X009
Abstract: MGAB A10 fbnl MGAB
Text: TEMx28 Device 21/28 Channel Dual Bus High Density Mapper TXC-04222 DESCRIPTION • Add/drop up to 28 E1, DS1, or VT/TU payloads from two add and two drop STM-1/VC4, STS-3 buses • Add bus and drop bus timing modes • Cross mapping applications DS1 mapped to/from
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TEMx28
TXC-04222
VT2/TU-12s)
TXC-04222-MB
X009
MGAB A10
fbnl
MGAB
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TPI2220MH270Auto
Abstract: TPI2220MH270 TPI2220MH240Auto TPI-0805 tpi22 TPI2220
Text: Multilayer Ceramic SMD Varistor TPI Surface Mount MH-Auto Series Working Voltage MAX TPI Model Number Breakdown Voltage Peak Current (MAX) Clamping Voltage (MAX) Typical Capacitance ※ AC (VRMS) DC (V) 1mA (V) 8/20µ s (A) (A) (V) 1KHz (pF) TPI0805MH240Auto
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TPI0805MH240Auto
TPI0805MH270Auto
TPI0805MH470Auto
TPI1206MH240Auto
TPI1206MH270Auto
TPI1206MH470Auto
TPI1210MH240Auto
TPI1210MH270Autow
TPI2220MH270Auto
TPI2220MH270
TPI2220MH240Auto
TPI-0805
tpi22
TPI2220
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TPI2220ML390C
Abstract: TPI2220 27 21 121 8000 tpi22 TPI2220ML220C
Text: Multilayer Ceramic SMD Varistor TPI 2220 Surface Mount ML-C Series Working Voltage MAX Breakdown Voltage Peak Clamping Energy Typical Current Voltage Absorption Capacitance ※ (MAX) (MAX) (MAX) AC (VRMS) DC (V) 1mA (V) 8/20µ s (A) (A) (V) 10/1000µ s (J)
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TPI2220ML180C
TPI2220ML220C
TPI2220ML240C
TPI2220ML270C
TPI2220ML330C
TPI2220ML390C
TPI2220ML470C
TPI2220ML560C
TPI2220ML680C
TPI2220ML820C
TPI2220ML390C
TPI2220
27 21 121 8000
tpi22
TPI2220ML220C
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tpi22
Abstract: No abstract text available
Text: TEMx28 Device 28 Channel Dual Bus High Density Mapper TXC-04222 DATA SHEET PRODUCT PREVIEW • Add/drop up to 28 E1, DS1, or VT/TU payloads from two add and two drop STM-1/VC4, STS-3 buses • Add bus and drop bus timing modes • Cross mapping applications DS1 mapped to/from
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TEMx28
TXC-04222
VT2/TU-12s)
TXC-04222-MB
tpi22
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TPI15
Abstract: tpi22 929 rev oh S29 ba3302 me520B RCO22 RCO20 TXC-04222AIOG RPO14 ba7307
Text: TEMx28 Device 21/28 Channel Dual Bus High Density Mapper TXC-04222 DESCRIPTION • Add/drop up to 28 E1, DS1, or VT/TU payloads from two add and two drop STM-1/VC4, STS-3 buses • Add bus and drop bus timing modes • Cross mapping applications DS1 mapped to/from
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Original
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PDF
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TEMx28
TXC-04222
VT2/TU-12s)
TPI15
tpi22
929 rev oh S29
ba3302
me520B
RCO22
RCO20
TXC-04222AIOG
RPO14
ba7307
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hp2 800 232
Abstract: E1 HDB3 99279 TPI28 TCI26 TPI14
Text: TEMx28 Device 28 Channel Dual Bus High Density Mapper TXC-04222 FEATURES DESCRIPTION • Add/drop up to 28 E1, DS1, or VT/TU payloads from two add and two drop STM-1/VC4, STS-3 buses • Add bus and drop bus timing modes • Cross mapping applications DS1 mapped to/from
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TEMx28
TXC-04222
VT2/TU-12s)
TXC-04222-MB,
hp2 800 232
E1 HDB3
99279
TPI28
TCI26
TPI14
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t25f1
Abstract: TPI44 TNI12
Text: E1Mx16 Device E1 Mapper 16-Channel TXC-04216 DESCRIPTION • Add/drop sixteen 2.048 Mbit/s signals from an STM-1 VC-4/AU-3, STS-3, or an STS-1 • Independent add and drop bus timing modes • Selectable HDB3 positive/negative rail or NRZ E1 interface. Performance counter provided for illegal
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E1Mx16
16-Channel
TXC-04216
16-byte
t25f1
TPI44
TNI12
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TPI20
Abstract: TXC-03114 TPI13
Text: TEMx28 Device 28 Channel Dual Bus High Density Mapper TXC-04222 DATA SHEET • Add/drop up to 28 E1, DS1, or VT/TU payloads from two add and two drop STM-1/VC4, STS-3 buses • Add bus and drop bus timing modes • Cross mapping applications DS1 mapped to/from
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PDF
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TEMx28
TXC-04222
VT2/TU-12s)
TXC-04222-MB
TPI20
TXC-03114
TPI13
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