JESD51
Abstract: JEDEC51-12 JESD51-12 JESD51-1 JESD51-7 JESD51-4 JESD-51 APP4083 JESD51-8 JEDEC JESD51-8
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS Keywords: Thermal, Theta-ja, Theta-jc, heat, Theta-jb, Psi-jb Jul 16, 2007 APPLICATION NOTE 4083 Thermal Characterization of IC Packages Abstract: Thermal characterization of packages is critical for the performance and reliability of IC applications.
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com/an4083
AN4083,
APP4083,
Appnote4083,
JESD51
JEDEC51-12
JESD51-12
JESD51-1
JESD51-7
JESD51-4
JESD-51
APP4083
JESD51-8
JEDEC JESD51-8
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qml-38535
Abstract: OM117NT OM117ANT 7703404UA
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED P Add case outline M. Technical changes and corrections to table I. Editorial changes throughout. 93-10-02 M. A. FRYE R Add class V level devices. Update boilerplate. - ro 99-06-08 R. MONNIN T Add case outline N. Make changes to 1.2.4, PD, theta JC, IMAX as specified in
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U3158
Abstract: SDP1172MD OM1321NHM 7703401za 7703407UA qml-38535 IP137AHVE 7703405UA 77034012A 7703407XA
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED P Add case outline M. Technical changes and corrections to table I. Editorial changes throughout. 93-10-02 M. A. FRYE R Add class V level devices. Update boilerplate. - ro 99-06-08 R. MONNIN T Add case outline N. Make changes to 1.2.4, PD, theta JC, IMAX as specified in
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U3158
LE174JB
U3158
SDP1172MD
OM1321NHM
7703401za
7703407UA
qml-38535
IP137AHVE
7703405UA
77034012A
7703407XA
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Theta-J
Abstract: SP232 SP332 SP336 sipex SP322 SP332ET SP334 SP522CA Theta JB
Text: SP322 FAQ Solved by TM Sipex Part: SP322 Date: Jul 24-07 Question: The online data sheet for SP332 does not mention if it’s fail-safe SP522CA is for the receivers. Is it fail-safe? Answer: The SP332 does have failsafe but works best for open line situations without termination.
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SP322
SP322
SP332
SP522CA
SP522CA)
SP522CA
SP332?
indi32
RS-232
Theta-J
SP232
SP336
sipex
SP332ET
SP334
Theta JB
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077,
JESD78,
Sumitomo G700K
sumitomo 6600h
Compound c7025
JESD22-B101
Nitto MP8000
G700K
SUMITOMO-G600
epoxy 8290
ablebond ablestik 8290
SUMITOMO g600 UL
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G30-88
Abstract: Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 G38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance
Text: Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square
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2500AN
7304LC
G38-87
115x102
RXMN60
RBDT20
G30-88
Theta JB
QFP PACKAGE thermal resistance die down
JC15-1
G-38-87
Theta-J
32 QFP PACKAGE thermal resistance
2500AN
QFP PACKAGE thermal resistance
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ABLEBOND
Abstract: No abstract text available
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086L,
JESD78,
ABLEBOND
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077L,
JESD78,
G700K
Nitto MP8000
Sumitomo G600
Sumitomo G700K
JESD78
sumitomo 6600h
Compound c7025
JESD-78
BCB4026
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1292 BGA
Abstract: amkor flip flip chip bga 0,8 mm FOOTPRINTS USE BY AMKOR Flip Chip Substrate X3941 amkor
Text: LAMINATE data sheet Super FC Features: Super FC® Packages: Amkor’s SuperFC® is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the
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kds9
Abstract: kyocera 48 lead ceramic LCC package stk 0035 n PL0181 stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97
Text: Simtek Corporation Product Packaging Data This document is intended to provide Simtek customers with key information as outlined below for package types used for Simtek nvSRAM products. For additional information contact Simtek at appseng@simtek.com. For RoHS Materials
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Outlin420
5x10-8
75psig
PL0181
kds9
kyocera 48 lead ceramic LCC package
stk 0035 n
stk 014
IDK28F1
ntk 32 lcc package
14CA8
sk9173
JESD97
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086,
JESD78,
Nitto MP8000
Sumitomo G700K
g700k
JESD78
JESD-78
sumitomo 6600h
ablebond ablestik
BCB4026
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Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1094L,
JESD78,
Sumitomo G700K
SUMITOMO g600
Ablestik 84-1
sumitomo 6600h
G700K
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Theta JB
Abstract: JC15-1 G30-88 G38-87
Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC
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2500AN
7304LC
G38-87
115x102
RXMN60
RBDT20
Theta JB
JC15-1
G30-88
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FP4451
Abstract: Theta JB hysol adhesive JC15-1 698-100AB DCDA37480-M014-001 G38-87 R1004 304-TBGA Aavid Thermalloy cold plate
Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 7/10/1998 Revised 7/31/98 Package: 480 37.5x37.5 mm TBGA 29 x 29 Array Case: 1152-01 Frame: ASAT Drawing Nbr. E04480002-0-50 DCDA37480-M014-001
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E04480002-0-50
DCDA37480-M014-001)
R1004
FP4451
G38-87
21426-ICB
35x35
FP4451
Theta JB
hysol adhesive
JC15-1
698-100AB
DCDA37480-M014-001
R1004
304-TBGA
Aavid Thermalloy cold plate
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sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com
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DS1685,
LMISR4
J-STD20A
J-STD-20A
ablebond
copper bond wire
copper bond wire amkor
ti 9841
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Theta-JC QFP die down
Abstract: G30-88 Theta-J G38-87 Theta JB
Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC
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2500AN
7304LC
G38-87
115x102
Theta-JC QFP die down
G30-88
Theta-J
Theta JB
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PHD64
Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
Text: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle
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100MHz
PHD64
land pattern for vsop 8 pins
land pattern for vsop
DCA56
PFC80
PZT10
DED28
DFD64
DAP38
PWD14
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Untitled
Abstract: No abstract text available
Text: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 3.3Vdc and 2.5Vdc, clock square wave
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QT481
QT488
768kHz
EAR99
768kHz
000gto
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mb86297
Abstract: MB86276 MB86294 MB86296 Coral PA MB86297 datasheet MB86292 mb86291a scarlet MB86290A MB86293
Text: Application Note Power consumption Overview of Graphic Controllers MB8629x Fujitsu Microelectronics Europe GmbH History 18-02-05 02-02-05 30.10.2007 MMi MM AvT V1.0 V1.1 V1.2 First version Thermal resistor values added Thermal resistor values added for Lime
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MB8629x
125degC)
85degC)
MB86290A
MB86291A
MB86292
MB86293
MB86294
MB86295
MB86296
mb86297
MB86276
MB86294
MB86296 Coral PA
MB86297 datasheet
MB86292
mb86291a
scarlet
MB86290A
MB86293
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32.768khz 5ppm
Abstract: QT481 QT88L EAR99 QT492 QT488
Text: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 3.3Vdc and 2.5Vdc, clock square wave
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QT481
QT488
768kHz
EAR99
768kHz
QT488
32.768khz 5ppm
QT88L
EAR99
QT492
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Untitled
Abstract: No abstract text available
Text: QT93W and QT93P SERIES Q-TECH CORPORATION HIGH-RELIABILITY LVPECL OR LVDS MINIATURE CLOCK OSCILLATORS 2.5 to 3.3Vdc - 40MHz to 300MHz Description Q-Tech’s surface-mount QT93 series oscillators consist of a 2.5Vdc and 3.3Vdc differential PECL or LVDS output
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QT93W
QT93P
40MHz
300MHz
EAR99
M17677
QT93W
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QML-38535
Abstract: GDIP1-T16 LM2990-12
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED 99-09-07 R. MONNIN Add case outline X for CAGE code 27014. Make changes to 1.2.4, theta JA, theta JC, as specified in 1.3, and figure 1. - ro REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A A OF SHEETS
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7703406UA
Abstract: qml-38535 7703405XA ip117ahvh 7703402UA MARKING CODE 21L SMD 7703405UA LM117HV LM137 LT117A
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED P Add case outline M. Technical changes and corrections to table 1. Editorial changes throughout. 93-10-02 M. A. FRYE R Add class V level devices. Update boilerplate. - ro 99-06-08 R. MONNIN T Add case outline N. Make changes to 1.2.4, P □, theta JC, Im a x as specified in
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