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    TO220 SEMICONDUCTOR PACKAGING Search Results

    TO220 SEMICONDUCTOR PACKAGING Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPHR7404PU Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    TO220 SEMICONDUCTOR PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Nitto MP8000

    Abstract: Nitto ON SEMICONDUCTOR TRACEABILITY MP180S mp8000 MP-8000 TO220 Semiconductor Packaging DS1821 package to220 PHILIP
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: January 18, 1999 Subject: PRODUCT CHANGE NOTICE – A001801 Description: Qualification of MP8000 for TO220


    Original     		PDF A001801 MP8000 MP180S MP8000. DS1633 DS1821 Nitto MP8000 Nitto ON SEMICONDUCTOR TRACEABILITY MP-8000 TO220 Semiconductor Packaging DS1821 package to220 PHILIP

    SF8A300

    Abstract: SDB20D45
    Text: SF8A300H Semiconductor Ultrafast Recovery Rectifier ULTRAFAST RECOVERY POWER RECTIFIER Description The SF8A300H is a silicon rectifier in a 2-Lead TO220 full-pack type package designed, and is specially suited for switching mode base drive and transistor circuit. This device is intended for use in low voltage,


    Original     		PDF SF8A300H SF8A300H O-220F-2L KSD-D0Q031-000 SF8A300 SDB20D45

    "ultra low forward voltage" TO220

    Abstract: No abstract text available
    Text: SF8A200H Semiconductor Ultrafast Recovery Rectifier ULTRAFAST RECOVERY POWER RECTIFIER Description The SF8A200H is a silicon rectifier in a 2-Lead TO220 full-pack type package designed, and is specially suited for switching mode base drive and transistor circuit. This device is intended for use in low voltage,


    Original     		PDF SF8A200H SF8A200H O-220F-2L KSD-D0Q030-000 "ultra low forward voltage" TO220

    217-36CTT6

    Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 217-36CTT6 ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5

    ebonol

    Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20 ebonol 637-10ABEP MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF WTS001 p1-25 O-220, OT-223, SOL-20

    ebonol

    Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB

    ebonol

    Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 ebonol abe sot-223 217-36CTRE6 217-36CT6 MO-169

    ebonol

    Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb

    ebonol

    Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,


    Original     		PDF O-220, OT-223, SOL-20 ebonol 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm

    N10015

    Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
    Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 292-AB 292-AB N10015 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01

    corrugated box spec

    Abstract: TO220 Semiconductor Packaging FDP7060 NDP4060L CBVK741B019 EO70 corrugated packaging F9852
    Text: TO-220 Tube Packing Data TO-220 Tube Packing Configuration: Figure 1.0 Packaging Description: TO-220 parts are shipped normally in tube. The tube is made of PVC plastic treated with anti-static agent.These tubes in standard option are placed inside a dissipative


    Original     		PDF O-220 530mm 130mm 114mm 102mm F9852 NDP4060L corrugated box spec TO220 Semiconductor Packaging FDP7060 NDP4060L CBVK741B019 EO70 corrugated packaging F9852

    TO220 Semiconductor Packaging

    Abstract: CBVK741B019 EO70 FDP7060 NDP4060L D9842 corrugated box spec bubble sheet 9852
    Text: TO-220 Tube Packing Data TO-220 Tube Packing Configuration: Figur e 1.0 Packaging Description: TO-220 parts are ship ped normally in tube. The tube is made of PVC plastic treated with anti -stati c agent.These tubes in standard option are placed inside a dissipative


    Original     		PDF O-220 114mm 102mm NDP4060L TO220 Semiconductor Packaging CBVK741B019 EO70 FDP7060 NDP4060L D9842 corrugated box spec bubble sheet 9852

    D2PAK1

    Abstract: No abstract text available
    Text: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip manufacturing process and the methods available for Flip Chip assembly.


    Original     		PDF MS-026 MO-108 D2PAK1

    TO-220 3 lead bend

    Abstract: TO220 Semiconductor Packaging 324 14pin 5-lead sot 326 326 SOT 326 sot223
    Text: Micrel Semiconductor Designing With LDO Regulators Section 6. Package Information Packaging for Automatic Handling . 322 Tape & Reel . 322


    Original     		PDF O-263 O-263 O-247 TO-220 3 lead bend TO220 Semiconductor Packaging 324 14pin 5-lead sot 326 326 SOT 326 sot223

    6n60

    Abstract: 6n60 data 6n60 equivalent imsys TO220 Semiconductor Packaging 6N60 datasheet 7103 transistor 6n60 6N-60
    Text: TO-220-3L Tube Packing Data TO-220 Tube Packing Configuration: Figure 1.0 Packaging Description: 50 units per Tube TO-220 parts are shipped normally in tube. The tube is made of PVC plastic treated with anti-static agent.These tubes in standard option are placed inside a dissipative


    Original     		PDF O-220-3L O-220 237mm 167mm 200cap) 525mm 360mm 265mm 6n60 6n60 data 6n60 equivalent imsys TO220 Semiconductor Packaging 6N60 datasheet 7103 transistor 6n60 6N-60

    ts 4141 TRANSISTOR

    Abstract: transistor AMm TO-220 packing methods
    Text: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-220 3 leads Thru-hole Plastic Package Package Outline, Tube Packing, Packaging and Handling Information Continental Device India Limited Data Sheet Page 1 of 5


    Original     		PDF O-220 O-220 C-120 ts 4141 TRANSISTOR transistor AMm TO-220 packing methods

    Untitled

    Abstract: No abstract text available
    Text: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-220 3 leads Thru-hole Plastic Package Package Outline, Tube Packing, Packaging and Handling Information Continental Device India Limited Data Sheet Page 1 of 5


    Original     		PDF O-220 O-220 C-120

    lm2576 current mode

    Abstract: lm2576hvt adj p LM2576 LM2576HVS-ADJ SIMPLE SWITCHER negative Voltage Regulator LM2576HVT-ADJ LM2576hvs-adj p LM2576 APPLICATION LM2576HVSX-12 Alternate Part or Supplier
    Text: LM2576HV - SIMPLE SWITCHER 3A Step-Down Voltage Regulator Page 1 of 2 Sign-On HOME My National Private Sites English LM2576HV - SIMPLE SWITCHER® 3A Step-Down Voltage Regulator Datasheet Packaging Samples & Pricing Reliability Features Knowledge Base WEBENCH Live Simulation!


    Original     		PDF LM2576HV AN-1061: AN-1061 1-Oct-02 27-Oct-2009] ISO/TS16949 com/mpf/LM/LM2576HV lm2576 current mode lm2576hvt adj p LM2576 LM2576HVS-ADJ SIMPLE SWITCHER negative Voltage Regulator LM2576HVT-ADJ LM2576hvs-adj p LM2576 APPLICATION LM2576HVSX-12 Alternate Part or Supplier

    Untitled

    Abstract: No abstract text available
    Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'


    Original     		PDF O-220, OT-223, SOL-20 217-36CTR6 1-866-9-OHMITE 217-36CTT6 O-263 MO-169

    Untitled

    Abstract: No abstract text available
    Text: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-220AC 2 Lead Leaded Plastic Package Package Outline, Packing Tube, Packaging and Handling Information TO220AC_Pkg_Drawing Rev271005 Continental Device India Limited


    Original     		PDF O-220AC O220AC Rev271005 O-220AC C-120

    ST L1117

    Abstract: ST MICROELECTRONICS L1117 33 LM7905 TO-92 ENE CP2211 CP2211 TL496 equivalent cp2206 MC34153 L7805 SOT 89 transistor L7905
    Text: Technology for Innovators TM Standard Linear Products Cross-Reference Including Amplifiers, Comparators, Timers, Peripheral Drivers, Power Management Controllers, References, Regulators, Supervisors, Shunts, Transmitters and Receivers INTERFACE COMPARATORS


    Original     		PDF A011905 ST L1117 ST MICROELECTRONICS L1117 33 LM7905 TO-92 ENE CP2211 CP2211 TL496 equivalent cp2206 MC34153 L7805 SOT 89 transistor L7905

    Untitled

    Abstract: No abstract text available
    Text: FCI Semiconductor Advanced Data Sheet TTB SERIES 100 to 230 Volt "TransTector" Bi-Directional Surge Protector _ ». Description Mechanical Dimensions TTB SERIES For Package Designation Use suffix as described below TO220 Suffix = T D 015 Suffix = D SMB Suffix = S


    OCR Scan     		PDF TTB130 TTB130S 200mA)

    4 PIN TO 220 IC

    Abstract: dp 502 t
    Text: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip m anufacturing process and the m ethods available for Flip Chip assembly.


    OCR Scan     		PDF