WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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AN69061
AN69061
WLCSP smt
EIA-481-D-2008
Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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Nihon handa rx303-92skho
Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale
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VMMK-1225
VMMK-125
AV02-1078EN
Nihon handa rx303-92skho
RX303-92SKHO
0402 land pattern
INCOMING INSPECTION solder paste
recommended land pattern for 0402 cap
WLCSP stencil design
land pattern for WLCSP
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SAC405
Abstract: SAC405 Data sheet FAN5902UCX MO-229 for3g AN608 3g transistor
Text: FAN5902 800mA Buck Converter for 3G RFPAs Features Description 92% Efficient Synchronous Operation The FAN5902 is a high-efficiency, low-noise, synchronous, step-down DC-to-DC converter designed for powering the radio frequency power amplifiers
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FAN5902
800mA
470nH
FAN5902
SAC405
SAC405 Data sheet
FAN5902UCX
MO-229
for3g
AN608
3g transistor
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Untitled
Abstract: No abstract text available
Text: Technical Article MS-1908 . Chip Scale Packaging Helps Portable Medical Devices Save Size and Weight by Mike Delaus and Santosh Kudtarkar, Analog Devices, Inc. IDEA IN BRIEF Wafer-level chip scale packages are allowing designers of portable healthcare equipment—such as invasive sensing,
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MS-1908
T09525-0-12/10
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SAC387
Abstract: IPC-7525 pcb warpage in ipc standard land pattern for WLCSP "x-ray machine" ROSIN FLUX TYPE ROL0 WLCSP stencil design FDZ191P sac105 IPC-9075
Text: www.fairchildsemi.com AN-6084 Surface Mount Assembly Guideline for WLCSP 1.0x1.5 Introduction The Wafer-Level Chip-Scale Package WLCSP is one of the smallest discrete MOSFET devices available in the market. Fairchild’s offering comes in two ultra-low profile
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AN-6084
SAC387
IPC-7525
pcb warpage in ipc standard
land pattern for WLCSP
"x-ray machine"
ROSIN FLUX TYPE ROL0
WLCSP stencil design
FDZ191P
sac105
IPC-9075
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for3g
Abstract: FAN5903UCX FAN5903 FAN5903 2008
Text: PROVIDED UNDER NDA — PROPRIETARY AND CONFIDENTIAL — DO NOT DISTRIBUTE FAN5903 Buck Converter with Bypass Mode for 3 G / 3.5 G / 4 G PAs Features Description • • FAN5903 is a high-efficiency, low-noise, synchronous, step-down, DC-DC converter designed for powering
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FAN5903
FAN5903
for3g
FAN5903UCX
FAN5903 2008
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Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
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SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
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Untitled
Abstract: No abstract text available
Text: SMM5145XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept IIP3 : +22dBm • 2LO-RF Isolation : 45dB
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SMM5145XZ
-12dB
22dBm
10dBm
SMM5145XZ
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Untitled
Abstract: No abstract text available
Text: MIC94161/2/3/4/5 3A High-Side Load Switch with Reverse Blocking General Description Features The MIC94161/2/3/4/5 is a family of high-side load switches designed to operate from 1.7V to 5.5V input voltage. The load switch pass element is an internal 14.5mΩ RDSON N-Channel MOSFET which enables the
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MIC94161/2/3/4/5
MIC94161/2/3/4/5
MIC9416x
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Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
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SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
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Untitled
Abstract: No abstract text available
Text: SMM5138XZ 12.7 – 15.4GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier • Conversion Gain : -13dB • Input Third Order Intercept IIP3 : +22dBm • LO-RF Isolation : 30dBc
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SMM5138XZ
-13dB
22dBm
30dBc
SMM5138XZ
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Untitled
Abstract: No abstract text available
Text: MIC94161/2/3/4/5 3A High-Side Load Switch with Reverse Blocking General Description Features The MIC94161/2/3/4/5 is a family of high-side load switches designed to operate from 1.7V to 5.5V input voltage. The load switch pass element is an internal 14.5mΩ RDSON N-Channel MOSFET which enables the
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MIC94161/2/3/4/5
MIC94161/2/3/4/5
MIC9416x
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JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
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marking 201B
Abstract: 201B 201C ISL99201 ISL99201IRTAZ-T ISL99201IRTAZ-TK ISL99201IRTBZ-T ISL99201IRTBZ-TK ISL99201IRTCZ-T
Text: ISL99201 Data Sheet February 27, 2009 Filterless High Efficiency 1.5W Class D Mono Amplifier The ISL99201 is a fully integrated high efficiency class-D mono amplifier. It is designed to maximize performance for mobile phone applications. The application circuit requires a
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ISL99201
ISL99201
400mW
FN6742
marking 201B
201B
201C
ISL99201IRTAZ-T
ISL99201IRTAZ-TK
ISL99201IRTBZ-T
ISL99201IRTBZ-TK
ISL99201IRTCZ-T
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JEP95 MS-028
Abstract: No abstract text available
Text: ES/SMM5723XZ Preliminary 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
JEP95 MS-028
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FAN4860UMP5X
Abstract: FAN4860UC5X LQM21PN1R0MC0 C1005X5R0J225M FAN4860 JESD22-A114
Text: FAN4860 3MHz, 5V Output Synchronous TinyBoost Regulator Features Description Operates with Very Small External Components: 1 H Inductor and 0402 Case Size Input and Output Capacitors Input Voltage Range from 2.3V to 4.5V The FAN4860 is a low-power boost regulator designed to
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FAN4860
200mA
300mA
FAN4860
FAN4860UMP5X
FAN4860UC5X
LQM21PN1R0MC0
C1005X5R0J225M
JESD22-A114
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FSA642
Abstract: FDMA1024NZ diagram circuit usb mp3 player with radio fm lcd CFL inverter circuit schematic diagram FAN5646 FDC610PZ block diagram 3x3 matrix keypad and microcontroller FDC658AP CFL 12v inverter circuit schematic diagram free pwm DC-DC SC70-5
Text: PORTABLE SOLUTIONS w w w. f a i r c h i l d s e m i . c o m INTRODUCTION Fairchild Semiconductor provides complete portable design solutions to assist in your design challenges and accelerate time to market in the ever fast moving design cycle. We offer a large portfolio of leading-edge products
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5723XZ 17 – 24GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.7dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5723XZ
24GHz
50ohm
ES/SMM5723XZ
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Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA
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SMM5722XZ
16GHz
50ohm
SMM5722XZ
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Untitled
Abstract: No abstract text available
Text: ES/SMM5724XZ Preliminary 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
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Untitled
Abstract: No abstract text available
Text: SMM5722XZ 12 – 16GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=2.3dB typ. • High Associated Gain : Gas=20dB (typ.) • Input Third Order Intercept Point (IIP3) : +5dBm • Low Current Consumption : IDD_LNA=30mA
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SMM5722XZ
16GHz
50ohm
SMM5722XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5724XZ 24 – 30GHz Low Noise/ Driver Amplifier MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Low Noise Figure : NF=3.2dB typ. • High Associated Gain : Gas=22dB (typ.) • Input Third Order Intercept Point (IIP3) : +4dBm
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ES/SMM5724XZ
30GHz
50ohm
ES/SMM5724XZ
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5141XZ 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
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ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
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Untitled
Abstract: No abstract text available
Text: ES/SMM5141XZ Preliminary 17.7 – 23.6GHz Up converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier and x2 multiplier • Conversion Gain : -12dB • Input Third Order Intercept Point IIP3 : +22dBm
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ES/SMM5141XZ
-12dB
22dBm
30dBc
ES/SMM5141XZ
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