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    TRAY 6 X 15 QFP 1414 Search Results

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    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    PEAK tray drawing

    Abstract: PEAK tray drawing 7 X 7 S1145 S11-45
    Text: -CHAMFER PACKAGE INDICATES P I N #1 o NOTES: O RIENTATIO N EE DE’ D 1. MATERIAL 2. ALL - RR8 3. TOLERANCES DIMENSIONS - ARE IN MILLIM ETERS. X.X = + 0 . 2 5 — X . X X = + 0.1 3 J7.62 v _ -34. UNLESS — 0,76 I : 5 .' 6.35 ! 5 5. 3 ESD 5. - 1 0 5 TO 1 0 11 O H M S / S Q .


    OCR Scan     		US50MER CSA00609 TI52E PEAK tray drawing PEAK tray drawing 7 X 7 S1145 S11-45 PDF

    PEAK tray drawing

    Abstract: P-00542 paft tray 6 x 15 qfp 1414
    Text: SEE BOTTOM V IE W -R2.54 3.0 X45 1/ PACKAGE PI N#1 O RIENTATIO N ;e e D DE' 1. MATERIAL 2. ALL - 3. TOLERANCES PP6 DIMENS - X.X = + 0 . 2 5 — X . X X = + 0.1 3 17.62 15. .3 UNLESS ~0?7 6.35 !55, - OTPERW ISE SURPACE ESD 5. - 1 0 5 TO 1 0 11 O P M S / S Q .


    OCR Scan     		CSA00609 PEAK tray drawing P-00542 paft tray 6 x 15 qfp 1414 PDF

    D78P0

    Abstract: UPD78P064GF UPD78P064GF-3BA uPD780208 78064Y uPD78P064 uPD78P064KL-T U12326E uPD78064 upd78062
    Text: DATA SHEET NEC MOS INTEGRATED CIRCUIT ¿¿PD78P064 8-BIT SINGLE-CHIP MICROCONTROLLER DESCRIPTION The ¿¡PD78P064 is a product of ¿¡PD78064 subseries in 78K/0 series, in which the on-chip mask ROM of the ¿¡PD78064 is replaced by one-time PROM or EPROM.


    OCR Scan     		uPD78P064 PD78P064 PD78064 78K/0 PD78064, 78064Y U10105E D78P0 UPD78P064GF UPD78P064GF-3BA uPD780208 uPD78P064KL-T U12326E uPD78064 upd78062 PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    communication IC 3802

    Abstract: 64F38004 HD64338001H MX73P Nippon capacitors
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		d-2888, H8/3802, H8/38004, H8/38002S, H8/38104 REJ09B0024-0700 communication IC 3802 64F38004 HD64338001H MX73P Nippon capacitors PDF

    1084-33

    Abstract: SK 18752 AC 1084-33 Toyocom 33-25 H8/38104 h1080 cmos 4000 logic book Nippon capacitors
    Text: REJ09B0024-0700 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 8 H8/3802, H8/38004, H8/38002S, H8/38104 Group


    Original     		REJ09B0024-0700 H8/3802, H8/38004, H8/38002S, H8/38104 H8/300L H8/3802 H8/38004 H8/3802 H8/3801 1084-33 SK 18752 AC 1084-33 Toyocom 33-25 h1080 cmos 4000 logic book Nippon capacitors PDF

    K9F2G08U0C

    Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
    Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM


    Original     		BR-10-ALL-001 K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0 PDF

    TI5C

    Abstract: SHARP I A05 SMD MARKING lah controller LU850425 lu850425 IR3Y38M LR38266 LR38277 LR38278 LR38578
    Text: SHARP S P E C No. E L 1 0 7 1 6 9 I S S U E : A u g u s t 18,1998 T o ;_ S P EC I F I CAT IONS Product Ty pe Model No. 8-BIT MICROCOMPUTER FOR DSP CAMERA SYSTEM LU850425 •^This specification contains 40 pages including the cover and appendix.


    OCR Scan     		LU850425 LU850425 LQFP100â AA1058 CV557 TI5C SHARP I A05 SMD MARKING lah controller LU850425 IR3Y38M LR38266 LR38277 LR38278 LR38578 PDF

    K9HDG08U1A

    Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
    Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


    Original     		BR-11-ALL-001 K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe PDF

    1084-33

    Abstract: AC 1084-33 CSTLS16M0X53-B0 H8/38104 seiko LCD lvd 404 TCA 700 v tray qfp 14x14 1.4 dp 502 t h8 family Nihon Dempa Kogyo Co., Ltd.
    Text: REJ09B0024-0600 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 8 H8/3802, H8/38004, H8/38002S, H8/38104 Group


    Original     		REJ09B0024-0600 H8/3802, H8/38004, H8/38002S, H8/38104 H8/300L H8/3802 H8/38004 H8/3802 H8/3801 1084-33 AC 1084-33 CSTLS16M0X53-B0 seiko LCD lvd 404 TCA 700 v tray qfp 14x14 1.4 dp 502 t h8 family Nihon Dempa Kogyo Co., Ltd. PDF

    LM324 preamp circuit DIAGRAM

    Abstract: RSC-164-V2 phone dialer LM324 RSC164v2 lm324 mic preamp block diagram of speech recognition C3A marking code circuit diagram of speech recognition rom at29c010
    Text: Voice Dialer Data Book  SENSORY, INC. Voice Dialer Copyright  Copyright 1998, Sensory, Inc. You may not copy, modify, or translate this document or any part of this document. Nor can you reduce any part of it to any machine readable form. Trademarks


    Original     		1uF/50V 470pF 22uF/10v 10uF/10V 22/16V 033uF/16v 1uF/16V 0047uF/50v 100pf 2N3904 LM324 preamp circuit DIAGRAM RSC-164-V2 phone dialer LM324 RSC164v2 lm324 mic preamp block diagram of speech recognition C3A marking code circuit diagram of speech recognition rom at29c010 PDF

    AC 1084-33

    Abstract: 1084-33 H8/38104 NDR 550 IN RF MODULE datasheet tca 761 TM 1628 driver display DP-64S si 18752 Hitachi DSA0044 Nippon capacitors
    Text: REJ09B0024-0500O The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 8 H8/3802, H8/38004, H8/38104 Group


    Original     		REJ09B0024-0500O H8/3802, H8/38004, H8/38104 H8/300L Unit2607 AC 1084-33 1084-33 NDR 550 IN RF MODULE datasheet tca 761 TM 1628 driver display DP-64S si 18752 Hitachi DSA0044 Nippon capacitors PDF

    1084-33

    Abstract: AC 1084-33 H8/38104 seiko LCD lvd 404 HD64F38104 ADE-502-055 datasheet tca 761 DP-64S HD64F38102 F38104FP
    Text: REJ09B0024-0400O The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 8 H8/3802, H8/38004, H8/38104 Group


    Original     		REJ09B0024-0400O H8/3802, H8/38004, H8/38104 H8/300L D-85622 1084-33 AC 1084-33 seiko LCD lvd 404 HD64F38104 ADE-502-055 datasheet tca 761 DP-64S HD64F38102 F38104FP PDF

    ph 4148 zener diode

    Abstract: philips zener diode ph 4148 pcf0700p Zener Diode ph 4148 PCA1318P ck2605 pcf0700p/051 philips Pca1318p on4673 Zener Diode 4148
    Text: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-40 DATED DECEMBER 31, 1998 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODE S COMMENTS DISCONTINUED INTEGRATED CIRCUIT PRODUCTS


    Original     		DN-40 74ABT126 74ABT2240 X3G-BZX84-C7V5 X3G-BZX84-C9V1 ph 4148 zener diode philips zener diode ph 4148 pcf0700p Zener Diode ph 4148 PCA1318P ck2605 pcf0700p/051 philips Pca1318p on4673 Zener Diode 4148 PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    TR4 SMD MARKING CODE

    Abstract: blm32a07 SMD 6PIN IC MARKING CODE vc UDA1325H BB2 marking ic20 usb PCF8511
    Text: INTEGRATED CIRCUITS DATA SHEET UDA1325 Universal Serial Bus USB CODEC Preliminary specification File under Integrated Circuits, IC01 1999 May 10 Philips Semiconductors Preliminary specification Universal Serial Bus (USB) CODEC UDA1325 FEATURES Audio recording channel


    Original     		UDA1325 UDA1325 OT319 OT270 TR4 SMD MARKING CODE blm32a07 SMD 6PIN IC MARKING CODE vc UDA1325H BB2 marking ic20 usb PCF8511 PDF

    32 pin eprom to eprom copier circuit

    Abstract: PWM USING IC 555 TIMER TRANSISTOR BC 187 uPD78238 IEU-1311 78234 uPD78233 uPD78234 uPD78237 uPD78P238
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF

    sem 2106 inverter diagram

    Abstract: induction cooker schematic diagram automatic brake failure indicator and engine heating alarm working principles of dc fan in toshiba air conditioner atm with an eye seminar report sem 2106 inverter transistor smd marking mx ODOMETER transistor 9015 c sem 2106 manual
    Text: This version: Jan. 1998 Previous version: Nov. 1996 E2S0001-27-Y3 Introduction Thank you for supporting OKI Semiconductor products. In the rapidly advancing electronics industry, types of semiconductor applications are diversified, and customer demands for


    Original     		E2S0001-27-Y3 MIL-STD-883 MIL-STD-202 sem 2106 inverter diagram induction cooker schematic diagram automatic brake failure indicator and engine heating alarm working principles of dc fan in toshiba air conditioner atm with an eye seminar report sem 2106 inverter transistor smd marking mx ODOMETER transistor 9015 c sem 2106 manual PDF

    Untitled

    Abstract: No abstract text available
    Text: µPD78234 SUBSERIES 8-BIT SINGLE CHIP MICROCOMPUTER HARDWARE µPD78233 µPD78234 µPD78237 µPD78238 µPD78P238 µPD78234 A µPD78238 (A) 1990 1994 Document No. IEU-1290H (O. D. No. IEU-718H) Date Published January 1995 P Printed in Japan GENERAL NOTES ON CMOS DEVICES


    Original     		PD78234 PD78233 PD78234 PD78237 PD78238 PD78P238 IEU-1290H IEU-718H) PDF

    dinverter 768r

    Abstract: G7D-412S Ericsson Installation guide for RBS 6201 OMRON G7d TH3 thermistor 6201 RBS ericsson user manual TMS77C82NL reed relay rs 349-355 i ball 450 watt smps repairing RBS -ericsson 6601
    Text: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.


    Original     		HEF4527BT HEF4531BT HEF4534BP HEF4534BT MSP-STK430X320 AD9054/PCB AD9054BST-135 IPS521G IPS521S IRL2203S dinverter 768r G7D-412S Ericsson Installation guide for RBS 6201 OMRON G7d TH3 thermistor 6201 RBS ericsson user manual TMS77C82NL reed relay rs 349-355 i ball 450 watt smps repairing RBS -ericsson 6601 PDF