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    WIRE BOND PULL Search Results

    WIRE BOND PULL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    MP-5XRJ11PPXS-014 Amphenol Cables on Demand Amphenol MP-5XRJ11PPXS-014 Flat Silver Satin Modular Crossed wiring Cable, RJ11 / RJ11 14ft Datasheet

    WIRE BOND PULL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    precap

    Abstract: No abstract text available
    Text: Manufacturing Flow KIT FORMATION KIT INSPECTION DIE & COMPONENT ATTACH - WITH EPOXY CURE EPOXY CUSTOMER SOURCE INSPECTION IF APPLICABLE VACUUM BAKE HERMETIC SEAL MARK WIRE BOND QUAL/DESTRUCT WIRE PULL TEMPERATURE CYCLE WIRE BOND CONSTANT ACCELERATION WIRE BOND


    Original     		PDF

    XC2V1000

    Abstract: XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500
    Text: R Pinout Information Introduction This section describes the pinouts for Virtex-II devices in the following packages: • • • • • CS144: wire-bond chip-scale ball grid array BGA of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch


    Original     		PDF CS144: FG256, FG456, FG676: FF896, FF1152, FF1517: BG575 BG728: BF957: XC2V1000 XC2V1000 Pin-out IO-L93N XC2V80 XC2V40 XC2V250 XC2V500

    Quality & Reliability

    Abstract: No abstract text available
    Text: Quality & Reliability Program Calogic Quality Flow for Semiconductor Circuit Manufacturing Receiving Assembly QC Operator Monitor and Process Audit Die attach Lead-bond inspect Wire pull-test Incoming Inspection 100% Production 3rd Optical Stores QC Gate 3rd Optical


    Original     		PDF MIL-STD-883 1Q-25 Quality & Reliability

    nsmd smd

    Abstract: AND8195 SO8FL Solder paste stencil life AND8195/D 020C 1505C
    Text: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat


    Original     		PDF AND8195/D nsmd smd AND8195 SO8FL Solder paste stencil life AND8195/D 020C 1505C

    SO8FL

    Abstract: FOOTPRINT PCB nsmd smd stencil tension WS3060 so8 pcb pattern 1505C 020C
    Text: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat


    Original     		PDF AND8195/D SO8FL FOOTPRINT PCB nsmd smd stencil tension WS3060 so8 pcb pattern 1505C 020C

    LDMOS

    Abstract: No abstract text available
    Text: POLYFET RF DEVICES LDMOS Lateral Double Diffuse MOS Transistor The Next Generation polyfet rf devices 1 DMOS Technology • Vertical DMOS 9 Lateral DMOS • Bottom Side Drain • Source bond wire reducing gain • Higher Crss • BEO isolation • High Package Cost


    Original     		PDF L88081 L88082 L88013 L88012 L88008 L88007 L88016 L88026 1000Mhz LDMOS

    ABLEBONd 84-1

    Abstract: JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l

    ABLEBONd 84-1

    Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S

    Excelics Semiconductor

    Abstract: wrist
    Text: Excelics Semiconductor, Inc. DISTRIBUTION: CEO Marketing & Sales Human Resources Engineering Services Approvals Design & Test Engineering Fabrication Assembly & Test Purchasing Quality Assurance Document Control Shipping & Receiving ALL REV DESCRIPTION 01


    Original     		PDF

    Die Attach epoxy stamping

    Abstract: national semiconductor handbook national application handbook wire bond LM117 goodrich resin ltcc chip copper bond wire DIE ATTACH National Semiconductor Top Mark
    Text: Considerations in Implementing Chip-on-Board and Multi-Die Assemblies Mark McClintick Process Engineer September 17, 2003 Agenda • Manufacturing flow overview • Process considerations • General layout approaches • Thermal considerations 2 2003 National Semiconductor Corporation


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    SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

    Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
    Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .


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    MASK ROM 32M PROGRAM

    Abstract: samsung led monitor TTL 154 PAD 11
    Text: K3N6V U 1000F-C MASK ROM DIE 32M-Bit(4Mx8/2Mx16) CMOS Mask ROM FEATURES •Single 3.3V/ Single 3.0V power supply •Fast Access Time 3.3V Operation : 100ns (min)@CL=50pF 3.0V Operation : 120ns (min)@CL=100pF •x16 or x8 configurable with BHE-pin •TTL compatible inputs and outputs


    Original     		PDF 1000F-C 32M-Bit 4Mx8/2Mx16) 100ns 120ns 100pF Q15/A-1 MASK ROM 32M PROGRAM samsung led monitor TTL 154 PAD 11

    Silicon Controlled Rectifier Manual

    Abstract: jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060
    Text: Application Note AN-1060 Bare Die: Handling and Storage By Richard Clark Table of Contents Page Introduction .1 Packing/Carrier Type .1


    Original     		PDF AN-1060 Silicon Controlled Rectifier Manual jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060

    samsung led monitor

    Abstract: No abstract text available
    Text: K3N6C1000F-C MASK ROM DIE 32M-Bit 4Mx8/2Mx16 CMOS Mask ROM FEATURES •Single 5.0V power supply •Fast Access Time 5.0V Operation : 100ns (min)@CL=50pF 120ns (min)@CL=100pF •x16 or x8 configurable with BHE-pin •TTL compatible inputs and outputs •Three State Outputs


    Original     		PDF K3N6C1000F-C 32M-Bit 4Mx8/2Mx16) 100ns 120ns 100pF 32Mb6 Q15/A-1 samsung led monitor

    Untitled

    Abstract: No abstract text available
    Text: 3 Shield Bonding Products Scotchlok 4460 Shield Bond Connector No Tabbing Required Scotchlok 4460-S Shield Bond Connector The 4460-S Shield Bond Connector is designed to make a stable, low-resistance electrical connection between the shield of a communications cable and a


    Original     		PDF 4460-S 10/bag, 1000/cs. 20/bag,

    AN-1061

    Abstract: Ultrasonic welding circuit centrifuge machine for acceleration epoxy adhesive paste cte table soft solder die bonding ultrasonic flow meter ultrasonic transducer circuit ultrasonic generator ultrasonic bond Ultrasonic Transducer for gas meter
    Text: Application Note AN-1061 Bare Die: Die Attach and Wire Bonding Guidance for setting up assembly processes By Richard Clark Table of Contents Page Introduction .1 Storage and Handling .2


    Original     		PDF AN-1061 AN-1061 Ultrasonic welding circuit centrifuge machine for acceleration epoxy adhesive paste cte table soft solder die bonding ultrasonic flow meter ultrasonic transducer circuit ultrasonic generator ultrasonic bond Ultrasonic Transducer for gas meter

    MSTF-2ST-10R00J-G

    Abstract: Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI
    Text: Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s Discussion Millimeterwave MMIC's are becoming more common in commercial applications. Their small size and potentially lower cost has made them valuable in the growing market of millimeterwave systems. Their size and delicate nature


    Original     		PDF D35BV102KPX MSTF-2ST-10R00J-G Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI

    Sn60A

    Abstract: MIL-STD-883H MIL-STD-883H 2004.6 sodium silicate QQ-S-571 QQ-S-571, Class Sn 50 ultrasonic motion detector J-STD-002 MIL-F-14256 20 PIN LEADLESS CHIP CARRIER THICK FILM
    Text: MIL-STD-883H METHOD 2001.3 * CONSTANT ACCELERATION 1. PURPOSE. This test is used to determine the effects of constant acceleration on microelectronic devices. It is an accelerated test designed to indicate types of structural and mechanical weaknesses not necessarily detected in shock and


    Original     		PDF MIL-STD-883H Sn60A MIL-STD-883H MIL-STD-883H 2004.6 sodium silicate QQ-S-571 QQ-S-571, Class Sn 50 ultrasonic motion detector J-STD-002 MIL-F-14256 20 PIN LEADLESS CHIP CARRIER THICK FILM

    9lprs

    Abstract: 9lprs477 9lprs387 9lprs365 9LRS3165 9lprs325 9LPRS355 9LPR 9lprs914 9LPRS918
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0903-04 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: May 8, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: 9 mm x 9 mm VFQFPN-64 Product Mark 10 mm x 10 mm VFQFPN-72


    Original     		PDF A0903-04 VFQFPN-64 VFQFPN-72 you6138 9LPR309 9LPR311 9LPR323 9LPR325 9LPR332 9lprs 9lprs477 9lprs387 9lprs365 9LRS3165 9lprs325 9LPRS355 9LPR 9lprs914 9LPRS918

    NATIONAL SEMICONDUCTOR ink MARKING

    Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as


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    9LRS3199AKLFT

    Abstract: 9LvS3199aklft 9LRS3199 JESD22-B116 9lprs 9LRS3197 9LRS4116 vfqfpn-32 9LRS 9LvS3199
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 96138 PCN #: A0910-01 Product Affected: PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 6, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: VFQFPN-20, 32, 40, 48, 56 Product Mark


    Original     		PDF A0910-01 VFQFPN-20, Conta05AKLF 9LRS4205AKLFT 9LVRS392AKLF 9LVRS392AKLFT 9LVRS393AKLF 9LVRS393AKLFT 9LVRS393BKLF 9LVRS393BKLFT 9LRS3199AKLFT 9LvS3199aklft 9LRS3199 JESD22-B116 9lprs 9LRS3197 9LRS4116 vfqfpn-32 9LRS 9LvS3199

    ultrasonic probe ge

    Abstract: GaAs MMIC ESD, Die Attach and Bonding Guidelines GaAs FET chip ultrasonic bond AN-1001 Ultrasonic bubble kulicke Soffa nec microwave
    Text: California Eastern Laboratories AN-1001 APPLICATION NOTE RECOMMENDED HANDLING PROCEDURES FOR MICROWAVE TRANSISTOR AND MMIC CHIPS INTRODUCTION This document is provided to inform users of some of the handling precautions necessary and the assembly processes


    Original     		PDF AN-1001 ultrasonic probe ge GaAs MMIC ESD, Die Attach and Bonding Guidelines GaAs FET chip ultrasonic bond AN-1001 Ultrasonic bubble kulicke Soffa nec microwave

    schematic WELDER

    Abstract: gold melting furnace ultrasonic bond
    Text: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter­ natives in the selection of diodes and packaging with each


    OCR Scan     		PDF OT-23 schematic WELDER gold melting furnace ultrasonic bond

    ultrasonic bond

    Abstract: schematic WELDER Gunn Diode schematic WELDER capacitor M541 varactor beam lead thermal conductive teflon mesa similar
    Text: Application Note M an A M P com pany Bonding and Handling Procedures for Chip Diode Devices M541 V 2.00 Discussion Microstrip Packages and Chip Carriers Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last


    OCR Scan     		PDF