Sn63Pb37
Abstract: No abstract text available
Text: R276 Dispensable No-Clean Solderpaste for Leaded Alloys Product Description Physical Properties Data given for Sn63Pb37 87% metal, -325+500 mesh Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged
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Sn63Pb37
21Sep09
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Untitled
Abstract: No abstract text available
Text: Optically Clear Epoxy Encapsulating & Potting Compound 8321C Technical Data Sheet 8321C Description The 8321C Optically Clear Epoxy, Encapsulating and Potting Compound, is an electronic grade, optically clear epoxy. It cures at room temperature or by heat curing.
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8321C
8321C
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Untitled
Abstract: No abstract text available
Text: Black Epoxy Encapsulating & Potting Compound 832B Technical Data Sheet 832B Description The 832B Black Epoxy Encapsulating and Potting Compound is an electric grade epoxy. It is simple to mix and easy to use. This two parts black epoxy provides great insulation and protection value.
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kester Sn62Pb36Ag02
Abstract: Sn63pB37 temp profile
Text: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting
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Sn63Pb37
10rpm
21Sep09
kester Sn62Pb36Ag02
Sn63pB37 temp profile
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Untitled
Abstract: No abstract text available
Text: Easy Profile 256 No-Clean Solderpaste Product Description Physical Properties Data given for Sn63Pb37 90% metal, -325+500 mesh Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil
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Sn63Pb37
EP256
21Sep09
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Untitled
Abstract: No abstract text available
Text: SEMICONDUCTOR MATERIALS TSF-6522 No-Clean Tacky Soldering Flux Product Description Kester TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. Kester TSF-6522 can also be used in dot dispensing for BGA/PGA
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TSF-6522
TSF-6522
10rpm
13Jun07
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Untitled
Abstract: No abstract text available
Text: 3 Scotch-Weld Hot Melt Adhesive 3798 LM Technical Data August, 2006 Product Description 3M™ Scotch-Weld™ Hot Melt Adhesive 3798 LM is a heat applied, 100% solids, removable, thermoplastic adhesive. Features • Easily removes from most substrates. • Easy to use and fast.
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1-1W-10,
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Abstract: No abstract text available
Text: Thermally Conductive Epoxy Encapsulating & Potting Compound 832TC Technical Data Sheet 832TC Description The 832TC Thermally Conductive Epoxy, Encapsulating and Potting Compound, is an electric grade epoxy. It uses high purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This two
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832TC
832TC
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Untitled
Abstract: No abstract text available
Text: High Temperature Epoxy Encapsulating & Potting Compound 832HT Technical Data Sheet 832HT Description The 832HT High Temperature Epoxy Encapsulating and Potting Compound is an electronic grade epoxy designed for high temperature environments. It is also an ideal encapsulant for very chemically aggressive
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832HT
832HT
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Abstract: No abstract text available
Text: Translucent Epoxy Encapsulating & Potting Compound 832C Technical Data Sheet 832C Description The 832C Translucent Epoxy Encapsulating and Potting Compound is an electric grade epoxy. It is simple to mix and easy to use. This two parts clear epoxy provides great insulation and protection value.
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Kester 197
Abstract: No abstract text available
Text: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder
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Sn63Pb37,
10Sep04
Kester 197
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Untitled
Abstract: No abstract text available
Text: Flame Retardant Epoxy Encapsulating & Potting Compound 833FRB Technical Data Sheet 833FRB Encapsulating and Potting Epoxy Description The 833FRB Flame Retardant Epoxy Encapsulating and Potting Compound is a UL 94V-0 recognized electric grade epoxy in the QMFZ2 category. This two-part epoxy provides a black, self-extinguishing finish
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833FRB
833FRB
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Abstract: No abstract text available
Text: Super ShieldTM Nickel Conductive Coating 841 Technical Data Sheet 841-Liquid Description The 841 Super Shield Nickel Conductive Coating is a conductive acrylic paint designed to reduce electromagnetic or radio frequency interference EMI/RFI —an issue for all electronic devices. Long-term
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841-Liquid
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POLYOL
Abstract: No abstract text available
Text: 3 Scotch-Weld TM Urethane Adhesive DP605 NS Off-White • DP640 Brown Technical Data Product Description May, 2010 3M Scotch-Weld™ Urethane Adhesives DP605 NS Off-White and DP640 Brown are two-part, non-sag urethane adhesives. They feature tough, flexible bonds with
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DP605
DP640
225-3S-06
POLYOL
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ML-1 94V-0
Abstract: E-36952 TSE397C-333ML MIL-A-46106 str 6709 MIL-A-46146 str 6708 Mil-S-46163A semiconductors cross index semiconductors cross reference
Text: Why MG Chemicals? At MG Chemicals, we realize that our number one asset is you, our customer. ISO Quality Standards. Since 1955, M.G. Chemicals has provided the North American electronics industry with a full line of high performance chemicals and accessories. The M.G. Chemicals manufacturing facility operates
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835-P-20
8420-P
8701-10ML,
8702-10ML,
8703-10ML,
8704-10ML)
416-E
416-ES
416-K
416-RP
ML-1 94V-0
E-36952
TSE397C-333ML
MIL-A-46106
str 6709
MIL-A-46146
str 6708
Mil-S-46163A
semiconductors cross index
semiconductors cross reference
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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LGA 2011 Socket diagram
Abstract: senju laser solder wire transistors catalog HLQFP 176 Package drawing FeNi42 national marking code senju jet printer smd transistor code 314 Weibull SOP EIAJ TYPE II ED-7402-1 microfocus x-ray
Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.1.01 Mar 2011 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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propert8175-9600,
R50ZZ0003EJ0101
REJ11K0001-0900)
LGA 2011 Socket diagram
senju laser solder wire
transistors catalog
HLQFP 176 Package drawing
FeNi42
national marking code
senju jet printer
smd transistor code 314 Weibull
SOP EIAJ TYPE II ED-7402-1
microfocus x-ray
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SMD 8PIN IC MARKING CODE 251
Abstract: No abstract text available
Text: User’s Manual Renesas Semiconductor Package Mount Manual www.renesas.com Rev.2.00 Mar 2012 Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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R50ZZ0003EJ0200
REJ11K0001-0900)
SMD 8PIN IC MARKING CODE 251
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