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    TQ160 Search Results

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    TQ160 Price and Stock

    Littelfuse Inc IXTQ160N10T

    MOSFET N-CH 100V 160A TO3P
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    DigiKey IXTQ160N10T Tube 300
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    Newark IXTQ160N10T Bulk 300
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    IXYS Corporation IXTQ160N085T

    MOSFET N-CH 85V 160A TO3P
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    DigiKey IXTQ160N085T Tube
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    IXYS Corporation IXTQ160N075T

    MOSFET N-CH 75V 160A TO3P
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    DigiKey IXTQ160N075T Tube
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    Anytek Technology Corporation Ltd TQ1601000000G

    TERM BLOCK 16POS 45DEG 5MM PCB
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    DigiKey TQ1601000000G Bulk 2,016
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    Onlinecomponents.com TQ1601000000G
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    Interstate Connecting Components TQ1601000000G
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    Samtec Inc MTMM-113-02-T-Q-160

    VARIABLE POST HEIGHT HEADER STRI
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    DigiKey MTMM-113-02-T-Q-160 Bulk 1
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    Avnet Americas MTMM-113-02-T-Q-160 Bulk 1
    • 1 $3.5476
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    Mouser Electronics MTMM-113-02-T-Q-160
    • 1 $3.62
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    • 100 $2.65
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    Powell Electronics MTMM-113-02-T-Q-160 117 1
    • 1 $4.42
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    Master Electronics MTMM-113-02-T-Q-160
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    • 10 $3.71
    • 100 $3.11
    • 1000 $2.22
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    TQ160 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TQ1601000000G Amphenol Anytek Connectors, Interconnects - Terminal Blocks - Wire to Board - TERM BLOCK 16POS 45DEG 5MM PCB Original PDF
    TQ160 Package Xilinx Tqfp (tq160) Package Original PDF

    TQ160 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    QF32

    Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176
    Text: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)


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    TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176 PDF

    Untitled

    Abstract: No abstract text available
    Text: R TQFP TQ160 Package PK011 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.


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    TQ160) PK011 PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    1156-BALL

    Abstract: bga 896 411PI BF957 132-ball package
    Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns


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    Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    interfacing cpld xc9572 with keyboard

    Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
    Text: The Programmable Logic Data Book 2000 R R , XC2064, NeoCAD PRISM, XILINX Block Letters , XC-DS501, NeoROUTE, XC3090, FPGA Architect, XC4005, FPGA Foundry, XC5210, Timing Wizard, NeoCAD, TRACE, NeoCAD EPIC, XACT are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC, Configurable Logic Cell, CoolRunner, Dual Block, EZTag, Fast CLK, FastCONNECT,


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    XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100 PDF

    bt 1696

    Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
    Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are


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    PDF

    JEDS51-2

    Abstract: xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
    Text: Application Note: Packaging R Packaging Thermal Management XAPP415 v1.0 December 19, 2001 Thermal Management Modern high-speed logic devices consume appreciable amount of electrical energy. This energy invariably turns into heat. Higher device integration drives technologies to produce


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    XAPP415 JEDS51-2 xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680 PDF

    TQ18W-35P

    Abstract: dc pancake motor TQ25W-4P TQ64W-5PC TQ40W data book transistors 2SA TQ34 TQ10Y-10PV 0840 057 TQ18
    Text: LIMITED ANGLE TORQUE MOTORS AND TACHOMETERS Introduction Limited Angle Brushless Motor Description Limited angle brushless motors are single-phase machines which produce torque over a limited angle without the need for commutation. With a constant current, the torque will follow one of the curves


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    PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


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    FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


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    FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


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    UG112 UG072, UG075, XAPP427, BFG95 PDF

    MC19

    Abstract: XCR3320 f32578 vhdl code up down counter
    Text: APPLICATION NOTE This product has been discontinued. Please see www.xilinx.com/partinfo/notify/pdn0007.htm for details. XCR3320: 320 Macrocell SRAM CPLD R DS033 v1.3 October 9, 2000 0* Features • • • • • • • • • • • • • • •


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    com/partinfo/notify/pdn0007 XCR3320: DS033 TQ160: 160-pin BG256: 256-ball XCR3320 TQ160 BG256 MC19 XCR3320 f32578 vhdl code up down counter PDF