Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    WCSP PACKAGE RELIABILITY Search Results

    WCSP PACKAGE RELIABILITY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    WCSP PACKAGE RELIABILITY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    WLCSP stencil design

    Abstract: ja 16201 WLCSP smt Texas SBVA017 wcsp wcsp reliability A104B IPC-7525 JESD22 S2062
    Text: Application Report SBVA017 - February 2004 NanoStart & NanoFreet 300mm Solder Bump Wafer Chip-Scale Package Application Jim Rosson High Performance Analog—MAKE Packaging ABSTRACT The NanoStartWafer Chip-Scale Package WCSP is a family of bare die packages


    Original     		PDF SBVA017 300mm MO-211 WLCSP stencil design ja 16201 WLCSP smt Texas wcsp wcsp reliability A104B IPC-7525 JESD22 S2062

    Untitled

    Abstract: No abstract text available
    Text: TMP106 Chip-Scale Package SLLS672A − OCTOBER 2005 − REVISED JANUARY 2006 Digital Temperature Sensor with Two-Wire Interface FEATURES DESCRIPTION D D D D The TMP106 is a two-wire, serial output temperature sensor available in a WCSP package. Requiring no


    Original     		PDF TMP106 SLLS672A TMP106 12-Bits,

    S1C17564

    Abstract: WCSP-48 TQFP13-64pin
    Text: S1C17554/564 16-bit Single Chip Microcontroller ●48-pin wafer-chip-scale package WCSP ●10-bit A/D converter ●Code-efficient architecture optimized for the C language, single-cycle instruction high processing performance, serial ICE, and built-in 16-bit


    Original     		PDF S1C17554/564 16-bit 48-pin 10-bit 16-bit S1C17 S1C17554/564 S1C17564 WCSP-48 TQFP13-64pin

    rdl 117

    Abstract: SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability
    Text: Application Report SBVA016 – September 2003 NanoStar Wafer Chip-Scale Package Design Ray Crampton, Jim Rosson High-Performance Analog Products ABSTRACT To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale WCSP package, Texas Instruments has introduced the 170µm NanoStar™ YEQ


    Original     		PDF SBVA016 MO-211 rdl 117 SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability

    Untitled

    Abstract: No abstract text available
    Text: S1C17554/564 16-bit Single Chip Microcontroller ●48-pin wafer-chip-scale package WCSP ●10-bit A/D converter ●Code-efficient architecture optimized for the C language, single-cycle instruction high processing performance, serial ICE, and built-in 16-bit


    Original     		PDF S1C17554/564 16-bit 48-pin 10-bit 16-bit S1C17 S1C17554/564

    d1m11

    Abstract: RX2 1110
    Text: TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Low-Power, Digital Temperature Sensor with SMAART Wire Interface Check for Samples: TMP104 FEATURES DESCRIPTION • The TMP104 is a digital output temperature sensor in a four-ball wafer chip-scale package WCSP . The


    Original     		PDF TMP104 SBOS564A TMP104 d1m11 RX2 1110

    PicoGate

    Abstract: No abstract text available
    Text: MicroPak Logic 65% smaller Drop-in replacements for PicoGate New package format dramatically reduces the size of PicoGate Logic while maintaining industry-standard 0.5 mm pad pitch and provides more rugged, more reliable performance than WCSP packages. The same die is used as


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Low-Power, Digital Temperature Sensor with SMAART Wire Interface Check for Samples: TMP104 FEATURES DESCRIPTION • The TMP104 is a digital output temperature sensor in a four-ball wafer chip-scale package WCSP . The


    Original     		PDF TMP104 SBOS564A TMP104

    Untitled

    Abstract: No abstract text available
    Text: TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Low-Power, Digital Temperature Sensor with SMAART Wire Interface Check for Samples: TMP104 FEATURES DESCRIPTION • The TMP104 is a digital output temperature sensor in a four-ball wafer chip-scale package WCSP . The


    Original     		PDF TMP104 SBOS564A TMP104

    Untitled

    Abstract: No abstract text available
    Text: LY8010 2.5 W Mono Filterless Class D Audio power Amplifier WCSP Preliminary. 1.0 REVISION HISTORY Revision Rev. 0.1 Rev. 0.11 Rev. 0.12 Rev. 0.13 Rev. 0.14 Rev. 0.15 Rev. 1.0 Description Initial Issue Modify product name rule Modify package type U to C


    Original     		PDF LY8010 LY8010

    Untitled

    Abstract: No abstract text available
    Text: TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Low-Power, Digital Temperature Sensor with SMAART Wire Interface Check for Samples: TMP104 FEATURES DESCRIPTION • The TMP104 is a digital output temperature sensor in a four-ball wafer chip-scale package WCSP . The


    Original     		PDF TMP104 SBOS564A TMP104

    S1F77330B0A

    Abstract: code D1y
    Text: S1F77330B0A Power Bus Switch IC 2 to 1 Bus Switch „ OVERVIEW The S1F77330 series is the bus switch suitable for USB applications. The adopted CMOS process technology characterizes the S1F77330 series by low power consumption. The compact WCSP adopted for the package enables the S1F77330 series


    Original     		PDF S1F77330B0A S1F77330 S1F77330B0A code D1y

    RX2 1110

    Abstract: No abstract text available
    Text: TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Low-Power, Digital Temperature Sensor with SMAART Wire Interface Check for Samples: TMP104 FEATURES DESCRIPTION • The TMP104 is a digital output temperature sensor in a four-ball wafer chip-scale package WCSP . The


    Original     		PDF TMP104 SBOS564A TMP104 RX2 1110

    KSLI-252012AG

    Abstract: No abstract text available
    Text: TPS62700 www.ti.com SLVS784 – DECEMBER 2007 2 MHz 650 mA Step Down Converter for RF Power Amplifiers in Tiny 8-pin WCSP Package FEATURES 1 • • • • • • • • • • • DESCRIPTION High-Efficiency Step-Down Converter Output Current up to 650 mA


    Original     		PDF TPS62700 SLVS784 TPS62700 KSLI-252012AG

    GRM188R60J106M

    Abstract: GRM188R60J475K JESD51-7 MIPSA2520 TPS62700 TPS62700YZF VLF3014AT
    Text: TPS62700 www.ti.com SLVS784A – DECEMBER 2007 – REVISED MARCH 2008 2 MHz 650 mA Step Down Converter for RF Power Amplifiers in Tiny 8-pin WCSP Package FEATURES 1 • • • • • • • • • • • DESCRIPTION High-Efficiency Step-Down Converter


    Original     		PDF TPS62700 SLVS784A TPS62700 GRM188R60J106M GRM188R60J475K JESD51-7 MIPSA2520 TPS62700YZF VLF3014AT

    GRM188R60J106M

    Abstract: GRM188R60J475K JESD51-7 MIPSA2520 TPS62700 TPS62700YZF VLF3014AT LQM2HPN
    Text: TPS62700 www.ti.com SLVS784A – DECEMBER 2007 – REVISED MARCH 2008 2 MHz 650 mA Step Down Converter for RF Power Amplifiers in Tiny 8-pin WCSP Package FEATURES 1 • • • • • • • • • • • DESCRIPTION High-Efficiency Step-Down Converter


    Original     		PDF TPS62700 SLVS784A TPS62700 GRM188R60J106M GRM188R60J475K JESD51-7 MIPSA2520 TPS62700YZF VLF3014AT LQM2HPN

    Untitled

    Abstract: No abstract text available
    Text: LY8210 Preliminary. 1.0 2.5 W/CH Stereo Class D Audio power Amplifier WCSP/ TSSOP REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 1.0 Description Initial Issue Add Application Circuit Release datasheet and add TSSOP20 package Lyontek Inc. reserves the rights to change the specifications and products without notice.


    Original     		PDF LY8210 TSSOP20

    PCB design for very fine pitch csp package

    Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
    Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers


    Original     		PDF

    oki qfp tray

    Abstract: 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone
    Text: Oki’s Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market’s Requirement for a New Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s design engineers < •


    Original     		PDF 30min 30min 1000H 100cyc 300cyc 500cyc ED-4701 oki qfp tray 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone

    W-CSP footprint

    Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
    Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LY8210 Preliminary. 1.4 2.5 W/CH Stereo Class D Audio power Amplifier WCSP/ TSSOP FEATURES GENERAL DESCRIPTION „ 2.5 W/CH Into 4Ω from 5V power supply at THD = 10% (Typ.). „ 2.5V~5.5V Power supply. „ Low shutdown Current. „ Low Quiescent Current.


    Original     		PDF LY8210 LY8210

    Untitled

    Abstract: No abstract text available
    Text: LY8010 Preliminary. 1.4 2.5 W Mono Filterless Class D Audio power Amplifier WCSP / DFN FEATURES GENERAL DESCRIPTION „ 2.5 W Into 4Ω from 5V power supply at THD = 10% (Typ). „ 2.5V~5.5V Power supply. „ Low shutdown Current. „ Low Quiescent Current.


    Original     		PDF LY8010 LY8010 eli010

    SN74LVC1G157

    Abstract: SN74LVC1g P13A125 ti little logic land pattern for vsop 40 pins SN74LVC2G342 LVC2T45 NC7SZ112 1g125 high speed land pattern for vsop 60 pins
    Text: R E L I A B L E. L O G I C. TM I N N O V A T I O N. LITTLE LOGIC SELECTION GUIDE CBT DBV AHCT DCK CBTD CBTLV DBV DBV DCK DCK AHC DBV DCK DBV AUC DBV 5 LVC DBV(6) DCK(5) DCT DCK DBV(5) DCT DCK(5) YEP DCK(6) DCU DBV(6) YEP YZP DCK(6) DCU YZP AUP DBV(5) DBV(6)


    Original     		PDF A111103 SCYT129A SN74LVC1G157 SN74LVC1g P13A125 ti little logic land pattern for vsop 40 pins SN74LVC2G342 LVC2T45 NC7SZ112 1g125 high speed land pattern for vsop 60 pins

    SN74LVC1g

    Abstract: Fairchild 1G125 SMD 5PIN LOGIC GATE 7404 ttl inverter 7404 not gate 1g125 sn74auc2g74 Dual Analog Switches p174stx1G SMD SINGLE GATE
    Text: R E L I A B E. L L O G I C. I N N O V A T I O N. LITTLE LOGIC SELECTION GUIDE CBT DBV AHCT DCK CBTD CBTLV DBV DBV DCK DCK DBV AHC DBV DCK AUC DBV 5 LVC DBV(6) DCK(5) DCT DCK DBV(5) DCT DCK(5) YEA DCK(6) DCU YZA DBV(6) YEA DCK(6) DCU YZA (actual size of chip)


    Original     		PDF A070802 SCYT129 SN74LVC1g Fairchild 1G125 SMD 5PIN LOGIC GATE 7404 ttl inverter 7404 not gate 1g125 sn74auc2g74 Dual Analog Switches p174stx1G SMD SINGLE GATE