIMUM GOLD BARE SUBSTRA
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T-240R0J-GB
116AT
112-D-1198
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Mini-Systems
Abstract: No abstract text available
Text: THIN FILM MULTI-TAP RESISTORS MSMT 116 SERIES LOG RESISTOR MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.060" x 0.020" x 0.010" ±0.003" SILICON OR ALUMINA TANT ALUM NITRIDE ANTALUM 25,000 Å MINIMUM GOLD BARE SUBSTRA
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T-240R0J-GB
116AT
112-H-0306
Mini-Systems
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622-0641
Abstract: 622-3041 622-1430
Text: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR WITH 30µ INCHES GOLD .100" x .100" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic rated UL 94V-0 COLOR: Blue CONTACTS: Beryllium copper 30µ inches minimum gold over 50µ inches nickel in contact zone;
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LR92984
E60980
622-0641
622-3041
622-1430
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Untitled
Abstract: No abstract text available
Text: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR WITH 15µ INCHES GOLD .100" x .100" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic rated UL 94V-0 COLOR: Black CONTACTS: Phosphor bronze 15µ inches minimum gold over 50µ inches nickel in contact zone;
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LR92984
E60980
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X-GOLD 118
Abstract: xgold 118 ARM11 processor Infineon X-GOLD 116 X-GOLD x-goldtm ARM11 baseband block diagram of wireless gsm camera infineon x-gold gsm modem block diagram
Text: Product Brief X-GOLDTM116 Ultra-low cost GSM/GPRS Single-Chip Solution for Messaging Phones Main Features THE Infineon X-GOLD 116 is the first Single-Chip in 65nm CMOS technology that integrates Baseband, RF Transceiver, Power Management Unit and FM Radio. After the successful market introduction of the 2nd generation
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X-GOLDTM116
X-GOLDTM101
X-GOLDTM116
ARM11ances.
B153-H9348-X-X-7600
NB08-1333
X-GOLD 118
xgold 118
ARM11 processor
Infineon X-GOLD 116
X-GOLD
x-goldtm
ARM11 baseband
block diagram of wireless gsm camera
infineon x-gold
gsm modem block diagram
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12MM
Abstract: HDAM-15-12 C12C10 c12 assembly instruction
Text: REVISION A HDAM-XX-XX.X-X-13-X-X "D" REF PIN 11A (13 ROW PER POSITION) -11 -15 -23 3.25 .128 (REF) DO NOT SCALE FROM THIS PRINT 22.50 .886 (REF) LEAD STYLE -12.0: 12MM -17.0: 17MM CL No OF ROWS -13 PLATING SPECIFICATION -S: SELECTIVE, .000030 INCHES GOLD IN MATING AREA,
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X-X-13-X-X
WT-24-XX
MPP-26-01-N)
X-X-13-X-X-MKT
12MM
HDAM-15-12
C12C10
c12 assembly instruction
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Untitled
Abstract: No abstract text available
Text: UG78D6646JG Data sheets can be downloaded at www.unigen.com 64M Bytes 8M x 64 bits SYNCHRONOUS DRAM MODULE 184 Pin DDR SDRAM Unbuffered DIMM based on 4 pcs 8M x 16 DDR SDRAM 4K Refresh FEATURES • • PART IDENTIFICATION SDRAM PACKAGE PLATING 4K TSOP Gold
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UG78D6646JG
64ms/4K)
1250mil)
A0-A11:
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609-F161M
Abstract: No abstract text available
Text: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR .100" x .200" .100" x .300" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic, rated UL 94V-0 COLOR: Blue CONTACT MATERIAL: Beryllium copper with 30µ inches min. gold over 50µ inches min. nickel in contact
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LR92984
E60980
609-F141M2
609-F161M2
609-F141M
609-F161M
609-F161M
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Untitled
Abstract: No abstract text available
Text: REVISION B SEE NOTE 2 DO NOT SCALE FROM THIS PRINT SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION
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SPM-05-X-X-XXX-PF
OR-112-01
SH41-01-X
DCN-1532-32
C-296-01-X
EPOXY-01
PT-YFW-12T-P
TP-28
PT-1-24-02-112
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Untitled
Abstract: No abstract text available
Text: REVISION C SEE NOTE 2 SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION
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SPM-05-X-X-XXX-PF
OR-112-01
SH41-01-X
DCN-1532-32
C-296-01-X
SH41-XX-X
EPOXY-01
PT-YFW-12T-P
TP-28
PT-1-24-02-112
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SPM-05-S-B-VT1-PF
Abstract: No abstract text available
Text: REVISION D SEE NOTE 2 SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION
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SPM-05-X-X-XXX-PF
OR-112-01
SH41-01-X
DCN-1532-32
C-296-01-X
SH41-XX-X
EPOXY-01A
PT-YFW-12T-P
TP-28
PT-1-24-02-112
SPM-05-S-B-VT1-PF
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Untitled
Abstract: No abstract text available
Text: .156" 3.96mm Series 179 Right Angle Connector .156 (3.96) Centers Card Edge Tuning Fork Contacts PART NUMBER CODING 1 79- X X X - X X CONTACT PLATING CONTACT SURFACE AND TERMINATION 30 = .000010 GOLD OVERALL 32 = 000020 GOLD OVERALL ALL GOLD PLATED OVER .000050
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X79-XX3-XX
X79-XX4-XX
X79-XX5-XX
X79-XX6-XX
X79-XX7-XX
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Untitled
Abstract: No abstract text available
Text: THIN FILM MULTI TAP RESISTORS 116 SERIES LOG RESISTOR MECHANICAL DATA .060" x . 020" X .010" + .0 0 3 " SILICON OR ALUMINA TANTALUM NITRIDE 25,000 A MINIMUM GOLD BARE SUBSTRATE GOLD BACK OPTIONAL SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE ELECTRICAL DATA
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150ppm
-20dB
125mW
116-240ROJ-0000
240fi,
CN-TF112-A-0993
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Untitled
Abstract: No abstract text available
Text: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold
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Gold/10p"
Gold/200
/Tin/200
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Untitled
Abstract: No abstract text available
Text: Customer Information Sheet DRAWING N o .: SHEET M80-882XXXX 2 OF 2 I If IN D OUBT M80-882XXXX FIN IS 22 45 42 H : : : O F WAY S 1 7 . 22 : -S E L E C T I V E GOLD GOLD S E L E C T I V E GOLD ♦ TIN/LEAD / I00X TIN | | •2.00 x No.
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M80-882XXXX
M80-882XXXX
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Untitled
Abstract: No abstract text available
Text: NOTES: 1. MATERIALS AND FINISHES: BODY - BRASS, GOLD PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - TEFLON 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, 3. MECHANICAL: A. DURABILITY: 500 CYCLES MIN. B. TEMPERATURE RANGE: - 65'C to + 1 6 5 X
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116051AAZ02GA5F
SMA6051A1-008-3GT50G-50
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Ab00
Abstract: No abstract text available
Text: REV ORDER INFORMATION A 288 90 XX XX X APP. ECN NO. DATE NEW DESIGN Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart SPECIFICATION -Type * Current Rating: 1A * Withstanding Voltage: 500 VAC (1 min.) Insulation Resistance: * 1000 Megohms MIN.
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C28890XXXXX
Ab00
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Untitled
Abstract: No abstract text available
Text: REV A APP. ECN NO. NEW DESIGN ORDER INFORMATION 288 84 XX XX X H - Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart 00: B:0.9 01: B:1.3 SPECIFICATION * Current Rating: 1 A * Withstanding Voltage: 500 VAC ( 1 min. ) * Insulation Resistance:
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C28884XXXXX
C28884XXXXX
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C2888
Abstract: No abstract text available
Text: REV ECN NO. APP. NEW DESIGN A ORDER INFORMATION 288 84 XX XX X H - Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart 00: B:0.9 01: B:1.3 SPECIFICATION * Current Rating: 1 A * Withstanding Voltage: 500 VAC ( 1 min. ) * Insulation Resistance:
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C28884XXXXX
C2888
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Untitled
Abstract: No abstract text available
Text: REV A ORDER INFORMATION APP. ECN NO. NEW DESIGN DATE 288 90 XX XX X I _ Plating: 2: Selective Gold 3: All Gold No. O f Contact 08 ~ 80 Pin Chart 0.7 SPECIFICATION -Type * Current Rating: 1A * Withstanding Voltage: 4-.0±0.20 500 VAC (1 m in.) o Insulation Resistance:
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C28890XXXXX
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Transistor S 40443
Abstract: No abstract text available
Text: bbS3T31 0024T37 flOO « A P X Philips Semiconductors NPN 7 GHz wideband transistor £ BFG197; BFG197/X; BFG197/XR AMER PHILIPS/ DIS CRETE FEATURES Product specification b?E D PINNING PIN • High power gain • Low noise figure • Gold metallization ensures
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bbS3T31
0024T37
BFG197;
BFG197/X;
BFG197/XR
BFG197
BFG197
OT143
BFG197/X
Transistor S 40443
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transistor vc 548
Abstract: transistor C 548 B Philips
Text: bbSBTBl DDSMflDT Tb5 « A P X P hilips Sem iconductors NPN 12 GHz wideband transistor BFG33; BFG33/X N AUER PHILIPS/DISCRETE FEATURES Product specification b7E J> PINNING PIN • High power gain • Low noise figure • Gold metallization ensures excellent reliability.
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BFG33;
BFG33/X
BFG33
BFG33/X;
OT143.
transistor vc 548
transistor C 548 B Philips
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Untitled
Abstract: No abstract text available
Text: APP. REV ECN NO. A NEW DESIGN CUSTOMER COPY DATE ORDER INFORMATION 188 66 XX XX X n n n n n n n n • Plating: 2: Selective Gold 3: All Gold No. Of Contact 0 8 ~ u u u u u u u u 2.0±0.10 80 Chart — 0.50±0.05 Type 2.00*(NO OF CONTACTS/2-1) ±0.25 4.0±0.20
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C18866XXXXX
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thv8
Abstract: HYB39S16800T 16m x 4 hyb
Text: SIEMENS SIMM-Modules Product View S IM M -M odules Product View SIMM-Modules non-parity 2M X 32 FPM EDO FPM G = Gold leaded Semiconductor Group 26 EDO SIEMENS SIMM-Modules Product View 4M x 3 2 8M FPM EDO 32 FPM L-SIM-72-12 HYM 324020S/GS X EDO L-SIM-72-15
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L-SIM-72-12
324020S/GS
324025S/GS
L-SIM-72-15
328020S/GS
328025S/GS
364020S/GS
L-SIM-72-13
364035S/GS
thv8
HYB39S16800T
16m x 4 hyb
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