land pattern for TSSOP56
Abstract: TSSOP56 package TSSOP56
Text: 56-Pin Thin Shrink Small Outline Package TSSOP56 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max A 0.1 ±0.05 1.0 ±0.05
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56-Pin
TSSOP56
TSSOP56
land pattern for TSSOP56
TSSOP56 package
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TSSOP56 package
Abstract: TSSOP56
Text: 56-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP56 Package Tape Dimensions 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 Unit: mm Y’ Y’ 8.6 ±0.1 X 1.65 ±0.1
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56-Pin
TSSOP56
TSSOP56
TSSOP56 package
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TSSOP56
Abstract: RE933-10
Text: TSSOP56 Adapter thin shrink small outline package RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm
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TSSOP56
RE933-10
RE933-10
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Untitled
Abstract: No abstract text available
Text: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A
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TSSOP56:
OT481-2
MO-194
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Untitled
Abstract: No abstract text available
Text: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 28 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT
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TSSOP56:
OT364-1
MO-153
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TSSOP56
Abstract: TSSOP-56
Text: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max
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56pin
TSSOP56
TSSOP56
TSSOP-56
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sot364
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
OT364-1
MO-153EE
sot364
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TSSOP56
Abstract: No abstract text available
Text: PDF: 2003 Mar 26 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
MO-153
TSSOP56
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SOT364-1
Abstract: TSSOP56
Text: PDF: 2003 Apr 11 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
MO-153
SOT364-1
TSSOP56
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TSSOP56
Abstract: TSSOP56 package TSSOP-56
Text: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0
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56pin
TSSOP56
TSSOP56
TSSOP56 package
TSSOP-56
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MO-194
Abstract: sot481
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; lead pitch 0.4 mm SOT481-1 E D A X c y HE v M A Z 29 56 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 28 bp e w M 2.5
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TSSOP56:
OT481-1
OT481-1
MO-194
sot481
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MO-194
Abstract: TSSOP56 sot481
Text: PDF: 2001 Nov 23 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L detail X 1 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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TSSOP56:
OT481-2
MO-194
MO-194
TSSOP56
sot481
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JEDEC MO-153
Abstract: TSSOP56
Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
MO-153
JEDEC MO-153
TSSOP56
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TSSOP56 footprint
Abstract: TSSOP56 package TSSOP56 bo 139
Text: DIMENSIONS REF. mm inch MIN. TYP. MAX. MIN. A TYP. 1.2 A1 0.05 A2 0.047 0.15 0.002 0.9 0.006 64-LEAD THIN SHRINK SMALL OUTLINE 0.035 b 0.17 0.27 0.0067 0.011 c 0.09 0.20 0.0035 0.0079 D 13.9 14.1 0.547 0.555 E 7.95 8.25 0.313 0.325 E1 6.0 6.2 0.236 0.244 e
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64-LEAD
TSSOP56
TSSOP56
575in)
098in)
TSSOP56 footprint
TSSOP56 package
bo 139
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Untitled
Abstract: No abstract text available
Text: PC F8 536 PC A8 536 NXP LCD driver PCA8536 and PCF8536 I2C/SPI LCD and PWM LED controller for industrial and automotive applications This advanced, highly integrated LCD controller drives up to eight backplanes, up to 44 segments, and up to 320 elements, and provides an on-chip, 6-channel PWM controller for LED illumination.
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PCA8536
PCF8536
PCA8536)
BC847
BC857
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DDR2 SSTL class
Abstract: SSTL_18 DDR1-400 DDR2 SDRAM with SSTL_18 interface TVSOP-48 SSTL-18 PCK2059 SSTV16857 DDR200 hp SSTU32866
Text: Memory interfaces Support logic for memory modules and other memory subsystems Portfolio overview PC100 to PC133 • AVC, ALVC, AVCM, and ALVCH series registered drivers • PCK2509 and PCK2510 series PLL clock buffers DDR200 to DDR266 • SSTV and SSTL series registered drivers
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PC100
PC133
PCK2509
PCK2510
DDR200
DDR266
DDR333
DDR400
PCKVF857
DDR2-400
DDR2 SSTL class
SSTL_18
DDR1-400
DDR2 SDRAM with SSTL_18 interface
TVSOP-48
SSTL-18
PCK2059
SSTV16857
hp SSTU32866
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Untitled
Abstract: No abstract text available
Text: NXP display demo with LCD driver PCF8576 & capacitive sensor PCA8885 Touch-sensitive segmented 4 x 40 display Developed through a partnership with Truly, this advanced display showcases the LCD driver PCF8576 and the capacitive sensor PCA8885. It can be used to drive a segmented
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PCF8576
PCA8885
PCF8576
PCA8885.
TSSOP56
TSSOP28
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74CBTLV16211
Abstract: 74CBTLV16211DGG JESD22-A114E TSSOP56
Text: 74CBTLV16211 24-bit bus switch Rev. 02 — 26 August 2009 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to
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74CBTLV16211
24-bit
74CBTLV16211
12-bit
74CBTLV16211DGG
JESD22-A114E
TSSOP56
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74CBTLV16211
Abstract: 74CBTLV16211DGG TSSOP56
Text: 74CBTLV16211 24-bit bus switch Rev. 03 — 12 January 2010 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to
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74CBTLV16211
24-bit
74CBTLV16211
12-bit
74CBTLV16211DGG
TSSOP56
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74CBTLV16211
Abstract: 74CBTLV16211DGG TSSOP56
Text: 74CBTLV16211 24-bit bus switch Rev. 4 — 16 August 2010 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to
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74CBTLV16211
24-bit
74CBTLV16211
12-bit
74CBTLV16211DGG
TSSOP56
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SC28L198
Abstract: SCC2691AC1A28 LCD 09151 CSOT109 PCA9552 PCK2002 PCF8591 APPLICATION pecl clock so8 PCA9550 PCA9553
Text: Interface Products Interface Products 67 I2C Logic Family Overview • Analog/Digital Converters It is frequency required to record analog information, such as temperature, pressure, battery level, signal strength, etc. The analog voltage information from the diode, pressure sensor,
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ULx2003
Abstract: ULN2066 ST232B L604 STOTG04E ULN 232 RS-423 ST202EB ST202EC ST207EB
Text: Interface ICs Selection guide October 2009 www.st.com/interface Interface standards Interface ICs are a collection of standard functional blocks that provide a means to connect logic level signals to the various voltages and current requirements of transmission lines and buses. With this in mind a variety of Recommended
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RS-232
RS-422
SO-16,
SO-16L
TSSOP38,
TSSOP48,
TSSOP56
DIP-14
SO-18,
SO-20,
ULx2003
ULN2066
ST232B
L604
STOTG04E
ULN 232
RS-423
ST202EB
ST202EC
ST207EB
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74CBTLV16211
Abstract: 74CBTLV16211DGG JESD22-A114E TSSOP56
Text: 74CBTLV16211 24-bit low-voltage bus switch Rev. 01 — 20 June 2008 Product data sheet 1. General description The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output enable inputs 1OE, 2OE . The low on-state resistance of the switch allows connections to
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74CBTLV16211
24-bit
74CBTLV16211
12-bit
74CBTLV16211DGG
JESD22-A114E
TSSOP56
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TSSOP-56
Abstract: resin compound bond wire gold
Text: Fairchild Semiconductor Product Package Material Disclosure Package Type Weight of Package grams Component TSSOP-56 Lead Frame Copper alloy Maximum Minimum Material 2.21E-01 2.08E-01 Weight in grams Substance in material 7.37E-02 Copper Nickel Silicon Magnesium
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TSSOP-56
21E-01
08E-01
28E-01
84E-03
90E-03
22E-04
39E-03
37E-02
TSSOP-56
resin compound
bond wire gold
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