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    TRAYS 14 X 20 Search Results

    TRAYS 14 X 20 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation

    TRAYS 14 X 20 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    12B-0608-F19

    Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
    Text: ‹ Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X


    Original     		PDF 0X45M 3466b 26022i 12B-0608-F19 DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A

    daewon

    Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"


    Original     		PDF 3472b 26946h f27839b-opt2 daewon 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11

    C9012

    Abstract: c9048 OA902 C9036 OA300 C454D 40164 C4512 C90-12 c4572
    Text: 830-2012.qxp:QuarkCatalogTempNew 9/5/12 7:23 AM Page 830 FANS, BLOWERS & MOTORIZED IMPELLERS INTERCONNECT TEST & MEASUREMENT 7 Fan Trays, Cords, Daisy Chains and Filter Kits Thermalcare Fan Tray Assemblies Fan Cords ᭤ 115/230 Voltage Selector Included with Dual Voltage Tray


    Original     		PDF OA300ST-120 OA300ST-230 C45-2DC C45-3DC C45-4DC C45-6DC C45-9DC C45-2DC-72P C45-2DC-144P C45-3DC-24P C9012 c9048 OA902 C9036 OA300 C454D 40164 C4512 C90-12 c4572

    SMD BOOK

    Abstract: smd 842 SMD Packages TQFP Package 44 lead 20B40 P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK
    Text: Package Outlines Plastic Package, P-DIP-40 Plastic Dual In-Line Package 20B40 DIN 41870 T10 Plastic Package, P-LCC-28-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-44-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-68 (Plastic Leaded Chip Carrier) – SMD


    Original     		PDF P-DIP-40 20B40 P-LCC-28-1 P-LCC-44-1 P-LCC-68 P-LCC-84-2 P-MQFP-44-2 P-MQFP-44-4 P-MQFP-80 P-MQFP-100-2 SMD BOOK smd 842 SMD Packages TQFP Package 44 lead P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    daewon

    Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
    Text: ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 ‹ Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044


    Original     		PDF f28384b VDJ044 28805c 3477b 27776c daewon VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		PDF SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP

    Untitled

    Abstract: No abstract text available
    Text: MXO45LV & MXO45HSLV HCMOS/TTL Clock Oscillator FEATURES • • • • • • • • • • Standard 14 Pin or 8 Pin DIP Packages HCMOS/TTL Compatible Output Fundamental and 3rd Overtone Crystal Designs Frequency Range 1 – 200 MHz Frequency Stability ±50 ppm Standard


    Original     		PDF MXO45LV MXO45HSLV MXO45LV MXO45HSLV IN45HSLV MXO45HSTLV. DIP-14 3M579545] 14M31818] 125M0000]

    Untitled

    Abstract: No abstract text available
    Text: MXO45 & MXO45HS HCMOS/TTL Clock Oscillator FEATURES • • • • • • • • • • Standard 14 Pin or 8 Pin DIP Packages HCMOS/TTL Compatible Output Fundamental and 3rd Overtone Crystal Designs Frequency Range 1 – 200 MHz Frequency Stability ±50 ppm Standard


    Original     		PDF MXO45 MXO45HS MXO45 MXO45HS MXO45HST. DIP-14 3M579545] 14M31818] 125M0000]

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		PDF SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783

    ATMEL 220 24C16

    Abstract: datasheet for atmel 416 24c16 an 24C16 pinout detail IPMB PICMG 2 11 R1 0 CompactPCI Power Interface IPMB Address AT24C16 ZT 7102 intel tray mechanical drawings carrier fru information
    Text: Intel NetStructureTM ZT 7102 Chassis Management Module Design Guide September 2002 Order Number: 273774-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PDF

    KCD-QD01-BA

    Abstract: KCD-QD01 cyberdisplay 320 kopin cyberdisplay kopin 320 320 display RS170 Module KLQS-007-A-B kopin amlcd
    Text: CyberDisplayTM CyberDisplayTM 320 Monochrome Display Model 290 KCD-QD01-BA Specifications For Use With RS170 Module Kopin Corporation 695 Myles Standish Blvd., Taunton, MA 02780 T 508.824.6696, F 508.824.6958 2/22/2001 KLQS-007-A-B Table of Contents 1. ELECTRICAL SPECIFICATIONS . 1-3


    Original     		PDF KCD-QD01-BA RS170 KLQS-007-A-B KCD-QD01-BA KCD-QD01 cyberdisplay 320 kopin cyberdisplay kopin 320 320 display RS170 Module KLQS-007-A-B kopin amlcd

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    HIOKI 3119

    Abstract: CSL-Z7302 EIA-383 JESD625-a ESD test plan JESD625 so20w CZE1000R jedec JESD625-a K6911
    Text: Application Report SZZA027A - April 2002 Electrostatic Discharge ESD Protective Semiconductor Packing Materials and Configurations Cles Troxtell and James Huckabee Standard Linear & Logic ABSTRACT The Texas Instruments Standard Linear & Logic (SLL) Business Group uses an


    Original     		PDF SZZA027A HIOKI 3119 CSL-Z7302 EIA-383 JESD625-a ESD test plan JESD625 so20w CZE1000R jedec JESD625-a K6911

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    Common rail injector service manuals

    Abstract: IPMB B2035 4511 bp Common rail injector Technical data INTEL 915 sdr GR-63-CORE M66EN PICMG 3.0 -48v GR-63-CORE Zone 4 test requirements
    Text: Intel NetStructureTM ZT 5088 12U General Purpose Packet Switched Platform Technical Product Specification July 2003 Order Number: 273789-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


    Original     		PDF

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    5085DC

    Abstract: PICMG 2.0 R3.0 AD202 B2082-01 Positronic Industries GR-63-CORE ZT5085 what are the dimensions of 19" rack, 3U height positronic connector compactPCI 47 positions connector
    Text: Intel NetStructureTM ZT 5085 12U Redundant Host Packet Switched Platform Technical Product Specification July 2003 Order Number: 273790-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		PDF

    a1770

    Abstract: EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil
    Text: Ferrites and accessories Packing Date: September 2006 Data Sheet  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Packing Packing Survey of packing modes


    Original     		PDF FAL0697-T FAL0677-E a1770 EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 20 RELEASED FOR PUBLICATION BY - 6 5 4 3 2 20 LOC GP ALL RIGHTS RESERVED. LIGHT PIPE KIT 1761012-1 1 REVISIONS DIST 00 P LTR DESCRIPTION APVD REVISED PER ECO-11-007052 06APR2011 JY CW F REVISED PER ECO-14-000886


    Original     		PDF ECO-11-007052 06APR2011 ECO-14-000886 20FEB2014 02FEB2004