photolithography
Abstract: No abstract text available
Text: Wafer Fab Capability Wafer Loading: Automated wafer loading throughout the Fab prevents handling-induced mechanical damage. Ion Implant: State-of-the-art high current implanter capable of the full range of dose requirements. Wafer Cleaning: Semi-automated wafer
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AMS130-2
150mm
ISO9000
QS9000
photolithography
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AM29
Abstract: 29f800bb AMD xp
Text: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray
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60Co
Abstract: No abstract text available
Text: Intersil White Paper Specialty Products Space and Defense Wafer by Wafer Low Dose Rate Acceptance Testing in a Production Environment Abstract—This White Paper describes technical details of a wafer by wafer low dose rate acceptance testing program being implemented for all Intersil radiation hardened products. We
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G85-0703
Abstract: g85 wafer G81-0703 G85 wafer format XML G85 TN-00-21 wafer map format G81 wafer format substrate 123456705F2
Text: TN-00-21: SEMI-Defined Wafer Map Format Introduction Technical Note SEMI -Defined Wafer Map Format Introduction Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International SEMI® . Using a mapping format defined by a worldwide
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TN-00-21:
G81-0703
G85-0703
09005aef81d8ff80/Source:
09005aef81d8ff52
TN0021
g85 wafer
G85 wafer format
XML G85
TN-00-21
wafer map format
G81 wafer format
substrate
123456705F2
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Cascade Microtech
Abstract: No abstract text available
Text: High-stable HF wafer contact ideal for automated wafer testing Z Probe High-Frequency Wafer Probe GS/SG 10 GHz A Ground-Signal (GS) coniguration is the most cost-effective RF design as less wafer space is taken up with contact pads. Cascade Microtech’s |Z| Probe in a GS/SG coniguration enables wafer-level testing with the highest accuracy and throughput available while
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ZProbe10-ss-0310
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eproms eraser
Abstract: eraser eprom UV eraser 15W-sec eprom eraser
Text: EPROM eraser - Wafer cleaner Page 1 of 3 CHIPhERASER EPROM Erasers and Wafer Cleaners JELIGHT CO.INC.established in 1978, is a recognized producer of quality ultraviolet light sources and relat equipment. The expertise gained throughout the years has assisted us in designing UV wafer and EPROM
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Untitled
Abstract: No abstract text available
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.
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EE-SPY801/802
EE-SPY801
EE-SPY802
X064-E1-02
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two leg infrared receiver led
Abstract: EE9-C01 IT16 power window construction details ethylene gas sensor
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 CSM_EE-SPY801_802_DS_E_3_1 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. • The contact surface with the wafer carrier uses a special chemicalresistant fluororesin.
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EE-SPY801/802
EE-SPY801
two leg infrared receiver led
EE9-C01
IT16
power window construction details
ethylene gas sensor
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IC weight sensor
Abstract: chloride ups circuit diagram relay 24v omron two leg infrared receiver led 12V ENERGY LIGHT CIRCUIT DIAGRAM EE-SPX303 hydrocarbon sensor hydrogen gas sensor omron plc Pulsating photoelectric Optical Sensor datasheet
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.
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EE-SPY801/802
EE-SPY801
IC weight sensor
chloride ups circuit diagram
relay 24v omron
two leg infrared receiver led
12V ENERGY LIGHT CIRCUIT DIAGRAM
EE-SPX303
hydrocarbon sensor
hydrogen gas sensor
omron plc
Pulsating photoelectric Optical Sensor datasheet
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UN-D1400
Abstract: WLCSP stencil design AN10439 EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
Text: AN10439 Wafer Level Chip Size Package Rev. 03 — 17 October 2007 Application note Document information Info Content Keywords wafer, level, chip-scale, chip-size, package, WLCSP Abstract This application note provides guidelines for the use of Wafer Level Chip
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AN10439
AN10365
AN10439
UN-D1400
WLCSP stencil design
EIA541
IEC60286
WLCSP chip mount
Service Manual smd rework station
Wafer Level Chip Size Package
und14
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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amkor flip
Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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CSPNL
Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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SN74ACT16245DL
Abstract: act16245 texas cmos SN74ACT16245D EN-4088Z SN74HC00N SN74HC42D TEXAS INSTRUMENTS, Mold Compound TS-095 cmos testing abstract
Text: TEXAS INSTRUMENTS Notification of Wafer Thickness Reduction from 15 and 13 Mils to 11 Mils December 5, 1996 Abstract Texas Instruments Advanced System Logic is reducing wafer thickness from 15 and 13 mils to 11 mils for all CMOS and BiCMOS technologies in all Wafer Fabrication Sites producing these
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HC00N
ACT16245DL
ABT245ADB
SN74ACT16245DL
act16245
texas cmos
SN74ACT16245D
EN-4088Z
SN74HC00N
SN74HC42D
TEXAS INSTRUMENTS, Mold Compound
TS-095
cmos testing abstract
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IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6012
IPC-D-279
IPC-6013
IPC-6016
IPC-2223
ipc 7094
IPC-7094
IPC-2226
IPC-6011
IPC-7525
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asl1000
Abstract: INCOMING MATERIAL INSPECTION wafer incoming outgoing inspection INSPECTION
Text: QC WAFER FAB Supplier: Location: Quality System: BCD Semiconductor Manufacturing Limited Shanghai, China ISO9001:2000 Starting Material/Process Materials Incoming Material Inspection Fail Return to Vendor/ Corrective Action Wafer Inspection/ Test Fail Disposition per
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asl1000
INCOMING MATERIAL INSPECTION
wafer incoming
outgoing inspection
INSPECTION
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Nihon handa rx303-92skho
Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale
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VMMK-1225
VMMK-125
AV02-1078EN
Nihon handa rx303-92skho
RX303-92SKHO
0402 land pattern
INCOMING INSPECTION solder paste
recommended land pattern for 0402 cap
WLCSP stencil design
land pattern for WLCSP
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wafer level package
Abstract: SN63 PB37 PROFILES with or without underfill IRF6100 desoldering
Text: AN-1011 Wafer Level Package Technology Board Mounting Application Note for 0.800mm pitch devices page Device construction 2 Design considerations 3 Assembly considerations 4 International Rectifier AN-1011 Wafer Level Package Technology Board Mounting Application Note
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AN-1011
800mm
wafer level package
SN63 PB37 PROFILES
with or without underfill
IRF6100
desoldering
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Untitled
Abstract: No abstract text available
Text: PA200DS-BR 200 mm Semi-automatic Probe System with Blue Ray DATA SHEET The PA200DS-BR was speciically designed for measurements requiring backside access to the wafer. The design allows you free access to both sides of the wafer, as well as high throughput due to a lightweight chuck design. The wafer itself can be ixed by vacuum or mechanically clamped to allow testing
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PA200DS-BR
PA200DS-BR
s-7482
PA200DSBR-DS-0911
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Untitled
Abstract: No abstract text available
Text: PRESS RELEASE CYPRESS RESTRUCTURES: SAN JOSE WAFER FACILITY TO BE R&D ONLY SAN JOSE, California. . .October 14, 1996. . .Cypress Semiconductor Corporation [NYSE: CY] today announced a restructuring of its San Jose wafer fabrication facility, including a workforce
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Plating Showerhead System for Improved Backside Wafer Plating
Abstract: No abstract text available
Text: Plating Showerhead System for Improved Backside Wafer Plating Jens Riege, Heather Knoedler, Shiban Tiku, Nercy Ebrahimi Skyworks Solutions, Inc. 2427 West Hillcrest Drive, Newbury Park, CA jens.riege@skyworksinc.com 805-480-4434 Keywords: Plating Showerhead, Boundary Layer Reduction, Through-Wafer Via
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Untitled
Abstract: No abstract text available
Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE
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AN-617
AN03272-0-5/12
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201676B
Abstract: No abstract text available
Text: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied
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201676B
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RLA120
Abstract: RLA80 8 resistor array 10k dip breadboard RLA Linear Array applications manual, Raytheon raytheon analog 24 pin dip MIL GRADE TRANSISTOR ARRAY raytheon transistor raytheon rla bipolar transistor tester RAYTHEON
Text: Sing!e ucpy RLA Linear Macrocell Array Semicustom Program Handle With Care Services Offered: • ■ ■ ■ ■ Photo mask layout Wafer fabrication Package assembly Testing — wafer and package Reliability screening — commercial and military ■ Technical aid
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24-lead
28-pad
28-pin
44-pad
44-pin
RLA120
RLA80
8 resistor array 10k dip breadboard
RLA Linear Array applications manual, Raytheon
raytheon analog 24 pin dip
MIL GRADE TRANSISTOR ARRAY
raytheon transistor
raytheon rla
bipolar transistor tester
RAYTHEON
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