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    VSP8 PACKAGE DIMENSION Search Results

    VSP8 PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    VSP8 PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    VSP8 Package

    Abstract: vSP8 Vsp8 Package dimension equivalent components of diode By 127
    Text: PACKAGE DIMENSIONS VSP8 +0.3 2.9 -0.1 ~ 10º 1 0.55 ±0.2 4.0±0.3 5 2.8±0.2 8 4 +0.1 0.127 -0.05 0.65 +0.1 0.1 - 0.05 1.1±0.1 0.6MAX 0.1 0.2±0.1 0.1 M UNIT : mm


    Original     		PDF

    ET-7101

    Abstract: SSOP10 SSOP14 SSOP20
    Text: TAPING DIMENSIONS 2. TAPING DIMENSIONS There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with


    Original     		PDF ET-7101 C-0806 10pin 14pin 20pin 20pin ET-7101 SSOP10 SSOP14 SSOP20

    4558D

    Abstract: 4556 op-amp IC 4558 surround sound circuit REGULATOR IC l7812cv TDA2822M SMD TYPE circuit inter CV 203 NE555N IC AUDIO FILTER NJM2060 "cross reference" IC L7912CV MC34063P1
    Text: NJR CORPORATION Product Reference Overview SEMICONDUCTORS LINEAR RF & WIRELESS PACKAGING 27 PART NUMBER SYSTEMS 33 CROSS REFERENCE 35 AUDIO ICs 8 COMMUNICATION ICs 9 VIDEO ICs 10 CMOS SWITCH 11 MCU & PERIPHERAL 13 LCD DRIVER 15 LSI/OTHER 16 SPECIAL FUNCTIONS


    Original     		PDF O-220F O-220 O-252 4558D 4556 op-amp IC 4558 surround sound circuit REGULATOR IC l7812cv TDA2822M SMD TYPE circuit inter CV 203 NE555N IC AUDIO FILTER NJM2060 "cross reference" IC L7912CV MC34063P1

    PACKAGE DIMENSIONS

    Abstract: SSOP10 SSOP14 SSOP20
    Text: PACKAGE DIMENSIONS 3. PACKAGE DIMENSIONS SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M UNIT :mm SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3 4.4±0.2 8 7


    Original     		PDF SSOP10 SSOP14 67MAX SSOP20 45MAX SSOP20-B2 FLP10-C1 PACKAGE DIMENSIONS SSOP10 SSOP14 SSOP20

    Untitled

    Abstract: No abstract text available
    Text: NJM8512 Precision, Dual, JFET Input Operational Amplifier • FEATURES ■GENERAL DESCRIPTION ●Low Input Offset Voltage ●Low Input Offset Voltage Drift ●Low Supply Current ●High Slew Rate ●Wide Bandwidth ●Low Noise ●Low Input Bias Current ●No Phase Reversal


    Original     		PDF NJM8512 10nV/ï NJM8512 74MAX

    NJU7084

    Abstract: NJU7084R NJU7084M
    Text: NJU7084 HIGH-POWER & LOW-VOLTAGE AUDIO POWER AMPLIFIER • GENERAL DESCRIPTION The NJU7084 is an audio power amplifier designed for telephone applications. No external coupling capacitors are required because of the differential outputs. The closed loop gain is adjusted by two external resistors,


    Original     		PDF NJU7084 NJU7084 NJU7084R NJU7084M DMP24 86MAX NJU7084R NJU7084M

    Untitled

    Abstract: No abstract text available
    Text: NJM8512 Precision, Dual, JFET Input Operational Amplifier • FEATURES ■GENERAL DESCRIPTION ●Low Input Offset Voltage ●Low Input Offset Voltage Drift ●Low Supply Current ●High Slew Rate ●Wide Bandwidth ●Low Noise ●Low Input Bias Current ●No Phase Reversal


    Original     		PDF NJM8512 10nV/ï NJM8512 74MAX

    Untitled

    Abstract: No abstract text available
    Text: NJM8512 Precision, Dual, JFET Input Operational Amplifier • FEATURES ■ PACKAGE OUTLINE ●Low Input Offset Voltage ●Low Input Offset Voltage Drift ●Low Supply Current ●High Slew Rate ●Wide Bandwidth ●Low Noise ●Low Input Bias Current ●No Phase Reversal


    Original     		PDF NJM8512 10nV/â NJM8512AR NJM8512BR MO-187-DA NJM8512

    NJM2903 equivalent

    Abstract: NJM2903R
    Text: AEC-Q100 ISO/TS16949 Automotive NJM2903 SINGLE-SUPPLY DUAL COMPARATOR • FEATURES ● Operating Temperature -40ºC ≤ Ta ≤ +125ºC ● Operating Voltage +2V~+36V ● Single Supply Operation ● Open Collector Output ● High Output Sink Current ● Package Outline


    Original     		PDF AEC-Q100 ISO/TS16949 NJM2903 NJM2903R NJM2903 equivalent NJM2903R

    SSOP14 package

    Abstract: 74a diode SSOP20 SSOP10 SSOP14 vSP8 Mtp6 SSOP020-P-0225 SC74A
    Text: PACKAGE OUTLINE TABLE / PACKAGE CODE TABLE 1. PACKAGE OUTLINE TABLE Suffix 6Pin 8Pin 10Pin 14Pin 20Pin SSOP V - - √ √ √ VSP R - √ - - - FLP K √ - √ - - MTP6 F √ - - - - MTP6-1 F √ - - - - SSOP VSP FLP6 MTP6 MTP6-1 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE


    Original     		PDF 10Pin 14Pin 20Pin SSOP10 SSOP010-P-0225 SSOP14 SSOP014-P-0225 SSOP20 SSOP020-P-0225 SSOP20-B2 SSOP14 package 74a diode SSOP20 SSOP10 SSOP14 vSP8 Mtp6 SC74A

    DIP18 package

    Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20


    Original     		PDF DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 DIP40 DIP18 package SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225

    QFP80

    Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32

    SOP18 EIAJ

    Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
    Text: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 SOP18 EIAJ QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ

    QFP80

    Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
    Text: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18


    Original     		PDF DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18 DIP20 DIP22 DIP22-D2 DIP24 DIP24-D2 QFP80 QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013

    EMP20-E2

    Abstract: QFP80 QFP64 package QFP80-C3 SSOP20
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF O-252 EMP20-E2 QFP80 QFP64 package QFP80-C3 SSOP20

    EMP24-E3

    Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF O-252 EMP24-E3 EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10

    SSOP14 pcb

    Abstract: dmp 30 package DMP8 pcb pattern QFP80 SOP32 data sheet SSOP10 Package QFP-100C EMP20-E2 QFP64 package QFP80-C3
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


    Original     		PDF BCC32 SSOP14 pcb dmp 30 package DMP8 pcb pattern QFP80 SOP32 data sheet SSOP10 Package QFP-100C EMP20-E2 QFP64 package QFP80-C3

    Untitled

    Abstract: No abstract text available
    Text: RECOMMENDED MOUNTING METHOD • RECOMMENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92


    OCR Scan     		PDF T0-220F DIP14 DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 SDIP22 SDIP24

    Untitled

    Abstract: No abstract text available
    Text: RECOMMENDED MOUNTING METHOD • RECONENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG REFLOW


    OCR Scan     		PDF T0-220F DIP14 DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 SDIP22 SDIP24

    SS0P24

    Abstract: SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1
    Text: csa RECOMMENDED MOUNTING METHOD A • RECONENDED MOUNTING METHOD 1.Solderins Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92


    OCR Scan     		PDF T0-220F DIP14 DIP16 DIP18 DIP20 DIP22 DIP28 DIP40 SDIP22 SDIP24 SS0P24 SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1

    SC74A

    Abstract: SSOP14 SSOP20 VSP8 Package SC-74A
    Text: PACKAGE OUTLINE TABLE I PACKAGE CODE TABLE 1. PACKAGE OUTLINE TABLE Suffix 6Pin 8Pin 10Pin 14Pin 20Pin SSOP V . _ O O VSP R . O _ _ . O* _ _ _ _ _ - - FLP K MTP6 F MTP6-1 F o o ' _ - - * : PRELIMINARY SSOP 2. PACKAGE CODE TABLE VSP NJRC vs . e ia j FLP6 MTP6


    OCR Scan     		PDF 10Pin 14Pin 20Pin SSOPOI0-P-0225 SSOP14 SSOP20 SSOP020-P-0225 SSOP20-B2 SC-74A SC74A VSP8 Package

    SSOP14 pcb

    Abstract: SSOP14 SSOP20 SSOP20-B2
    Text: RECOMMENDED SOLDER PADS Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into


    OCR Scan     		PDF SSOP14 SSOP20 SSOP20-B2 SSOP14 pcb

    QFP80-CI

    Abstract: 10B10T DIP40 NJU9702 SDIP22 SDIP24
    Text: g - 5= -£ o C •1 CC =c c -c ? > 6.4*“ K3 • oo 1 TI g TD > O * > O m s_ O £ í f j'. > V 6.41 s m z « o z <z> A PACKAGE DIMENSIONS DIP 16 Unît: î DIP 18 I 24.2 r^rnirnirnirriifnirnirnir^\ o a M 2 o ~ ir Unit mm 2-4- Nêu^apan RadioCo^HcL PACKAGE DIMENSIONS


    OCR Scan     		PDF 74MAX 03MAX NJU9702. DIP40 SDIP22 SDIP24 QFP80-CI QFP80-C2 QFPI00-CI QFP64-GI QFP80-CI 10B10T NJU9702

    FLH 211

    Abstract: IR 92 0151 MENS MENS package
    Text: •PACKAGE DIMENSIONS DIP8 Pi8 r~i r^ i h 3 «o O V K? \J LJ rzzzi a ’• r 0-15* Unit: m m DIP 14 r^ i U nit: m m N ew fa panfh cloi Co.,dil . 2-3 4 D I MENS I ONS DIP 16 19.0 O 0 —15* U nit: m m DIP 18 V I J 1 l^ J U 9 7.62 J I = Z L i\ 0 —15* U n it i


    OCR Scan     		PDF DIP20 DIP22 NJU9702. SDIP348020100 QFP64-G FLH 211 IR 92 0151 MENS MENS package