TSOP 54 Package
Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)
|
Original
|
FPT-54P-M01
500mil
54-pin
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 PIN
TSOP II 54 Package
|
PDF
|
54-pin
Abstract: TSOP 54 Package TSOP 54 II
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01) 54-pin plastic TSOP (II) (FPT-54P-M01)
|
Original
|
FPT-54P-M01
54-pin
FPT-54-M01)
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 II
|
PDF
|
54-PIN
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02) 54-pin plastic TSOP (II) (FPT-54P-M02)
|
Original
|
FPT-54P-M02
54-pin
FPT-54P-M02)
F54003S-1C-1
|
PDF
|
TSOP Type II
Abstract: 9749 cel 9200 140C 8361H JESD22 Cypress 44LD
Text: Cypress Semiconductor Qualification Report QTP# 97491, Version 1.0 March, 1998 44 Ld TSOP Type II OSE, Taiwan Assembly Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type II QTP# 97491, V. 1.0 2 of 4 March, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
|
Original
|
8361H
JESD22-A112
CY7C1021-ZSC
619708844L
619708845L
TSOP Type II
9749
cel 9200
140C
8361H
JESD22
Cypress
44LD
|
PDF
|
M312L5623MTS
Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
Text: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary
|
Original
|
184pin
200mil
72-bit
M312L5620MTS-CB3/A2/B0
M312L5623MTS-CB3/A2/B0
256Mx4(
K4H1G0438M)
128Mx8(
K4H1G0838M)
M312L5623MTS
TSOP 173 g
M312L5620MTS-CB3
m312l5623mts-cb3
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM
|
Original
|
512MB,
184pin
512Mb
200mil
72-bit
M383L6523BTS-
|
PDF
|
MT48LC16M8A2BB
Abstract: No abstract text available
Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free
|
Original
|
128Mb:
MT48LC32M4A2
MT48LC16M8A2
MT48LC8M16A2
PC100-
PC133-compliant
4096-cycle
09005aef8091e66d
x4x8x16
MT48LC16M8A2BB
|
PDF
|
MT48LC16M8A2BB
Abstract: No abstract text available
Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free
|
Original
|
128Mb:
MT48LC32M4A2
MT48LC16M8A2
MT48LC8M16A2
54-pin
60-ball
54-ball
MT48LC16M8A2BB
|
PDF
|
MT48LCM32B2P
Abstract: No abstract text available
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
PC100-compliant
4096-cycle
09005aef811ce1fe
MT48LCM32B2P
|
PDF
|
MT48LCM32B2P
Abstract: No abstract text available
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
86-pin
90-ball
PC100-compliant
09005aef811ce1fe
MT48LCM32B2P
|
PDF
|
MT48LC2M32B2P
Abstract: No abstract text available
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
86-pin
90-ball
PC100-compliant
09005aef811ce1fe
MT48LC2M32B2P
|
PDF
|
MT48LCM32B2P
Abstract: MT48LCM32B2 x32s
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
PC100-compliant
4096-cycle,
09005aef811ce1fe
MT48LCM32B2P
MT48LCM32B2
x32s
|
PDF
|
MT48LC2M3B2b5
Abstract: MT48LCM32B2 MT48LCM32B2P MT48LC2M3B2 MT48LCM32 SMD MARKING code tac 63 ball fbga thermal resistance micron MT48LC4M16A2B4-6A IT 64Mb SDRAM is a high-speed CMOS
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
PC100-compliant
4096-cycle
09005aef811ce1fe
MT48LC2M3B2b5
MT48LCM32B2
MT48LCM32B2P
MT48LC2M3B2
MT48LCM32
SMD MARKING code tac
63 ball fbga thermal resistance micron
MT48LC4M16A2B4-6A IT 64Mb SDRAM is a high-speed CMOS
|
PDF
|
MT48LCM32B2
Abstract: MT48LC2M3B2
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
PC100-compliant
4096-cycle
09005aef811ce1fe
MT48LCM32B2
MT48LC2M3B2
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
86-pin
90-ball
PC100-compliant
09005aef811ce1fe
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 – 512K x 32 x 4 Banks Features Options Marking • Configuration – 2 Meg x 32 512K x 32 x 4 banks • Plastic package – OCPL1 – 86-pin TSOP II (400 mil) standard – 86-pin TSOP II (400 mil) Pb-free
|
Original
|
MT48LC2M32B2
PC100-compliant
4096-cycle
09005aef811ce1fe
|
PDF
|
MT48LC4M32B2P
Abstract: TP 472
Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)
|
Original
|
128Mb:
MT48LC4M32B2
PC100-compliant
4096-cycle
09005aef80872800
MT48LC4M32B2P
TP 472
|
PDF
|
TSOP II 54
Abstract: TSOP II 54 Package 54PIN 54P3G-C
Text: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2
|
Original
|
54P3G-C
54pin
400mil
54-P-400-0
TSOP II 54
TSOP II 54 Package
54P3G-C
|
PDF
|
MT48LC4M32B2P
Abstract: x32SDR
Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)
|
Original
|
128Mb:
MT48LC4M32B2
PC100-compliant
4096-cycle
09005aef80872800
MT48LC4M32B2P
x32SDR
|
PDF
|
MT48LC4M32B2P
Abstract: No abstract text available
Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)
|
Original
|
128Mb:
MT48LC4M32B2
PC100-compliant
4096-cycle
09005aef80872800
MT48LC4M32B2P
|
PDF
|
MT48LC4M32B2P
Abstract: marking 6a2 smd 6A 1176
Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)
|
Original
|
128Mb:
MT48LC4M32B2
PC100-compliant
4096-cycle
09005aef80872800
MT48LC4M32B2P
marking 6a2 smd
6A 1176
|
PDF
|
MT48LC4M32B2P
Abstract: No abstract text available
Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)
|
Original
|
128Mb:
MT48LC4M32B2
PC100-compliant
4096-cycle
09005aef80872800
MT48LC4M32B2P
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HYUNDAI HYM5V72A220A X-Series 1M X 7 2-b it CMOS DRAM MODULE DESCRIPTION The HYM5V72A220A is a 1M x 72-bit Fast page mode CMOS DRAM module consisting of four HY51V4400B in 20/26 pin TSOP-II, eight HY51V18160B 44/50pin TSOP-II and four 16-bit BiCMOS line driver in TSSOPon a 168 pin
|
OCR Scan
|
HYM5V72A220A
72-bit
HY51V4400B
HY51V18160B
44/50pin
16-bit
22jiF
HYM5V72A220ATXG/ASLTXG
RAS0-RA53)
|
PDF
|
ECO6
Abstract: No abstract text available
Text: HYUNDAI HYM572A220 X-Series 2M x 72-bit CMOS DRAM MODULE DESCRIPTION The HYM572A220 is a 1M x 72-bit Fast page mode CMOS DRAM module consisting of four HY514400A in 20/26 pin SOJ or TSOP-II, eight HY5118160 42/42 pin SOJ or 44/50 pin TSOP-II and two 16-bit BiCMOS line driver in
|
OCR Scan
|
HYM572A220
72-bit
HY514400A
HY5118160
16-bit
HYM572A220TXG/LTXG
DQ0-DQ71)
1EC06-10-APR95
ECO6
|
PDF
|
