Transistor mounting pads
Abstract: wn transistor Transistor Pads
Text: TRANSISTOR MOUNTING PADS Key D = Glass Filled Polyester N / WN = Nylon / White Nylon GFN = Glass Filled Nylon P = Polypropylene Suggested Continuous Operating Temp range = Suggested Continuous Operating Temp range = Suggested Continuous Operating Temp range =
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2SC495
Abstract: NSP41A BU108 transistor BD614 MOTOROLA 2SA663 BD4122 BD661 MJ1000 NSP2100 D45VH4 similar
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MJF6107 Power Transistor For Isolated Package Applications PNP SILICON POWER TRANSISTOR 7 AMPERES 70 VOLTS 34 WATTS Designed for general–purpose amplifier and switching applications, where the mounting surface of the device is required to be electrically isolated from the heatsink
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MJF6107
2N6107
E69369,
TIP73B
TIP74
TIP74A
TIP74B
TIP75
TIP75A
TIP75B
2SC495
NSP41A
BU108
transistor BD614 MOTOROLA
2SA663
BD4122
BD661
MJ1000
NSP2100
D45VH4 similar
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TRANSISTOR BC 384
Abstract: BU108 bd139 equivalent transistor 2N3055 equivalent RCA1C03 transistor Bc 574 BU326 BU100
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MJF47 High Voltage Power Transistor Isolated Package Applications NPN SILICON POWER TRANSISTOR 1 AMPERE 250 VOLTS 28 WATTS Designed for line operated audio output amplifiers, switching power supply drivers and other switching applications, where the mounting surface of the device is required
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TIP47
E69369,
MJF47
TIP73B
TIP74
TIP74A
TIP74B
TIP75
TIP75A
TIP75B
TRANSISTOR BC 384
BU108
bd139 equivalent transistor
2N3055 equivalent
RCA1C03
transistor Bc 574
BU326
BU100
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AN10896
Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
Text: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages
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AN10896
AN10896
finger print sensor pcb with circuit
Mounting and Soldering of RF transistors
heller 1700
ipc 610D
JEDEC J-STD-020d Moisture/Reflow sensitivity
HVQFN48
J-STD-020D
bga rework
graphite thermal spreader
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TO126 package
Abstract: PF730 Heatsinks TO247 package 220SA TO202 package Heatsinks TO247 SOT93 package TO126 TO218 package
Text: HEATSINKS & MOUNTINGS HEATSINKS SOT32/TO126 package MAX247 package A range of innovative heatsinks for the STMicroelectronics MAX247 power transistor package. Utilise novel clip solutions to obtain optimum performance. PF730, PF732 MAX6263 Clip-on heatsinks, with a mounting hole, to fit a
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OT32/TO126
MAX247
MAX247TM
PF730,
PF732
MAX6263
EAD063NN
EAD063TH
TO126 package
PF730
Heatsinks
TO247 package
220SA
TO202 package
Heatsinks TO247
SOT93 package
TO126
TO218 package
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AN10896
Abstract: No abstract text available
Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages
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AN10896
AN10896
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C5098
Abstract: No abstract text available
Text: TO-5 CASE RELAY DPDT, HIGH CURRENT Series MCA Product Description A series of ultra miniature hermetically sealed relays constructed in a transistor style case, providing superior performance and established reliability characteristics. Designed for high density PCB mounting is available in a variety of sensitivities. Contact configurations and material improvements to
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Untitled
Abstract: No abstract text available
Text: TO-5 CASE RELAY DPDT, HIGH CURRENT Series MCA Product Description A series of ultra miniature hermetically sealed relays constructed in a transistor style case, providing superior performance and established reliability characteristics. Designed for high density PCB mounting is available in a variety of sensitivities. Contact configurations and material improvements to
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K177-353BQ2840
Abstract: K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353
Text: HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and other similar devices requiring effective transfer of generated heat. Highly conductive aluminium foil with adhesive applied to both sides negates the
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KA150-2AC.
300mm
KA150-2AC-30X30
5-100X100
2-100X100
0-100X100
5000Vrms
K177-353BQ2840
K177-NA-353
K1778
TSC209-ZP
k177
TSC506-NY
K200-AC-403
TSC405-ZP
K177-AC-353
K200-AC-353
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ZEMREX
Abstract: k177 bq35 TO3 SILICONE MICA SHEET D149
Text: Insulating Kit Features: • KOOL-PADS offer a low cost alternative to all other types of thermally conductive insulators constructed from a thermally conductive silicone rubber compound coated onto a layer of woven glassfibre, they provide a strong flexible and clean insulator, which will not crack, age or permit
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18043
Abstract: IPC600E
Text: P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter FEATURES • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder devices directly to topside of
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OT-25,
OT-23A-6
OT-25
IPC-600E,
C36000,
B16/B16M
-610B
1110748-P
18043
IPC600E
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IPC-600E
Abstract: TRANSISTOR SUBSTITUTION
Text: P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter FEATURES • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder devices directly to topside of
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OT-25,
OT-23A-6
OT-25
IPC-600E,
C36000,
1110748-P
-610B
IPC-600E
TRANSISTOR SUBSTITUTION
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IPC-600E
Abstract: nj TRANSISTOR 610B ASTM-B16-85 TRANSISTOR SUBSTITUTION HASL surface mount to dip adapter
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT-23A-6
OT-25
IPC-600E,
IPC-600E
nj TRANSISTOR
610B
ASTM-B16-85
TRANSISTOR SUBSTITUTION
HASL
surface mount to dip adapter
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Untitled
Abstract: No abstract text available
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT-23A-6
OT-25
IPC-600E,
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Untitled
Abstract: No abstract text available
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT23A-6
OT-25
IPC600E,
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Untitled
Abstract: No abstract text available
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT23A-6
OT-25
IPC600E,
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IPC-600E
Abstract: No abstract text available
Text: Part No. 1110748 - Surface Mount to DIP Adapter for SOT-25, SOT-23A-6 FEATURES: • Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. • Solder masked top-side pads allow user to hand solder
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OT-25,
OT-23A-6
OT-23A-6
OT-25
IPC-600E,
IPC-600E
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Untitled
Abstract: No abstract text available
Text: CERLED Ceramic Chip SMD SMD - Wide-Viewing Angle CR 10 TE Photo Transistor Description The solder pads provide an excellent heat sink. For multi-sensors just choose 2 or more CERLEDs. Clear epoxy lens. Special Type CR10TE-DLF with daylight filter on request.
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CR10TE-DLF)
DTS1005
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Untitled
Abstract: No abstract text available
Text: CERLED Ceramic Chip SMD SMD - Wide-Viewing Angle CR 50 TE Photo Transistor Description The solder pads provide an excellent heat sink. For multi-sensors just choose 2 or more CERLEDs. Clear epoxy lens. Special Type CR50TE-DLF with daylight filter on request.
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CR50TE-DLF)
DTS1005
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Untitled
Abstract: No abstract text available
Text: D A T A S H E E T CERLED Ceramic Chip SMD SMD – Wide-Viewing Angle CR 50 TE Photo Transistor Description The solder pads provide an excellent heat sink. For multi-sensors just choose 2 or more CERLEDs. Clear epoxy lens. Special Type CR50TE-DLF with daylight
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CR50TE-DLF)
DTS1005
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DTS1005
Abstract: No abstract text available
Text: D A T A S H E E T CERLED Ceramic Chip SMD SMD – Wide-Viewing Angle CR 10 TE Photo Transistor Description The solder pads provide an excellent heat sink. For multi-sensors just choose 2 or more CERLEDs. Clear epoxy lens. Special Type CR10TE-DLF with daylight
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CR10TE-DLF)
DTS1005
DTS1005
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CR50TE-DLF
Abstract: DTS1005 transistor smd cr CR50TE
Text: D A T A S H E E T CERLED Ceramic Chip SMD SMD – Wide-Viewing Angle CR 50 TE Photo Transistor Description The solder pads provide an excellent heat sink. For multi-sensors just choose 2 or more CERLEDs. Clear epoxy lens. Special Type CR50TE-DLF with daylight
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CR50TE-DLF)
DTS1005
CR50TE-DLF
DTS1005
transistor smd cr
CR50TE
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la 4440 amplifier circuit diagram 300 watt
Abstract: la 4440 amplifier circuit diagram 300 watt diode LT 7229 2sd323 YM 7137 3D DA 3807 pdf transistor inverter welder 4 schematic 2N5630 THYRISTOR br 403 1N3492
Text: Alphanumeric Index Power Transistor Selector Guide Power Transistor Cross Reference Power Transistor Data Sheets Thyristor Selector Guide Thyristor Cross Reference Thyristor Data Sheets Leadforms, Hardware, and Mounting Techniques R ectifier and Zener Diode
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AN-784A
la 4440 amplifier circuit diagram 300 watt
la 4440 amplifier circuit diagram 300 watt
diode LT 7229
2sd323
YM 7137 3D
DA 3807 pdf transistor
inverter welder 4 schematic
2N5630
THYRISTOR br 403
1N3492
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V5592
Abstract: TOP-66 5598 transistor 8617 diode DIN 53505 marking code to3 diode marking J5P SOT TO-126 mounting V7387 8630F
Text: ASSMANN Die-cast-Heatsinks Electronic C om ponen ts Thermal Conductive Ceramic Pads Technical data Applications: Electro- and electronic-industry i. e. computers, TV sets, VTR, medical equipment, measuring instruments, motor car- and machineindustry, photovoltanie, aviation.
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