EPIC-1S
Abstract: WAFER SN74ACT245 wafer fab control plan
Text: TEXAS INSTRUMENTS Initial Notification for the Planned 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab December 8, 1998 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB plans to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication technology. The product
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150mm
125mm
SN74ACT245
60sec
EPIC-1S
WAFER
wafer fab control plan
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Precon
Abstract: 857916 ACT245 EN-4088Z SN74ACT245N EPIC-1S
Text: TEXAS INSTRUMENTS Final Notification for the 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab February 19, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB has completed the qualification to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication
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150mm
125mm
DiH20Rn
260deg
Precon
857916
ACT245
EN-4088Z
SN74ACT245N
EPIC-1S
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508 531 02 48
Abstract: SN74ABT2245
Text: TEXAS INSTRUMENTS Final Notification for the 200mm Diameter Wafer Qualification of the Freising, Germany Wafer Fab June 27, 1997 Abstract As previously notified in May by PCN 5300, the Texas Instruments Wafer Fabrication Facility in Freising, Germany FFAB has qualified the convertion of the wafer diameter from 150mm to 200mm
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200mm
150mm
200mm
150mm,
508 531 02 48
SN74ABT2245
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SN74LS04N
Abstract: TL04ACN MC3403N SN74F04N UA9636ACP OI Bipolar Logic Qualification
Text: TEXAS INSTRUMENTS Initial Notification of Mitsubishi Silicon of America MSA Second Source Wafer Qualification for Starting 125mm Substrates in Sherman, Texas Wafer Fab February 5, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) plans to qualify
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125mm
SN74LS04N
TL04ACN
MC3403N
SN74F04N
UA9636ACP
OI Bipolar Logic
Qualification
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UN-D1400
Abstract: WLCSP stencil design AN10439 EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
Text: AN10439 Wafer Level Chip Size Package Rev. 03 — 17 October 2007 Application note Document information Info Content Keywords wafer, level, chip-scale, chip-size, package, WLCSP Abstract This application note provides guidelines for the use of Wafer Level Chip
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AN10439
AN10365
AN10439
UN-D1400
WLCSP stencil design
EIA541
IEC60286
WLCSP chip mount
Service Manual smd rework station
Wafer Level Chip Size Package
und14
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74LS04D
Abstract: mitsubishi lot code HBM 00-01 74ls04d datasheet TI Ji Bipolar LINEAR TECHNOLOGY date code JI Bipolar 500 mold compound JI Linear Bipolar Products TL 170C
Text: TEXAS INSTRUMENTS Final Notification of Mitsubishi Silicon of America MSA Second Source Wafer Qualification for Starting 125mm Substrates in Sherman, Texas Wafer Fab July 22, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) has qualified Mitsubishi
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125mm
85C85
260deg
74LS04D
mitsubishi lot code
HBM 00-01
74ls04d datasheet
TI Ji Bipolar
LINEAR TECHNOLOGY date code
JI Bipolar
500 mold compound
JI Linear Bipolar Products
TL 170C
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SN74ACT16245DL
Abstract: act16245 texas cmos SN74ACT16245D EN-4088Z SN74HC00N SN74HC42D TEXAS INSTRUMENTS, Mold Compound TS-095 cmos testing abstract
Text: TEXAS INSTRUMENTS Notification of Wafer Thickness Reduction from 15 and 13 Mils to 11 Mils December 5, 1996 Abstract Texas Instruments Advanced System Logic is reducing wafer thickness from 15 and 13 mils to 11 mils for all CMOS and BiCMOS technologies in all Wafer Fabrication Sites producing these
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HC00N
ACT16245DL
ABT245ADB
SN74ACT16245DL
act16245
texas cmos
SN74ACT16245D
EN-4088Z
SN74HC00N
SN74HC42D
TEXAS INSTRUMENTS, Mold Compound
TS-095
cmos testing abstract
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IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6012
IPC-D-279
IPC-6013
IPC-6016
IPC-2223
ipc 7094
IPC-7094
IPC-2226
IPC-6011
IPC-7525
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Nihon handa rx303-92skho
Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale
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VMMK-1225
VMMK-125
AV02-1078EN
Nihon handa rx303-92skho
RX303-92SKHO
0402 land pattern
INCOMING INSPECTION solder paste
recommended land pattern for 0402 cap
WLCSP stencil design
land pattern for WLCSP
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CARSEM
Abstract: 225E-01 0.5um ICC03290 MP8000C 84-1-lmis-r4 tsmc cmos model tsmc Activation Energy HRS100
Text: Reliability Engineering Tucson Corporation Analytical Services Qualification Description: Qualify new model. Model: RA: PA: Date: Die Name: Die Size: Mask Revision: Wafer Fab Site: Process: Technology: Metal 1: Metal 2: Metal 3: Passivation: HTOL assem/wafer/lot :
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TMP121AIDBV
ICC03290
CARSEM
225E-01
0.5um
ICC03290
MP8000C
84-1-lmis-r4
tsmc cmos model
tsmc Activation Energy
HRS100
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Ablebond 84-1*SR4
Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Text: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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PI6CV857A
Ablebond 84-1*SR4
z9925
EIAJ ED-4701
MARK A48
857L
TSMC 0.35um
Volt, SPDM, CMOS
98068A
0.6 um cmos process
ablebond 84-1lmisr4
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Untitled
Abstract: No abstract text available
Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE
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AN-617
AN03272-0-5/12
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TL062p
Abstract: TL084IDR TL084ACDR TL082BCDR TL082BCP TL084ACD TL082ACP TL082BCD TL084IN TL084BCD
Text: TEXAS INSTRUMENTS Notification of the Excalibur-1 Process in SFAB October 7, 1997 Abstract Texas Instruments Standard Linear and Logic has completed qualification for wafer sourcing of Excalibur-1 Process in the Sherman Wafer Fabrication site SFAB in Sherman, Texas. Reference
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TL072IP3
TL074ACJ
TL074BCDR
TL074IDR10
TL081ACDR
TL081BCDR
TL081CDR10
TL081ID
TL082ACD
TL082ACP
TL062p
TL084IDR
TL084ACDR
TL082BCDR
TL082BCP
TL084ACD
TL082ACP
TL082BCD
TL084IN
TL084BCD
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201676B
Abstract: No abstract text available
Text: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied
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201676B
201676B
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SAC1205
Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
Text: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)
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AN3846
SAC1205
IPC-A-600G
IPC-6012
WLCSP stencil design
JESD-B111
AN3846
sac105
IPC 6012
WLCSP smt
IPC-6016
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sn1035
Abstract: TL062P TL082BCDR TL084IN TL082ACP TL082BCD TL082BCP TL084BCD TL084ACDR SN103658DR
Text: TEXAS INSTRUMENTS Notification of the Excalibur-1 Process in SFAB June 3, 1997 Abstract Texas Instruments Standard Linear and Logic has qualified wafer sourcing of Excalibur-1 Process in the Sherman Wafer Fabrication site SFAB in Sherman, Texas. At present, these wafers are fabricated
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TL072BCD
TL072IDR
TL072IP3
TL074ACJ
TL074BCDR
TL074IDR10
TL081ACDR
TL081BCDR
TL081CDR10
TL081ID
sn1035
TL062P
TL082BCDR
TL084IN
TL082ACP
TL082BCD
TL082BCP
TL084BCD
TL084ACDR
SN103658DR
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EPIC-1ZS
Abstract: texas cmos databook ir 4310 50C24 CBT16211DL EN-4088Z SN74CBT16211DL texas cmos 50C24.1 texas instrument
Text: TEXAS INSTRUMENTS Notification for the Addition of EPIC-1ZS CMOS Process to the Lubbock Wafer Fabrication Site April 17, 1998 Abstract Texas Instrument’s Lubbock Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the EPIC-1ZS CMOS
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50C24
EPIC-1ZS
texas cmos databook
ir 4310
CBT16211DL
EN-4088Z
SN74CBT16211DL
texas cmos
50C24.1
texas instrument
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SN75ALS172DW
Abstract: SG3524N SN75ALS172N sn75als174dw TL092CP SN75ALS174DWR TL494CN TL1555P TL1555 285K
Text: TEXAS INSTRUMENTS Informational Notification of Offload of Product to SFAB from HIJI June 30, 1999 Abstract Texas Instruments Standard Linear and Logic is continuing to move the manufacture of several device types to the Sherman Wafer Fabrication site SFAB in Sherman, Texas from the HIJI Wafer
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33PWR
TLV2361CDBV
TLV2361CDBVR
TLV2361IDBV
TLV2361IDBVR
TLV2362ID
SN75ALS172DW
SG3524N
SN75ALS172N
sn75als174dw
TL092CP
SN75ALS174DWR
TL494CN
TL1555P
TL1555
285K
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TSMC 0.35um
Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Text: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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rdl 117
Abstract: SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability
Text: Application Report SBVA016 – September 2003 NanoStar Wafer Chip-Scale Package Design Ray Crampton, Jim Rosson High-Performance Analog Products ABSTRACT To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale WCSP package, Texas Instruments has introduced the 170µm NanoStar™ YEQ
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SBVA016
MO-211
rdl 117
SENJU SOLDER PASTE
rdl 117-a
wcsp reliability
IPC9701
MO-211
solder paste senju snpb
wcsp package reliability
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ASL3C
Abstract: ALVCH16245 151x24
Text: TEXAS INSTRUMENTS Initial Notification for the ASL3C Process with Retrograde Well to the Freising, Germany Wafer Fabrication Site November 19, 1998 Abstract Texas Instrument’s Friesing, Germany Wafer Fabrication Facility is qualifying the ALS3C process with retrograde well. This process change will affect all products in the ALVCH product family.
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100ical
PCN5349
ASL3C
ALVCH16245
151x24
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TL783CKC
Abstract: QTS06450
Text: TEXAS INSTRUMENTS Final Notification for the Addition of BIDFET Process to the Sherman Wafer Fabrication Site and Die Revision for TL783CIN July 27, 1998 Abstract Texas Instrument’s Sherman Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the BIDFET process. The
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TL783CIN
TL783CIN
QTS06450
TL783CKC
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EPIC-1S
Abstract: 74ACT245 EN-4088Z SN74ACT245N EN4088Z
Text: TEXAS INSTRUMENTS Notification for the Addition of CMOS Process to the Sherman Wafer Fabrication Site November 26, 1996 Abstract Texas Instrument’s Sherman Wafer Fabrication Facility has qualified the EPIC-1S CMOS process. The HC, AC, ACT, LV, AHCT and AHC product families are produced from this process and may be
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EN-4088Z
ACT245N
EPIC-1S
74ACT245
EN-4088Z
SN74ACT245N
EN4088Z
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4780
Abstract: CDSOD323 material declaration
Text: MATERIAL DECLARATION SHEET Material Number CDSOD323 Series Product Line Diode Products Compliance Date 1 Jan 2006 RoHS Compliant Yes No. Construction Element subpart MSL Homogeneous Material 1 Material weight [g] 1 Lead Frame Lead Frame 2 Die Silicon Wafer
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CDSOD323
18-march
4780
material declaration
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