Untitled
Abstract: No abstract text available
Text: SO P5 6 TS SOT364-1 TSSOP56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape
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OT364-1
TSSOP56;
001aak603
OT364-1
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TSSOP56
Abstract: No abstract text available
Text: PDF: 2003 Mar 26 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
MO-153
TSSOP56
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PDF
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SOT364-1
Abstract: TSSOP56
Text: PDF: 2003 Apr 11 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
MO-153
SOT364-1
TSSOP56
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PDF
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sot364
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
OT364-1
MO-153EE
sot364
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PDF
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land pattern for TSSOP56
Abstract: TSSOP56 package TSSOP56
Text: 56-Pin Thin Shrink Small Outline Package TSSOP56 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max A 0.1 ±0.05 1.0 ±0.05
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56-Pin
TSSOP56
TSSOP56
land pattern for TSSOP56
TSSOP56 package
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PDF
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TSSOP56
Abstract: TSSOP56 package TSSOP-56
Text: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0
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56pin
TSSOP56
TSSOP56
TSSOP56 package
TSSOP-56
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PDF
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MO-194
Abstract: sot481
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm; lead pitch 0.4 mm SOT481-1 E D A X c y HE v M A Z 29 56 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 28 bp e w M 2.5
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TSSOP56:
OT481-1
OT481-1
MO-194
sot481
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MO-194
Abstract: TSSOP56 sot481
Text: PDF: 2001 Nov 23 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L detail X 1 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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TSSOP56:
OT481-2
MO-194
MO-194
TSSOP56
sot481
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PDF
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JEDEC MO-153
Abstract: TSSOP56
Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP56:
OT364-1
MO-153
JEDEC MO-153
TSSOP56
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PDF
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TSSOP56
Abstract: RE933-10
Text: TSSOP56 Adapter thin shrink small outline package RE933-10 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 56 - hole dia 1.00 mm - size 27.00 x 39.50 mm
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TSSOP56
RE933-10
RE933-10
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 A 3 A1 pin 1 index A θ Lp L 1 28 w M bp e detail X 2.5 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT
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TSSOP56:
OT364-1
MO-153
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PDF
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TSSOP56
Abstract: TSSOP-56
Text: Thin Shrink Small Outline Package 56pin TSSOP56 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max
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56pin
TSSOP56
TSSOP56
TSSOP-56
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2 E D A X c y HE v M A Z 29 56 A A2 A 3 A1 pin 1 index θ Lp L 1 detail X 28 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A
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TSSOP56:
OT481-2
MO-194
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PDF
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TSSOP56 package
Abstract: TSSOP56
Text: 56-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP56 Package Tape Dimensions 2.0 ±0.1 4.0 ±0.1 Y X’ 14.6 ±0.1 11.5 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 Unit: mm Y’ Y’ 8.6 ±0.1 X 1.65 ±0.1
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56-Pin
TSSOP56
TSSOP56
TSSOP56 package
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msi 7267 MOTHERBOARD SERVICE MANUAL
Abstract: ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram "0.4mm" bga "ball collapse" height PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C smd TRANSISTOR code marking A7 terminals diagram of smd transistor bo2 cookbook for ic 555
Text: GTL/GTLP Logic High-Performance Backplane Drivers Data Book Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information
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GDFP1-F48
-146AA
GDFP1-F56
-146AB
msi 7267 MOTHERBOARD SERVICE MANUAL
ttl cookbook
msi ms 7267 MOTHERBOARD CIRCUIT diagram
"0.4mm" bga "ball collapse" height
PCF 799
crystal oscillator 8MHz 4 pins
smd diode MARKING F5 44C
smd TRANSISTOR code marking A7
terminals diagram of smd transistor bo2
cookbook for ic 555
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74ALVT16543
Abstract: 74ALVT16543DGG 74ALVT16543DL 8C12 8EN10
Text: INTEGRATED CIRCUITS 74ALVT16543 2.5 V/3.3 V ALVT 16-bit registered transceiver 3-State Product data sheet Supersedes data of 1998 Feb 13 Philips Semiconductors 2004 Sep 14 Philips Semiconductors Product data sheet 2.5 V/3.3 V 16-bit registered transceiver (3-State)
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74ALVT16543
16-bit
74ALVT16543
74ALVT16543DGG
74ALVT16543DL
8C12
8EN10
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PDF
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clc014aje
Abstract: LMV8244 Video sync splitter lm DS34C86 LMH0074SQ DS8921 HV servo thermopile array 2N3960 DP838640 DS8921 equivalent
Text: Analog Design Guide for Xilinx FPGAs www.national.com/xilinx 2008 Vol. 1 Analog Solutions for FPGAs .2 Design Tools .3 PowerWise Solutions . 4-5 Data Conversion . 6-12 Amplifiers. 13-23
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74ALVT16821
Abstract: 74ALVT16821DGG 74ALVT16821DL JESD78 SSOP56 TSSOP56 diode 1d8
Text: 74ALVT16821 20-bit bus interface D-type flip-flop; positive-edge trigger; 3-state Rev. 03 — 13 June 2005 Product data sheet 1. General description The 74ALVT16821 high-performance Bipolar Complementary Metal Oxide Semiconductor BiCMOS device combines low static and dynamic power dissipation with
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74ALVT16821
20-bit
74ALVT16821
10-bit,
74ALVT16821DGG
74ALVT16821DL
JESD78
SSOP56
TSSOP56
diode 1d8
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AEC-Q100
Abstract: PCF8576D TQFP64 TSSOP56 smd diode marking s30
Text: PCF8576D Universal LCD driver for low multiplex rates Rev. 08 — 19 March 2009 Product data sheet 1. General description The PCF8576D is a peripheral device which interfaces to almost any Liquid Crystal Display LCD with low multiplex rates. It generates the drive signals for any static or
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PCF8576D
PCF8576D
AEC-Q100
TQFP64
TSSOP56
smd diode marking s30
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74ALVT16501
Abstract: 74ALVT16501DGG 74ALVT16501DL JESD78 SSOP56 TSSOP56 b1238
Text: 74ALVT16501 18-bit universal bus transceiver; 3-state Rev. 04 — 8 August 2005 Product data sheet 1. General description The 74ALVT16501 is a high-performance Bipolar Complementary Metal Oxide Semiconductor BiCMOS product designed for VCC operation at 2.5 V and 3.3 V with
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74ALVT16501
18-bit
74ALVT16501
74ALVT16501DGG
74ALVT16501DL
JESD78
SSOP56
TSSOP56
b1238
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PDF
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS 74AVC16834A 18-bit registered driver with inverted register enable and Dynamic Controlled Outputs 3-State Product data Supersedes data of 2000 Jul 25 Philips Semiconductors 2002 Sep 11 Philips Semiconductors Product data 18-bit registered driver with inverted register enable
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74AVC16834A
18-bit
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IA LE-4
Abstract: 74ALVC16501 74ALVC16501DGG 74ALVC16501DL SSOP56 TSSOP56 SSOP56 package TC9.5/4.8/TN25/15/HB 541
Text: Philips Semiconductors Objective Specification 18-Bit Universal bus transceiver; 3-state FEATURES • • • • • • • • QUICK REFERENCE DATA GNP = 0 V ; Timb = 25 °C; t, = t, = 2.5 ns Wide supply voltage range of 1.2 V to 3.6 V In accordance with JEDEC
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OCR Scan
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18-Bit
74ALVC16501
74ALVC16501
IA LE-4
74ALVC16501DGG
74ALVC16501DL
SSOP56
TSSOP56
SSOP56 package
TC9.5/4.8/TN25/15/HB 541
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PDF
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J13014
Abstract: 74ALVC16646 74ALVC16646DGG 74ALVC16646DL SSOP56 TSSOP56 Philips E10 SOP-56
Text: Philips Semiconductors Objective Specification 16-Bit bus transceiver/register; 3-state FEATURES • • • • • • • Wide supply voltage range of 1.2 V to 3.6 V In accordance with JEDEC standard rto.8-1A CMOS fow power consumption Multibyte flow-through
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OCR Scan
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16-Bit
74ALVC16646
74ALVC16646
VC16646
711002b
J13014
74ALVC16646DGG
74ALVC16646DL
SSOP56
TSSOP56
Philips E10
SOP-56
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PDF
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BG43
Abstract: ABE 814 16DI 74ALVC16600DGG 74ALVC16600DL SSOP56 TSSOP56
Text: Philips Semiconductors Objective Specification 18-Bit Universal bus transceiver; 3-state FEATURES • • • • • • • • 74ALVC16600 QUICK REFERENCE DATA GND = 0 V; T « * = 25 °C; t, = t, = 2.5 ns Wide supply voltage range of 1.2 V to 3.6 V In accordance with JEDEC
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OCR Scan
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18-Bit
74ALVC16600
74ALVC16600
711002b
G07S7MD
BG43
ABE 814
16DI
74ALVC16600DGG
74ALVC16600DL
SSOP56
TSSOP56
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PDF
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