underfill
Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
Text: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings
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AN-1050
AN-1035,
underfill
SILICON CONTROL RECTIFIER DETAILS
AN-1050
Aluminum alloys physical properties
Ablestik underfill
SN62 PB36 ag2 Copper
SN62 PB36 ag2
alsic 105
alsic
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SE4110S: GPS Receiver IC Applications Product Description • The SE4110S is a highly integrated GPS receiver offering high performance and low power operation in a wide range of low-cost applications. It is particularly well suited to cellphone and high sensitivity L1-band GPS /
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SE4110S:
SE4110S
DST-00065
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor MPC8560EC Rev. 3, 07/2004 Technical Data MPC8560 Integrated Processor Hardware Specifications The MPC8560 contains a PowerPC processor core. The MPC8560 integrates a processor that implements the PowerPC architecture with system logic required for networking, storage,
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MPC8560EC
MPC8560
MPC8560
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Bandpass filter SAW 2.4 GHz 50 Ohm
Abstract: No abstract text available
Text: DATA SHEET SE4110S: GPS Receiver IC Applications • • Product Description High sensitivity / low power GPS and A-GPS applications Portable navigation devices, mobile phones and GPS peripheral devices Telematics equipment Features
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SE4110S:
SE4110S
DST-00065
Bandpass filter SAW 2.4 GHz 50 Ohm
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PDF
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uart 16450 timing
Abstract: MPC8260 MPC8544EEC MPC860T PC16550D REQ64 RGMII Layout Guide
Text: Freescale Semiconductor Technical Data Document Number: MPC8544EEC Rev. 4, 09/2010 MPC8544E PowerQUICC III Integrated Processor Hardware Specifications 1 MPC8544E Overview This section provides a high-level overview of MPC8544E features. Figure 1 shows the major functional units within
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MPC8544EEC
MPC8544E
MPC8544E
32-bit
32-Kbyte
uart 16450 timing
MPC8260
MPC8544EEC
MPC860T
PC16550D
REQ64
RGMII Layout Guide
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PDF
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Untitled
Abstract: No abstract text available
Text: DATA SHEET SE4110S: GPS Receiver IC Applications Product Description • The SE4110S is a highly integrated GPS receiver offering high performance and low power operation in a wide range of low-cost applications. It is particularly well suited to cellphone and high sensitivity L1-band GPS /
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SE4110S:
SE4110S
02442A
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MPC8260
Abstract: MPC860T PC16550D REQ64 MPC8533
Text: Freescale Semiconductor Technical Data Document Number: MPC8533EEC Rev. 4, 09/2010 MPC8533E PowerQUICC III Integrated Processor Hardware Specifications 1 MPC8533E Overview This section provides a high-level overview of MPC8533E features. Figure 1 shows the major functional units within
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MPC8533EEC
MPC8533E
MPC8533E
32-bit
32-Kbyte
MPC8260
MPC860T
PC16550D
REQ64
MPC8533
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201654C
Abstract: Loctite hysol
Text: DATA SHEET SE2600S: 2.4 GHz WLAN Switch/Low-Noise Amplifier Front-End Applications • IEEE802.11b DSSS WLAN • IEEE802.11g/n OFDM WLAN • Embedded systems Features • Integrates an SP3T switch and LNA with bypass mode • Gain: 12 dB • Noise Figure: 1.8 dB
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SE2600S:
IEEE802
11g/n
11-bump,
JEDEC-J-STD-020)
SE2600S
201654C
201654C
Loctite hysol
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET SKY85606-11: 5 GHz, 802.11ac Switch/Low-Noise Amplifier Front-End VDD Applications • WiFi-enabled handsets, tablets, and mobile systems System-in-Package SiP modules for embedded systems 802.11n/ac smartphones and tablets
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SKY85606-11:
11n/ac
15-bump,
JEDEC-J-STD-020)
202882B
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mpc7448
Abstract: C10G2
Text: Freescale Semiconductor MPC7448EC Rev. 0, 9/2005 Advance Information MPC7448 RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7448. The MPC7448 is an implementation of the PowerPC microprocessor family of reduced instruction set computer RISC
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MPC7448EC
MPC7448
MPC7448.
MPC7450
C10G2
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EB62
Abstract: AMCC PART MARKING Chronos P1 metrowerks codetest MPC8560 tier fence high voltage high voltage tier fence generator MPC85xx tsec MPC8560PX667LB primer p19
Text: Freescale Semiconductor MPC8560EC Rev. 3, 07/2004 Technical Data MPC8560 Integrated Processor Hardware Specifications The MPC8560 contains a PowerPC processor core. The MPC8560 integrates a processor that implements the PowerPC architecture with system logic required for networking, storage,
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MPC8560EC
MPC8560
MPC9850
MPC9850
MPC9855
MPC9855
EB62
AMCC PART MARKING
Chronos P1
metrowerks codetest
tier fence high voltage
high voltage tier fence generator
MPC85xx tsec
MPC8560PX667LB
primer p19
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motorola diode marking B12
Abstract: No abstract text available
Text: Advance Information MPC7447AEC Rev. 0, 2/2004 MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7447A is an
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MPC7447AEC
MPC7447A
MPC7447A;
MPC7447.
MPC7447A.
MPC7450
MPC7455,
MPC7445,
MPC7450,
motorola diode marking B12
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201676B
Abstract: No abstract text available
Text: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied
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201676B
201676B
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET SKY85202-11: 2.4 GHz, 802.11ac Switch/Low-Noise Amplifier Front-End Applications VBATT BT • WiFi-enabled handsets, tablets, and mobile systems System-in-Package SiP modules for embedded systems 802.11n/ac smartphones and tablets
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SKY85202-11:
11n/ac
15-bump,
JEDEC-J-STD-020)
SQ04-0074.
202933C
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PDF
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AD14
Abstract: MPC107 DNA 1001 DL
Text: Advance Information MPC107EC/D Rev. 0.6, 12/2001 MPC107 PCI Bridge /Memory Controller Hardware Specifications This document provides an overview of the MPC107 PCI bridge/memory controller PCIB/MC for high-performance embedded systems. The MPC107 is a cost-effective,
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MPC107EC/D
MPC107
MPC107.
AD14
DNA 1001 DL
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET SKY85606-11: 5 GHz, 802.11ac Switch/Low-Noise Amplifier Front-End VDD Applications • WiFi-enabled handsets, tablets, and mobile systems System-in-Package SiP modules for embedded systems 802.11n/ac smartphones and tablets
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Original
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SKY85606-11:
11n/ac
15-bump,
JEDEC-J-STD-020)
202882C
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PDF
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Untitled
Abstract: No abstract text available
Text: Si8473EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.041 at VGS = - 4.5 V - 7.1 0.055 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET
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Si8473EDB
2002/95/EC
8473E
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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PDF
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Untitled
Abstract: No abstract text available
Text: Si8475EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.032 at VGS = - 4.5 V - 7.7 0.051 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET
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Si8475EDB
2002/95/EC
8475E
Si8475EDB-T1-E1
25trademarks
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: Si8473EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.041 at VGS = - 4.5 V - 7.1 0.055 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET
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Si8473EDB
2002/95/EC
8473E
Si8473EDB-T1-E1
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
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PDF
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Untitled
Abstract: No abstract text available
Text: Si8475EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.032 at VGS = - 4.5 V - 7.7 0.051 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET
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Si8475EDB
2002/95/EC
8475E
Si8475EDB-T1-E1
25hay
11-Mar-11
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PDF
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Untitled
Abstract: No abstract text available
Text: Si8473EDB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) () - 20 ID (A)a, e 0.041 at VGS = - 4.5 V - 7.1 0.055 at VGS = - 2.5 V - 6.1 • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET Power MOSFET
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Si8473EDB
2002/95/EC
8473E
Si8473EDB-T1-E1
11-Mar-11
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PDF
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor, Inc. Advance Information MPC7447AEC Rev. 0, 2/2004 Freescale Semiconductor, Inc. MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The MPC7447A is an
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MPC7447AEC
MPC7447A
MPC7447A;
MPC7447.
MPC7447A.
MPC7450
MPC7447AEC
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PDF
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Untitled
Abstract: No abstract text available
Text: Si8487DB Vishay Siliconix P-Channel 30-V D-S MOSFET FEATURES PRODUCT SUMMARY (A)a, e VDS (V) RDS(on) () Max. 0.031 at VGS = - 10 V - 7.7 - 30 0.035 at VGS = - 4.5 V - 7.3 0.045 at VGS = - 2.5 V - 6.4 ID • Halogen-free According to IEC 61249-2-21 Definition
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Si8487DB
Si8409DB
2002/95/EC
11-Mar-11
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PDF
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AS4DDR264M72PBG
Abstract: H11M1
Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG1 64Mx72 DDR2 SDRAM w/ SHARED CONTROL BUS iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • Proprietary Enchanced Die Stacked iPEM
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AS4DDR264M72PBG1
64Mx72
dat008
AS4DDR264M72PBG
H11M1
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