QFP JEDEC tray
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 160 pin QFP 24 x 24 Terminal Spacing Linear = 0.5 A B 81 80 120 121 detail of lead end C D S Q 41 40 160 1 F G H I M J P K N NOTE S160GM-50-8ED-2 EIAJ CODE Weight (Reference Value)
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LA-3A68A-1
ST-TQ242414TJ-1
00nch)
S160GM-50-8ED-2
QFP JEDEC tray
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray Name LA-3508A-1 JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 120 121 81 80 detail of lead end C S D R Q 41 40 160 1 F G P H I M J K M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of
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LA-3508A-1
OT-001T-01
S160GD-65-LGD,
S160GD-65-LGD
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LA-0518A-1
Abstract: S160GM-50-JMD
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 detail of lead end C D S Q 160 1 F G R 41 40 H I M J K P M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3529A-1
LA-0518A-1
S160GM-50-JMD,
S160GM-50-JMD
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transistor NEC D 587
Abstract: NEC D 587 LA-3525A-1 LA-0525A-1
Text: Mounting Pad Packing NEC Tray Name LA-3525A-1 LA-0525A-1 JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A B 81 80 120 121 detail of lead end C D S Q 160 1 R 41 40 F G H I J M P K M N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of
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LA-3525A-1
LA-0525A-1
OT-001T-01
P160GD-65-5BD-3
SC-587-B
transistor NEC D 587
NEC D 587
LA-0525A-1
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P160GD-65-LBD
Abstract: No abstract text available
Text: Packing NEC Tray Name LA-3508A-1 Mounting Pad JEDEC Tray OT-001T-01 160 pin QFP 28 x 28 Terminal Spacing Linear = 0.65 A 81 80 160 1 41 40 F C 120 121 D B G H I M detail of lead end J N 5°±5° M Q P S K L P160GD-65-LBD, MBD NOTE Each lead centerline is located within 0.13 mm
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LA-3508A-1
OT-001T-01
P160GD-65-LBD,
P160GD-65-LBD
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nec 2701
Abstract: JEDEC tray dimension 2701 NEC LA-0518A-1 QFP JEDEC tray
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3529A-1 LA-0518A-1 MQFP 24x24 2.7mm 160 pin QFP 24 × 24 Terminal Spacing Linear = 0.5 A B 120 121 81 80 S C D R Q 41 40 160 1 F G H I J M P K S N S L NOTE ITEM 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3529A-1
LA-0518A-1
S160GM-50-3ED,
nec 2701
JEDEC tray dimension
2701 NEC
QFP JEDEC tray
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QFP28
Abstract: 7404 QFP JEDEC tray JEDEC TRAY QFP
Text: TRAY CONTAINER UNIT : mm 3 x 8=24 NEC 135° C MAX. A' 34.20 37.02 27.93 34.20 74.04 30.93 37.02 QFP28×28×3.2A 135.9 PPE A 259.14 315.0 322.6 SECTION A-A' 34.20 (3.77) (6.35) 7.62 27.35 Applied Package Quantity (pcs) 120-pin Plastic QFP (3.2mm thick) 160-pin Plastic QFP (3.2mm thick)
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QFP28
208-pin
256-pin
120-pin
160-pin
SSD-A-H7605
7404
QFP JEDEC tray
JEDEC TRAY QFP
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QFP JEDEC tray
Abstract: nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec
Text: TRAY CONTAINER HEAT PROOF 7 A' 15.20 13.10 12.5 PPE 135°C MAX NEC 15.70 A 8x20 = 160 13.00 109.9 LQFP 10×10×1.4 12.5 288.8 315.0 322.6 SECTION A-A' 12.50 Applied Package 6.12 (6.35) 9.90 7.62 135.9 UNIT : mm Quantity (pcs) 64-pin Plastic QFP (1.4mm thick)
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64-pin
44-pin
52-pin
SSD-A-H6405-1
QFP JEDEC tray
nec 44 pin LQFP
LQFP Package tray
NEC lqfp 52
JEDEC TRAY QFP
JEDEC tray standard
qfp tray standard
nec 44pin
QFp Package tray
tray qfp 160 jedec
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ND-1420-2
Abstract: QFP JEDEC tray 304-Pin 304 QFP
Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
100-Pin
ND-1420-2
QFP JEDEC tray
304 QFP
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QFP Shipping Trays
Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
100-Pin
QFP Shipping Trays
ND-1420-2
QFP 100 pin
QFP PACKAGE mass
64 leads qfp
QFP JEDEC tray
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
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QFP JEDEC tray
Abstract: No abstract text available
Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
QFP JEDEC tray
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TO-220 JEDEC
Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
100-Pin
TO-220 JEDEC
ND-1420-2
QFP Package 80 lead
4-0308
4040 data sheet
9 pin socket
nd-3232-3.4
parts detail of 5.1 sound pcb
QFP 100 pin
QFP Shipping Trays
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QFP JEDEC tray
Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
Text: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical
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304-pin
QFP JEDEC tray
ND-3232-3
ND-2828-3
304-pin dimensions
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MIL-I-8835A
Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from
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NEC A39A
Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES
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C10943XJ6V0IF00
IEI-635,
IEI-1213)
ED-7411
NEC A39A
NEC A39A 240
SOP28 330 mil land pattern
NEC A39A 8 PIN
mjh 106
120-PIN 282 185 01
smd TRANSISTOR code b6
ED-7500
transistor a39a
SIP 400B
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camtex trays
Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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PLCC 84 PINS
Abstract: camtex trays MIL-I-8835A
Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
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116-Pin
Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size
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C13185EJ1V0PF00
116-Pin
PBGA 256 reflow profile
semiconductor cross index
Lead Free reflow soldering profile BGA
reflow soldering profile BGA
224-pin plastic ball grid array 0.8mm
JIS-Z0202
tray qfp 14x14 1.4
tray bga 10x10
pcb warpage after reflow
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ASE QFP
Abstract: No abstract text available
Text: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical
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304-pin
ASE QFP
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removal tool from EPLD socket
Abstract: No abstract text available
Text: QFP Carrier & Development Socket M a rc h 1995, ver. 7 Features D ata S h ee t • ■ ■ ■ General Description Q uad flat pack QFP carriers protect fragile leads on Altera QFP devices during shipping and device handling. Development sockets allow on-board electrical and mechanical
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OCR Scan
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PDF
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304pin
removal tool from EPLD socket
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Untitled
Abstract: No abstract text available
Text: QFP Carrier & Development Socket Ju n e 1996, ver. 10 Features D ata S h e e t • ■ ■ ■ ■ General Description Q u a d flat p ac k Q FP c a rrie rs p ro te c t frag ile le a d s o n Q F P d ev ice s d u rin g sh ip p in g a n d d ev ic e h a n d lin g .
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OCR Scan
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304-pin
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