tqfp 44 thermal resistance
Abstract: tqfp 64 thermal resistance CPGA MQUAD PQFP-128 TQFP 132 PACKAGE Package 48 LCC CQFP 240
Text: Thermal Resistance of Packages 4401035 NC Thermal Resistance of Packages Similarly, thermal resistance from junction to case is denoted by θ JC , and defined by θ JC = T j – T c ⁄ P d ; here, T c is the case temperature (˚C) at the external surface of the package.
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BC 1098
Abstract: EPM7384 ALTERA 68 PLCC t187
Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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232-pin
240-pin
100-pin
256-pin
484-pin
672-pin
BC 1098
EPM7384
ALTERA 68 PLCC
t187
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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texas instruments packing label
Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
Text: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make
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7150M
CDC582
CDC586
CDC2582
CDC2586
SN250056
SN74ACT2235-XX
SN74ACT7807-XX
SN74ACT7808-XX
SN10067
texas instruments packing label
SPAD
Eftec 64t
PZT144
CDC582
TEXAS INSTRUMENTS, Mold Compound
EN-4085S2K3
eftec 45
EN-4085S2
eftec+64
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LFXP2-8E
Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.
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64-ball
144-ball
LFXP2-8E
LFXP2-40E
LFXP2-5E
LFXP20C
theta jc FCBGA
LFXP2-17E
LFE3-17
Theta JB
LFXP15C
LFXP2-8E 132
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100 PIN "PGA" ALTERA DIMENSION
Abstract: No abstract text available
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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altera ep610
Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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PCMCIA Design
Abstract: TQFP 132 PACKAGE SN74ACT3641 tqfp 64 thermal resistance
Text: FIFO Surface-Mount Packages for PCMCIA Applications Tom Jackson Advanced System Logic – Semiconductor Group SDMA001A 69 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information
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SDMA001A
36-bit
PCMCIA Design
TQFP 132 PACKAGE
SN74ACT3641
tqfp 64 thermal resistance
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TQFP 132 PACKAGE
Abstract: PCMCIA CARD, Static Memory, dual battery TQFP-120 SN74ACT3641
Text: FIFO Surface-Mount Packages for PCMCIA Applications Tom Jackson Advanced System Logic – Semiconductor Group SDMA001A 69 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information
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SDMA001A
TQFP 132 PACKAGE
PCMCIA CARD, Static Memory, dual battery
TQFP-120
SN74ACT3641
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tqfp 44 thermal resistance datasheet
Abstract: plcc junction to ambient resistance EPAD-TQFP-64 tqfp 64 thermal resistance
Text: THERMAL MANAGEMENT Semiconductor devices dissipate heat while operating. Device junction temperature is a function of : 1 the amount of power dissipated in the circuit, and (2) the net thermal resistance between the heat source and a reference point such as the surrounding ambient of still air. It has been well
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tqfp 44 thermal resistance datasheet
plcc junction to ambient resistance
EPAD-TQFP-64
tqfp 64 thermal resistance
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CX870
Abstract: PIC16F1825 SST38VF os8108
Text: Focus Product Selector Guide Focus Product Selector Guide Microcontrollers • Digital Signal Controllers • Analog • Memory • Wireless www.microchip.com Microchip: A Partner in Your Success Microchip is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system
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DS01308J
CX870
PIC16F1825
SST38VF
os8108
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ATSAMD21G18
Abstract: No abstract text available
Text: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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48MHz
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TQFP 100 pin ic
Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Text: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink
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MS-026
TQFP 100 pin ic
tqfp 7x7 1.4 tray
tqfp 7x7 tray
MS-026
JEDEC tray standard 17 x 17
tqfp 64 thermal resistance
MS-026 TQFP
TQFP Package 44 lead
tqfp 32 thermal resistance
CO-124
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ATMEL Tape and Reel drawing
Abstract: ATMEL Tape and Reel code JEDEC Drawing MO-220 qfn48 Atmel Moisture sensitivity level Moisture/ATMEL Tape and Reel QFN-64 ATSAMD21G18
Text: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and
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48MHz
ATMEL Tape and Reel drawing
ATMEL Tape and Reel code
JEDEC Drawing MO-220 qfn48
Atmel Moisture sensitivity level
Moisture/ATMEL Tape and Reel QFN-64
ATSAMD21G18
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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Pic18f24k22
Abstract: PIC18F26K22 pic18f25k22 zg2100mc 40 pin PIC18F46K22 PIC18F45K22 PIC18F46K22 pic18f23k22 PIC16F1823 PWM c programming PIC18F1330
Text: Corporate Focus Product Selector Guide 2nd Quarter 2010 Focus Product Selector Guide Featuring: 8-, 16- and 32-bit PIC Microcontrollers dsPIC® Digital Signal Controllers Analog & Interface Products Serial EEPROMs, Serial SRAMs and RF Products www.microchip.com
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DS01308B
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Pic18f24k22
PIC18F26K22
pic18f25k22
zg2100mc
40 pin PIC18F46K22
PIC18F45K22
PIC18F46K22
pic18f23k22
PIC16F1823 PWM c programming
PIC18F1330
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PIC16F1787
Abstract: ar1020 PIC18F25K80 PIC16F17 PIC16F1786 PIC16F1509 PIC18 lcd 39vf020 PIC16F1503 PIC16F1782
Text: Corporate Focus Product Selector Guide First Half 2011 Focus Product Selector Guide Featuring: 8-, 16- and 32-bit PIC Microcontrollers dsPIC®Digital Signal Controllers Analog & Interface Products Serial EEPROMs, Serial SRAMs, NOR Flash Memory Wireless and RF Products
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DS01308E
DS01308E*
PIC16F1787
ar1020
PIC18F25K80
PIC16F17
PIC16F1786
PIC16F1509
PIC18 lcd
39vf020
PIC16F1503
PIC16F1782
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39SF020A
Abstract: 25VF032B 25vf064 PIC10F320 25vf016B SST12CP11 PIC18f45k22 PIC18F25K80 25vf064c MTS2916A
Text: Corporate Focus Product Selector Guide Fourth Quarter 2010 Focus Product Selector Guide Featuring: 8-, 16- and 32-bit PIC Microcontrollers dsPIC® Digital Signal Controllers Analog & Interface Products Serial EEPROMs, Serial SRAMs, SST NOR Flash Memory Wireless and RF Products
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hig-8870
DS01308D
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39SF020A
25VF032B
25vf064
PIC10F320
25vf016B
SST12CP11
PIC18f45k22
PIC18F25K80
25vf064c
MTS2916A
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ATSAMD21G18
Abstract: No abstract text available
Text: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The
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ATSAMd21g18
Abstract: JEDEC Drawing MO-220 qfn48
Text: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The
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48MHz
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4572 IC 8PIN
Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines
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503-Pin
4572 IC 8PIN
epx780
TQFP 144 PACKAGE DIMENSION
ALTERA EP610
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