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    TRAY QFP 14X14 Search Results

    TRAY QFP 14X14 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    TRAY QFP 14X14 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JEDEC TRAY DIMENSIONS

    Abstract: QFP JEDEC tray JEDEC tray standard SSD-A-H7437 JEDEC TRAY DIMENSIONS QFP14 QFP 14 14 tray QFP14 TRAY CONTAINER
    Text: TRAY CONTAINER UNIT : mm 6 x 14=84 135° CMAX. 15.45 A' 18.30 21.50 17.75 18.30 NEC 105.0 QFP14 × 14 × 2.7 21.00 135.9 PPE A 279.5 315.0 322.6 SECTION A-A' 18.30 4.77 (6.35) 7.62 13.65 Applied Package 100-pin Plastic QFP (2.7mm thick) Quantity (pcs) 84 MAX.


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    PDF QFP14 100-pin SSD-A-H7437 JEDEC TRAY DIMENSIONS QFP JEDEC tray JEDEC tray standard SSD-A-H7437 JEDEC TRAY DIMENSIONS QFP14 QFP 14 14 tray QFP14 TRAY CONTAINER

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


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    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


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    PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    QFN tray

    Abstract: 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray
    Text: Packaging Product Specification PS007229-1010 Copyright 2010 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


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    PDF PS007229-1010 2000/REEL 1000/REEL 160/TRAY 1600/BAG 490/TRAY 260/TRAY QFN tray 7x7x1.4 tray tray datasheet bga MKT71C1176-00 qfn 5 x 5 TRAY PS007229-1010 lqfp 7x7 tray BGA package tray 64 BGA 31 x 31 tray LQFP Package tray

    MC9S12Dx256

    Abstract: tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 EAR99 HCS12 HCS12 1k79x
    Text: Page 1 of 4 MC9S12A256BCFU Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics


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    PDF MC9S12A256BCFU MC9S12A256BCFU HCS12 PQFP-G80 MC9S12Dx256 tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 EAR99 HCS12 1k79x

    MCHC908AB32CFUR2

    Abstract: No abstract text available
    Text: Page 1 of 3 MCHC908AB32CFUR2 Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics


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    PDF MCHC908AB32CFUR2 MCHC908AB32CFUR2 SAG9AB32

    sqfp 14x20

    Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
    Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has


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    PDF 30MHz 80C51 sqfp 14x20 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes

    IC30000

    Abstract: BDM-MCS12 CX6812 Freescale Microcontrollers HCS12 I2C EMUL12-PC 68HC908 usb eeprom emulator metrowerks codetest MQFP 14X14 tray
    Text: MC9S12B64 Product Summary Page Register Part Number Login Keyword Basket Home | Contact Us Contains Search Advanced | Parametric Products Applications Technologies Support Where to Buy About Freescale Freescale > Microcontrollers > 16-Bit HCS12, M68HC12, M68HC16, 56800/E > HCS12 Automotive Family > MC9S12B64


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    PDF MC9S12B64 16-Bit HCS12, M68HC12, M68HC16, 56800/E) HCS12 MC9S12B64 16-Bit IC30000 BDM-MCS12 CX6812 Freescale Microcontrollers HCS12 I2C EMUL12-PC 68HC908 usb eeprom emulator metrowerks codetest MQFP 14X14 tray

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


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    PDF 10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408

    JEDEC qfn tray

    Abstract: JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
    Text: Packaging Product Specification PS007230-0812 Copyright 2012 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE THESE PRODUCTS IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


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    PDF PS007230-0812 2500/BAG 1600/BAG 900/BAG 600/BAG 2000/REEL 1500/REEL JEDEC qfn tray JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN

    2L86D

    Abstract: ComPOD12 PROG12Z AN2546 bdm programmer 1l86d MSE9S12D64 AN2548 MC9SD64CFUR2 MC9S12H256
    Text: MC9S12D64 Product Summary Page Register Login Basket PartHome Number| Keyword Contact Us Contains Products Applications Technologies Support Where to Buy About Freescale Search Freescale > Microcontrollers > 16-Bit HCS12, M68HC12, M68HC16, 56800/E > HCS12 Automotive Family > MC9S12D64


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    PDF MC9S12D64 16-Bit HCS12, M68HC12, M68HC16, 56800/E) HCS12 MC9S12D64 16-Bit 2L86D ComPOD12 PROG12Z AN2546 bdm programmer 1l86d MSE9S12D64 AN2548 MC9SD64CFUR2 MC9S12H256

    2L86D

    Abstract: ComPOD12 PROG12Z bdm programmer chrysler pci bus protocol MC9S12Dx64 IC30000 Adapt9S12DP256 pemicro DB12S12FW
    Text: MC9S12DJ64 Product Summary Page Register Login Basket PartHome Number| Keyword Contact Us Contains Products Applications Technologies Support Where to Buy About Freescale Search Freescale > Microcontrollers > 16-Bit HCS12, M68HC12, M68HC16, 56800/E > HCS12 Family > MC9S12DJ64


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    PDF MC9S12DJ64 16-Bit HCS12, M68HC12, M68HC16, 56800/E) HCS12 MC9S12DJ64 16-Bit 2L86D ComPOD12 PROG12Z bdm programmer chrysler pci bus protocol MC9S12Dx64 IC30000 Adapt9S12DP256 pemicro DB12S12FW

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


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    PDF P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. [検索]のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して, 検索 F をクリックしてください。


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    PDF P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1

    SMD CODE 9Z

    Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
    Text: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2


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    PDF 300mm SMD CODE 9Z 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products

    chrysler sci

    Abstract: 2L86D ComPOD12 bdm programmer BDI1000 MC9S12Dx256 Freescale HCS12 MC9S12E128 ATD mc9s12dg256 code example assembly S12ATD10B8CV2
    Text: MC9S12A64 Product Summary Page Register Login Basket PartHome Number| Keyword Contact Us Contains Products Applications Technologies Support Where to Buy About Freescale Search Freescale > Microcontrollers > 16-Bit HCS12, M68HC12, M68HC16, 56800/E > HCS12 Family > MC9S12A64


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    PDF MC9S12A64 16-Bit HCS12, M68HC12, M68HC16, 56800/E) HCS12 MC9S12A64 16-Bit chrysler sci 2L86D ComPOD12 bdm programmer BDI1000 MC9S12Dx256 Freescale HCS12 MC9S12E128 ATD mc9s12dg256 code example assembly S12ATD10B8CV2

    78064Y

    Abstract: uPD78064 uPD78P064 uPD78P064GC uPD78P064KL-T U12326E upd78062 S19 SMA MARKING CODE IC-3224
    Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD78P064 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION The µPD78P064 is a product of µ PD78064 subseries in 78K/0 series, in which the on-chip mask ROM of the µPD78064 is replaced by one-time PROM or EPROM. As program write by user is possible, the µPD78P064 is best suited for evaluation, short-run and multiple-device


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    PDF PD78P064 PD78P064 PD78064 78K/0 PD78064 PD78064, 78064Y U10105E uPD78064 uPD78P064 uPD78P064GC uPD78P064KL-T U12326E upd78062 S19 SMA MARKING CODE IC-3224

    uPD78064B

    Abstract: uPD78P064B uPD78P064BGC uPD78P064BGC-7EA uPD78P064BGC-8EU uPD78P064BGF-3BA U12326E SEG 55
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    78064Y

    Abstract: uPD78064 uPD78P064 uPD78P064GC uPD78P064KL-T U12326E 78p064gf-3ba S19 SMA MARKING CODE PD78P064GF-3BA
    Text: DATA SHEET MOS INTEGRATED CIRCUIT mPD78P064 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION The mPD78P064 is a product of m PD78064 subseries in 78K/0 series, in which the on-chip mask ROM of the m PD78064 is replaced by one-time PROM or EPROM. As program write by user is possible, the m PD78P064 is best suited for evaluation, short-run and multiple-device


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    PDF mPD78P064 mPD78P064 PD78064 78K/0 PD78064 PD78P064 PD78064, 78064Y U10105E uPD78064 uPD78P064 uPD78P064GC uPD78P064KL-T U12326E 78p064gf-3ba S19 SMA MARKING CODE PD78P064GF-3BA

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


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    PDF SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST

    uPD78P064

    Abstract: UPD78P064GF-3BA 78064Y uPD78064 uPD78P064GC uPD78P064KL-T U12326E 16K-32K S19 SMA MARKING CODE
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    transistor SR 13001

    Abstract: RCA SK CROSS-REFERENCE PCD8572I ATmel 730 24c04 SR 13001 transistor atmel 716 24c04 UNITRODE applications handbook uc3842 -96 all 89c51 microcontroller references book QFP44 footprint HI5618
    Text: INTEGRATED CIRCUITS DATA SHEET PCF5001 POCSAG Paging Decoder Product specification Supersedes data of 1995 Apr 27 File under Integrated Circuits, IC17 1997 Mar 04 Philips Semiconductors Product specification POCSAG Paging Decoder PCF5001 CONTENTS BLOCK DIAGRAMS


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    PDF PCF5001 TAPE11 TAPE13 transistor SR 13001 RCA SK CROSS-REFERENCE PCD8572I ATmel 730 24c04 SR 13001 transistor atmel 716 24c04 UNITRODE applications handbook uc3842 -96 all 89c51 microcontroller references book QFP44 footprint HI5618

    D78P0

    Abstract: UPD78P064GF UPD78P064GF-3BA uPD780208 78064Y uPD78P064 uPD78P064KL-T U12326E uPD78064 upd78062
    Text: DATA SHEET NEC MOS INTEGRATED CIRCUIT ¿¿PD78P064 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION The ¿¡PD78P064 is a product of ¿¡PD78064 subseries in 78K/0 series, in which the on-chip mask ROM of the ¿¡PD78064 is replaced by one-time PROM or EPROM.


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    PDF uPD78P064 PD78P064 PD78064 78K/0 PD78064, 78064Y U10105E D78P0 UPD78P064GF UPD78P064GF-3BA uPD780208 uPD78P064KL-T U12326E uPD78064 upd78062

    D78P064

    Abstract: nec 100 pin
    Text: DATA SHEET NEC MOS INTEGRATED CIRCUIT ÎÎPD78P064 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION T he/¿ P D 7 8P 0 6 4 is a p ro d u c t of/¿PD 78064 subseries in 78K/0 series, in w hich the on-chip m ask ROM o fthe/¿ P D 78064 is replaced by one-tim e PROM or EPROM .


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    PDF uPD78P064 78K/0 PD78P064 PD78064, 78064Y 10105E 12326E D78P064 nec 100 pin