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    TQFP 6X6 TRAY Search Results

    TQFP 6X6 TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10067847-001TLF Amphenol Communications Solutions 10067847-001TLF-SD CARD TRAY PACKAGING Visit Amphenol Communications Solutions
    U77A11282001 Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A11282021 Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A61142001 Amphenol Communications Solutions SFP 1X6 CAGE NI TRAY Visit Amphenol Communications Solutions
    U77A11181D01 Amphenol Communications Solutions SFP CAGE 1X1 TIN TRAY D/C Visit Amphenol Communications Solutions

    TQFP 6X6 TRAY Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    peak tray qfn 6x6

    Abstract: tqfp 6X6 tray 6x6 TRAY tqfp
    Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o


    Original     		MLX81100 16-bit CPU90 30kbyte 100-kBaud 100Hz 100kHz 16-channel 10-bit peak tray qfn 6x6 tqfp 6X6 tray 6x6 TRAY tqfp PDF

    Full Bridge N-Channel FET driver IC

    Abstract: No abstract text available
    Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o


    Original     		MLX81100 16-bit CPU90 30kbyte 100-kBaud 100Hz 100kHz 16-channel 10-bit Full Bridge N-Channel FET driver IC PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    tray qfn 6x6

    Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
    Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA


    Original     		O-236AB OT-23) OT-23 O-220 O-252 OT-223 QFN00/Reel 490/Tray tray qfn 6x6 tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5 PDF

    AD5820

    Abstract: ad6548
    Text: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density


    Original     		T03762-0-1/13 AD5820 ad6548 PDF

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray PDF

    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


    Original     		S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon PDF

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Text: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight PDF

    emmc pcb layout

    Abstract: oled display 96x16 flashpro3 schematic silicon sculptor 3 actel smart fusion fpga JTAG Programmer Schematics microcontroller based temperature control fan avr M1A3PL-DEV-KIT A3PE3000L FG484 96x16
    Text: Product Catalog November 2009 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart from


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET MOS INTEGRATED CIRCUIT PD720114 ECOUSBTM Series USB 2.0 HUB CONTROLLER The μPD720114 is a USB 2.0 hub device that complies with the Universal Serial Bus USB Specification Revision 2.0 and works up to 480 Mbps. USB 2.0 compliant transceivers are integrated for upstream and all downstream ports.


    Original     		PD720114 PD720114 S17463E M8E0909E) PDF

    emmc pcb layout

    Abstract: oled display 96x16 fpga JTAG Programmer Schematics FLASHPRO4 A3PE1500-PQ208 ACTEL flashpro A2F200M3F-FGG484 96x16 oled A2F500 VQ100
    Text: Product Catalog March 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power FPGAs and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart


    Original     		PDF

    projected capacitive touch controller

    Abstract: mtouch sensor map MTCH6301 capacitive touch projected capacitive touch mutual touch and gestures control table top multitouch 4x4 matrix keypad dspic
    Text: MTCH6301 PROJECTED CAPACITIVE TOUCH CONTROLLER MTCH6301 Projected Capacitive Touch Controller Description Touch Features The MTCH6301 is a turnkey projected capacitive controller that allows easy integration of multi-touch and gestures to create a rich user interface in your design.


    Original     		MTCH6301 DS41663A-page projected capacitive touch controller mtouch sensor map capacitive touch projected capacitive touch mutual touch and gestures control table top multitouch 4x4 matrix keypad dspic PDF

    S17463E

    Abstract: uPD720114 PD720114 PD720114k9 uPD720114GA-9EU-A PD720114GA-YEU-A uPD720114K9-4E4-A PD72011 S17462EJ6V0DS00 VBUSM
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		M8E0909E) S17463E uPD720114 PD720114 PD720114k9 uPD720114GA-9EU-A PD720114GA-YEU-A uPD720114K9-4E4-A PD72011 S17462EJ6V0DS00 VBUSM PDF

    Untitled

    Abstract: No abstract text available
    Text: MTCH6301 MTCH6301 Projected Capacitive Touch Controller Description: Touch Features: MTCH6301 is a turnkey projected capacitive controller that allows easy integration of multi-touch and gestures to create a rich user interface in your design. Through a sophisticated combination of Self and Mutual


    Original     		MTCH6301 MTCH6301 Co60-4-227-8870 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package PDF

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST PDF

    LE79Q2281

    Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
    Text: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security


    Original     		PDF

    u18 202 sensor hall

    Abstract: DS33014 DS70605 three phase induction motor control schematics di schematic diagram inverter 24V to 3 PHASE bldc dsPICDEM MCHV DEVELOPMENT BOARD DS70316 4000w smps MC6024 u18 sensor hall
    Text: dsPICDEM MCHV Development System User’s Guide  2009 Microchip Technology Inc. DS70605A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.


    Original     		DS70605A DS70605A-page u18 202 sensor hall DS33014 DS70605 three phase induction motor control schematics di schematic diagram inverter 24V to 3 PHASE bldc dsPICDEM MCHV DEVELOPMENT BOARD DS70316 4000w smps MC6024 u18 sensor hall PDF

    R5F21347

    Abstract: R5F21256SDFP r5f64165 M30622F8PGP R5F64166 R5F2134A NEC 180NM CMOS r5f64169 R5F21348 R5F64189
    Text: M16C Family of Microcontrollers R8C • M16C • R32C 2008.9 TABLE OF CONTENTS Family Overview . . . . . . . . . . . 2 Top Reasons to Select M16C . . . . . . . . . . . . . . 4 On-chip Peripherals . . . . . . . 12 Highly Functional Timers . . .12 A/D Converter . . . . . . . . . . .12


    Original     		M16CTM 0908/10K/JP/PF/SP REU01B0032-0101 R5F21347 R5F21256SDFP r5f64165 M30622F8PGP R5F64166 R5F2134A NEC 180NM CMOS r5f64169 R5F21348 R5F64189 PDF

    manual FW82801BA motherboard

    Abstract: intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard
    Text: NOTE: PLEASE ADJUST SPINE TO PROPER WIDTH Europe Intel Corporation UK Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK Phone: England (44) 1793 403 000 France (33) 1 4694 7171 Germany (49) 89 99143 0 Italy (39) 02 575 441 Israel (972) 2 589 7111 Netherlands (31) 20 659 1800


    Original     		USA/2004/10K/MD/HP manual FW82801BA motherboard intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard PDF

    pic16f87a

    Abstract: DS39582 pic16f877a full instruction set pic16f877a manual PIC16F877A ARCHITECTURE PIC16F87A7 PIC16F876A programmer circuit diagram PIC16F877AP PIC16f873a example code to config spi PIC16F877a SAMPLE C pwm program
    Text: M PIC16F87XA Data Sheet 28/40-pin Enhanced FLASH Microcontrollers  2001 Microchip Technology Inc. Advance Information DS39582A Note the following details of the code protection feature on PICmicro MCUs. • • • • • • The PICmicro family meets the specifications contained in the Microchip Data Sheet.


    Original     		PIC16F87XA 28/40-pin DS39582A PIC16F877A-I/L PIC16F877AI/ML PIC16F877AI/P PIC16F877AI/PT PIC16F877AT44 pic16f87a DS39582 pic16f877a full instruction set pic16f877a manual PIC16F877A ARCHITECTURE PIC16F87A7 PIC16F876A programmer circuit diagram PIC16F877AP PIC16f873a example code to config spi PIC16F877a SAMPLE C pwm program PDF

    PIC18LF45K50

    Abstract: PIC18LF24K50
    Text: PIC18 L F2X/45K50 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with XLP Technology Universal Serial Bus Features: • USB V2.0 Compliant • Crystal-less Full Speed (12 Mb/s) and Low-Speed Operation (1.5 Mb/s) • Supports Control, Interrupt, Isochronous and Bulk


    Original     		PIC18 F2X/45K50 28/40/44-Pin, PIC18LF45K50 PIC18LF24K50 PDF

    diode byt 42m

    Abstract: DS30684 PIC18F25k50 autoshutdown timer pic18f45k50 pic18f24k50 PIC18 external interrupt example codes F24K50 Microchip mTouch Design Center PIC18 example codes SPI master
    Text: PIC18 L F2X/45K50 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with XLP Technology Universal Serial Bus Features: • USB V2.0 Compliant • Crystal-less Full Speed (12 Mb/s) and Low-Speed Operation (1.5 Mb/s) • Supports Control, Interrupt, Isochronous and Bulk


    Original     		PIC18 F2X/45K50 28/40/44-Pin, E-3-5778-366 DS30684A-page diode byt 42m DS30684 PIC18F25k50 autoshutdown timer pic18f45k50 pic18f24k50 PIC18 external interrupt example codes F24K50 Microchip mTouch Design Center PIC18 example codes SPI master PDF

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A PDF