TSOP 44 Package
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) * : Resin protrusion. (Each side : 0.15 (.006) Max) 44-pin plastic TSOP (II)
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Original
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FPT-44P-M18
400mil
44-pin
FPT-44P-M18)
F44025S-1C-1
120mil
TSOP 44 Package
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PDF
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FPT-44P-M08
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M08 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-44P-M08) 44-pin plastic TSOP (II) (FPT-44P-M08)
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Original
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FPT-44P-M08
44-pin
FPT-44P-M08)
F44017S-1C-2
FPT-44P-M08
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) 44-pin plastic TSOP (II) (FPT-44P-M18)
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Original
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FPT-44P-M18
44-pin
FPT-44P-M18)
F44025S-1C-1
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PDF
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29f800 29f400
Abstract: No abstract text available
Text: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP
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Original
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PA48TS29F
socket/44
29F100
29F200
29F400
29F800
29f800 29f400
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M17 44-pin plastic TSOP II Lead pitch 0.80mm Package width 300mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M17) 44-pin plastic TSOP (II) (FPT-44P-M17) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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Original
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FPT-44P-M17
300mil
44-pin
FPT-44P-M17)
F44024S-2C-1
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PDF
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TSOP044-P-0400-1
Abstract: MAX4435
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 44-pin plastic TSOP II (FPT-44P-M07) 44-pin plastic TSOP (II)
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Original
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FPT-44P-M07
TSOP044-P-0400-1
44-pin
FPT-44P-M07)
TSOP044-P-0400-1
MAX4435
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PDF
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TSOP044-P-0400-3
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M09 EIAJ code : TSOP044-P-0400-3 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-44P-M09) 44-pin plastic TSOP (II)
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Original
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FPT-44P-M09
TSOP044-P-0400-3
44-pin
FPT-44P-M09)
TSOP044-P-0400-3
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PDF
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29F800 equivalent
Abstract: No abstract text available
Text: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP
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Original
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PA48TS29F-800
socket/44
PA48TS29F
29F800
29F800
29F100,
29F800 equivalent
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PDF
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BGA and QFP Package mounting
Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,
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PDF
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2fu smd transistor
Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Text: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR
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Original
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TC55V1001ASTI/ASRI
TC55V2001STI/SRI
TC55V020FT/TR
TC55V2161FTI
TC55V200FT/TR
TC55V040FT/TR
TC55V400FT/TR
TC58VT
TC75S55FU
2fu smd transistor
Infrared sensor TSOP 1738
diode ESM 765
tsop Ir sensor
smd 1608
TSOP44 Package layout
TSOP infrared
infrared sensor (TSOP 1738)data sheet
Compact High-Current and Low VF Surface Mounting Device SBD
TC58V16BFT
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PDF
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TSOP Type II
Abstract: 9749 cel 9200 140C 8361H JESD22 Cypress 44LD
Text: Cypress Semiconductor Qualification Report QTP# 97491, Version 1.0 March, 1998 44 Ld TSOP Type II OSE, Taiwan Assembly Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type II QTP# 97491, V. 1.0 2 of 4 March, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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Original
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8361H
JESD22-A112
CY7C1021-ZSC
619708844L
619708845L
TSOP Type II
9749
cel 9200
140C
8361H
JESD22
Cypress
44LD
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PDF
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84-1LMI
Abstract: Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity
Text: Cypress Semiconductor Qualification Report QTP# 97205 VERSION 1.0 September, 1997 44 Ld, 400 mil TSOP Type II Package Hyundai-Korea Assembly Cypress Semiconductor Assembly: Hyndai, Korea Package: TSOP Type II QTP# 97205 V. 1.0 Page2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
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Original
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400-mil
S320CR
84-1LMI
Gold1021-ZSC
CY7C1021-ZSC
84-1LMI
Ablebond 84-1LMI
TSOP 48 thermal resistance
Ablebond
841LMI
140C
JESD22
moisture sensitivity
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PDF
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tsop II 44
Abstract: TSOP 44-40 Package 44P3W-R
Text: 44P3W-R Plastic 44pin 400mil TSOP EIAJ Package Code TSOP II 44/40-P-400-0.80 JEDEC Code – Weight(g) 0.47 Lead Material Alloy 42 e b2 l2 F 32 23 ME 35 Recommended Mount Pad E Symbol 1 10 13 A 22 c L D L1 HE 44 e y b A2 Detail F A A1 A2 b c D E e HE L
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Original
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44P3W-R
44pin
400mil
44/40-P-400-0
tsop II 44
TSOP 44-40 Package
44P3W-R
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M10 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Reverse bend
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Original
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FPT-44P-M10
44-pin
FPT-44P-M10)
F44015S-1C-2
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18)
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Original
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FPT-44P-M18
44-pin
FPT-44P-M18)
F44025S-1C-1
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M17 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 300 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M17)
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Original
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FPT-44P-M17
44-pin
FPT-44P-M17)
F44024S-2C-1
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PDF
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TSOP044-P-0400-1
Abstract: TSOP04 MAX4435 FPT-44P-M07
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method
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Original
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FPT-44P-M07
TSOP044-P-0400-1
44-pin
FPT-44P-M07)
heigh04)
F44016S-1C-2
TSOP044-P-0400-1
TSOP04
MAX4435
FPT-44P-M07
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PDF
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725004
Abstract: FPT-44P-M08 MAX4435
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC FPT-44P-M08 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-44P-M08)
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Original
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FPT-44P-M08
44-pin
FPT-44P-M08)
F44017S-1C-2
F44017S-1C-2
725004
FPT-44P-M08
MAX4435
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PDF
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M10 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-44P-M10) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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Original
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FPT-44P-M10
44-pin
FPT-44P-M10)
F44015S-1C-2
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PDF
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TSOP 86 Package
Abstract: tsop 86
Text: SMALL OUTLINE L-LEADED PACKAGE 86 PIN PLASTIC FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01) 86-pin plastic TSOP (II) (FPT-86P-M01) 86 44 Details of "A" part 0.25(.010)
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Original
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FPT-86P-M01
400mil
86-pin
FPT-86P-M01)
F86001S-1C-1
TSOP 86 Package
tsop 86
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PDF
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Untitled
Abstract: No abstract text available
Text: Package Dimensions 44-pin Plastic TSOP - Type II T N E H 1 D SEATING PLANE A L B e α A1 T Inches Millimeters No. Pins 44 44 Symbol Min Nom Max Min Nom Max A 0.039 — 0.047 1.00 — 1.20 A1 0.002 — 0.008 0.05 — 0.20 B 0.012 0.014 0.016 0.30 0.35 0.40
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Original
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44-pin
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PDF
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TSOP044-P-0400-1
Abstract: MAX4435
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction
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Original
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FPT-44P-M07
TSOP044-P-0400-1
44-pin
FPT-44P-M07)
F44016S-1C-2
TSOP044-P-0400-1
MAX4435
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PDF
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Untitled
Abstract: No abstract text available
Text: MEMORY ICS FUNCTION GUIDE 2. PRODUCT GUIDE Density 4M bit Org. Power Supply 512KX 3 5V±10% Part Number KM29N040T Speed Features Package = 32B Page Mode 4KB Block size 44 40 TSOP II 256B Page Mode 4KB Block size 44(40) TSOP II tR 15US tR C = 1 2 0 n s 3.3V±10%
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OCR Scan
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512KX
KM29N040T
KM29V040T
KM29N16000T/R
KM29N16000TS/RS
KM29N16000ET/ER
KM29N16000ETS/ERS
KM29N16000AT/AR
KM29N16000ATS/ARS
KM29V16000AT/AR
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PDF
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Untitled
Abstract: No abstract text available
Text: 16 M E G :x4,x8 MICRON I TECHNOLOGY, INC. Q FEATURES 44-Pin TSOP x4 NC DQ0 NC DQ1 - MARKING 4M 4 2M 8 - - • W RITE Recovery OWR/tDPL *WR = 1 CLK *WR = 2 CLK C on tact facto ry for availability.) Al A2 • Plastic Package - OCPL 44-pin TSOP (400 mil) Note:
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OCR Scan
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44-Pin
096-cycle
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PDF
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