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Abstract: No abstract text available
Text: Wafer and Die Infosheet Memory Products Features • Async SRAMs, Dual-Ports, FIFOs, MicroPower SRAMs, PROMs, and Sync SRAMs wafer and die • Wafer — Standard Wafer 25–30 mil thick — Background Wafer to 14 mil thick — Background Wafer to 11 mil thick
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CYXXXX
Abstract: No abstract text available
Text: Wafer and Die Infosheet Memory Products Features • Async SRAMs, Dual-Ports, FIFOs, MicroPower SRAMs, PROMs, and Sync SRAMs wafer and die • Wafer — Standard Wafer 25–30 mil thick — Background Wafer to 14 mil thick — Background Wafer to 11 mil thick
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Abstract: No abstract text available
Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 1 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick
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Untitled
Abstract: No abstract text available
Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 2 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick
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Precon
Abstract: 857916 ACT245 EN-4088Z SN74ACT245N EPIC-1S
Text: TEXAS INSTRUMENTS Final Notification for the 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab February 19, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB has completed the qualification to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication
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150mm
125mm
DiH20Rn
260deg
Precon
857916
ACT245
EN-4088Z
SN74ACT245N
EPIC-1S
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F37011
Abstract: No abstract text available
Text: TN0055 Technical note SRI4K die description Product information ● Product name: SRI4K ● Die code: P117ZMY Wafer and die features October 2007 Wafer diameter 8" Wafer thickness 180 µm Die technology F6SPs40s 3M 1P Diffusion Plant Chartered Die identification
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TN0055
P117ZMY
F6SPs40s
F37011
F37011
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SPANSION date code format
Abstract: AM29 T0003 Am29f 405 gde 8 905 959 252
Text: Chapter 8 Die and Wafer Shipments CHAPTER 8 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Storage Conditions for Die and Wafer Carrier Designs for Singulated Die Waffle Pack Surftape and Reel Carrier Designs for Wafers Wafer Jar
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AM29
Abstract: 29f800bb AMD xp
Text: u Chapter 11 Die and Wafer Shipments CHAPTER 11 DIE AND WAFER SHIPMENTS Introduction Product Carrier Guide for Die and Wafers Carrier Designs for Singulated Die Waffle Pack Surftape and Reel GEL-PAK Die Tray Carrier Designs for Wafers Wafer Jar GEL-PAK Wafer Tray
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SQTP
Abstract: HDCP EEPROM 24xx eeprom SQTP checksum microchip 25LC040A eeprom interface EAR99 DS21808 spi 25xx smart card serial source code for eeprom 24LC
Text: Wafer Programming Service Purchasing HDCP Compliant EEPROM Wafers Secure Wafer Programming Service For HDCP Device Keys www.microchip.com Supporting Your HDCP Requirements Secure Wafer Programming Environment After your company has made a significant investment
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DS22000B
DS22000B*
SQTP
HDCP EEPROM
24xx eeprom
SQTP checksum
microchip 25LC040A eeprom interface
EAR99
DS21808
spi 25xx
smart card serial
source code for eeprom 24LC
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Untitled
Abstract: No abstract text available
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.
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EE-SPY801/802
EE-SPY801
EE-SPY802
X064-E1-02
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two leg infrared receiver led
Abstract: EE9-C01 IT16 power window construction details ethylene gas sensor
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 CSM_EE-SPY801_802_DS_E_3_1 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. • The contact surface with the wafer carrier uses a special chemicalresistant fluororesin.
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EE-SPY801/802
EE-SPY801
two leg infrared receiver led
EE9-C01
IT16
power window construction details
ethylene gas sensor
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IC weight sensor
Abstract: chloride ups circuit diagram relay 24v omron two leg infrared receiver led 12V ENERGY LIGHT CIRCUIT DIAGRAM EE-SPX303 hydrocarbon sensor hydrogen gas sensor omron plc Pulsating photoelectric Optical Sensor datasheet
Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.
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EE-SPY801/802
EE-SPY801
IC weight sensor
chloride ups circuit diagram
relay 24v omron
two leg infrared receiver led
12V ENERGY LIGHT CIRCUIT DIAGRAM
EE-SPX303
hydrocarbon sensor
hydrogen gas sensor
omron plc
Pulsating photoelectric Optical Sensor datasheet
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74LS04D
Abstract: mitsubishi lot code HBM 00-01 74ls04d datasheet TI Ji Bipolar LINEAR TECHNOLOGY date code JI Bipolar 500 mold compound JI Linear Bipolar Products TL 170C
Text: TEXAS INSTRUMENTS Final Notification of Mitsubishi Silicon of America MSA Second Source Wafer Qualification for Starting 125mm Substrates in Sherman, Texas Wafer Fab July 22, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) has qualified Mitsubishi
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125mm
85C85
260deg
74LS04D
mitsubishi lot code
HBM 00-01
74ls04d datasheet
TI Ji Bipolar
LINEAR TECHNOLOGY date code
JI Bipolar
500 mold compound
JI Linear Bipolar Products
TL 170C
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G85-0703
Abstract: g85 wafer G81-0703 G85 wafer format XML G85 TN-00-21 wafer map format G81 wafer format substrate 123456705F2
Text: TN-00-21: SEMI-Defined Wafer Map Format Introduction Technical Note SEMI -Defined Wafer Map Format Introduction Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International SEMI® . Using a mapping format defined by a worldwide
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TN-00-21:
G81-0703
G85-0703
09005aef81d8ff80/Source:
09005aef81d8ff52
TN0021
g85 wafer
G85 wafer format
XML G85
TN-00-21
wafer map format
G81 wafer format
substrate
123456705F2
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SN74ACT16245DL
Abstract: act16245 texas cmos SN74ACT16245D EN-4088Z SN74HC00N SN74HC42D TEXAS INSTRUMENTS, Mold Compound TS-095 cmos testing abstract
Text: TEXAS INSTRUMENTS Notification of Wafer Thickness Reduction from 15 and 13 Mils to 11 Mils December 5, 1996 Abstract Texas Instruments Advanced System Logic is reducing wafer thickness from 15 and 13 mils to 11 mils for all CMOS and BiCMOS technologies in all Wafer Fabrication Sites producing these
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HC00N
ACT16245DL
ABT245ADB
SN74ACT16245DL
act16245
texas cmos
SN74ACT16245D
EN-4088Z
SN74HC00N
SN74HC42D
TEXAS INSTRUMENTS, Mold Compound
TS-095
cmos testing abstract
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E5-1101
Abstract: wafer prober AN115013 WM-40X0 SECS II wafer map format wafer map format wafer map 3d01
Text: AN115013 SECS II wafer map format Rev. 1.3 — 1 July 2009 Application note Document information Info Content Keywords wafer mapping, SECS II format, electronic inking Abstract This document gives a short guideline how to interpret wafer maps in SECS II format delivered with wafers by Business Line Identification.
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AN115013
E5-1101
wafer prober
AN115013
WM-40X0
SECS II wafer map format
wafer map format
wafer map
3d01
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Ablebond 84-1*SR4
Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Text: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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PI6CV857A
Ablebond 84-1*SR4
z9925
EIAJ ED-4701
MARK A48
857L
TSMC 0.35um
Volt, SPDM, CMOS
98068A
0.6 um cmos process
ablebond 84-1lmisr4
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General Wafer Specification
Abstract: IBIS wafer map format
Text: INTEGRATED CIRCUITS DATA SHEET ADDENDUM SL2 ICS11 I•CODE UID Smart Label IC Bumped Wafer Specification Product Specification Revision 3.0 2004 January 30 089030 Philips Semiconductors Product Specification Revision 3.0 2004 January 30 Bumped Wafer Specification
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ICS11
SCA74
General Wafer Specification
IBIS wafer map format
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ics-1023
Abstract: ICS10
Text: INTEGRATED CIRCUITS DATA SHEET ADDENDUM SL2 ICS10 I•CODE EPC Smart Label IC Bumped Wafer Specification Product Specification Revision 3.0 2004 January 30 080830 Philips Semiconductors Product Specification Revision 3.0 2004 January 30 Bumped Wafer Specification
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ICS10
SCA74
ics-1023
ICS10
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wafer level package
Abstract: SN63 PB37 PROFILES with or without underfill IRF6100 desoldering
Text: AN-1011 Wafer Level Package Technology Board Mounting Application Note for 0.800mm pitch devices page Device construction 2 Design considerations 3 Assembly considerations 4 International Rectifier AN-1011 Wafer Level Package Technology Board Mounting Application Note
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AN-1011
800mm
wafer level package
SN63 PB37 PROFILES
with or without underfill
IRF6100
desoldering
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MIFARE Card IC Coil Design Guide
Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Text: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01
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SCA74
MIFARE Card IC Coil Design Guide
MIFARE s70 chip
Philips MF1 IC S70
General Wafer Specification
MF1 IC S70
k 1356
12NC ordering code philips
MIFARE s70
philips application notes
philips 15601
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TSMC 0.35um
Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Text: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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MIFARE Card IC Coil Design Guide
Abstract: Philips MF1 IC S50 Mifare MF1 S50 Philips Mifare 1 S50 Philips Mifare 1 S50 specifications philips S50 MF1 S50 mifare s50 MIFARE card MF1 IC S50 S5005
Text: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Wafer Specification Revision 3.0 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Rev. 3.0 October 2002 Wafer Specification Standard Card IC MF1 IC S50 05 CONTENTS 1 SCOPE 3 2 REFERENCE DOCUMENTS
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SCA74
MIFARE Card IC Coil Design Guide
Philips MF1 IC S50
Mifare MF1 S50
Philips Mifare 1 S50
Philips Mifare 1 S50 specifications
philips S50
MF1 S50
mifare s50 MIFARE card
MF1 IC S50
S5005
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Untitled
Abstract: No abstract text available
Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE
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AN03272-0-5/12
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