TQ160 Search Results
TQ160 Price and Stock
Littelfuse Inc IXTQ160N10TMOSFET N-CH 100V 160A TO3P |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IXTQ160N10T | Tube | 300 |
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IXTQ160N10T | Bulk | 300 |
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IXYS Corporation IXTQ160N085TMOSFET N-CH 85V 160A TO3P |
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IXTQ160N085T | Tube |
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IXYS Corporation IXTQ160N075TMOSFET N-CH 75V 160A TO3P |
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IXTQ160N075T | Tube |
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Anytek Technology Corporation Ltd TQ1601000000GTERM BLOCK 16POS 45DEG 5MM PCB |
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TQ1601000000G | Bulk | 2,016 |
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TQ1601000000G |
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TQ1601000000G |
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Samtec Inc MTMM-113-02-T-Q-160VARIABLE POST HEIGHT HEADER STRI |
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MTMM-113-02-T-Q-160 | Bulk | 1 |
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MTMM-113-02-T-Q-160 | Bulk | 1 |
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MTMM-113-02-T-Q-160 |
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MTMM-113-02-T-Q-160 | 117 | 1 |
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MTMM-113-02-T-Q-160 |
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TQ160 Datasheets (2)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
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TQ1601000000G | Amphenol Anytek | Connectors, Interconnects - Terminal Blocks - Wire to Board - TERM BLOCK 16POS 45DEG 5MM PCB | Original | |||
TQ160 Package | Xilinx | Tqfp (tq160) Package | Original |
TQ160 Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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QF32
Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176
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Original |
TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176 | |
Untitled
Abstract: No abstract text available
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Original |
TQ160) PK011 | |
qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
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UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga | |
1156-BALL
Abstract: bga 896 411PI BF957 132-ball package
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Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package | |
xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
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UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G | |
xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
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UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance | |
interfacing cpld xc9572 with keyboard
Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
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XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100 | |
bt 1696
Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
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JEDS51-2
Abstract: xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
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XAPP415 JEDS51-2 xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680 | |
TQ18W-35P
Abstract: dc pancake motor TQ25W-4P TQ64W-5PC TQ40W data book transistors 2SA TQ34 TQ10Y-10PV 0840 057 TQ18
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
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FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 | |
schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
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FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 | |
XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
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Original |
UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 | |
BFG95
Abstract: No abstract text available
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Original |
UG112 UG072, UG075, XAPP427, BFG95 | |
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MC19
Abstract: XCR3320 f32578 vhdl code up down counter
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Original |
com/partinfo/notify/pdn0007 XCR3320: DS033 TQ160: 160-pin BG256: 256-ball XCR3320 TQ160 BG256 MC19 XCR3320 f32578 vhdl code up down counter |