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    THERMAL GAP PAD Search Results

    THERMAL GAP PAD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    THERMAL GAP PAD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    D149

    Abstract: D150 D2240 D257 D412 E595 IPC-TM650
    Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These


    Original     		PDF A13512-00 T-FLEX600-0707 D149 D150 D2240 D257 D412 E595 IPC-TM650

    D149

    Abstract: D150 D2240 D257 D412 E595
    Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These


    Original     		PDF

    D2240

    Abstract: D257 E595
    Text: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component


    Original     		PDF A15955-00 D2240 D257 E595

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad VO Ultimate Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material Features and Benefits • Thermal conductivity: 1.3 W/m-K • Ultra conformability • Gel-like modulus TYPICAL PROPERTIES OF GAP PAD VO ULTIMATE PROPERTY


    Original     		PDF E1269

    D149

    Abstract: D150 D2240 D257 D374 D575 D792 2500S20-0 2500S20 KPA25
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


    Original     		PDF 2500S20 E1269 2500S20 D149 D150 D2240 D257 D374 D575 D792 2500S20-0 KPA25

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


    Original     		PDF 2500S20 E1269 D2240 2500S20

    bergquist

    Abstract: 2500S2
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


    Original     		PDF 2500S20 2500S20 bergquist 2500S2

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


    Original     		PDF 2500S20 E1269 D2240 2500S20

    C351

    Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures


    Original     		PDF 2000S40 C351 D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very


    Original     		PDF 2000S40 2000S40

    D149

    Abstract: D575 ASTM D5470 D150 D2240 D257 D374 D792 ASTM d792 astm D150
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very


    Original     		PDF 2000S40 2000S40 D149 D575 ASTM D5470 D150 D2240 D257 D374 D792 ASTM d792 astm D150

    Untitled

    Abstract: No abstract text available
    Text: TflexTM HR400 Series Thermal Gap Filler Innovative Technology for a Connected World MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.


    Original     		PDF HR400 HR400â A15958-00

    BERGQUIST

    Abstract: 3000S30 conductivity
    Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 PROPERTY Color • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures


    Original     		PDF 3000S30 3000S30 BERGQUIST conductivity

    D575

    Abstract: ASTM D575 D792 C351 D149 D150 D2240 D257 D374 Bergquist Company
    Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 • Thermal conductivity = 3.0 W/mK • Low S-Class thermal resistance at very low pressures • Conformable low hardness


    Original     		PDF 3000S30 D575 ASTM D575 D792 C351 D149 D150 D2240 D257 D374 Bergquist Company

    A15999-00

    Abstract: D2240 ASTM D5470 ASTM-D-257 HR610FG D257 E595 HR600 HR6120 HR-60
    Text: Tflex HR600 Series TM Thermal Gap Filler Innovative Technology for a Connected World Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.


    Original     		PDF HR600 A15999-00 D2240 ASTM D5470 ASTM-D-257 HR610FG D257 E595 HR6120 HR-60

    A16311

    Abstract: XS460
    Text: TflexTM XS400 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.0 W/mK Thermally Conductive Gap Filler Tflex XS400 is a compliant elastomer gap filler designed to provide moderate thermal performance. This soft interface pad conforms well with minimal pressure, resulting in little


    Original     		PDF XS400 A16311-00 A16311 XS460

    ADHESIVE GAP PAD

    Abstract: D575 D2240 D257 E595 low outgassing materials
    Text: TflexTM 500 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with


    Original     		PDF A15958-00 ADHESIVE GAP PAD D575 D2240 D257 E595 low outgassing materials

    D149

    Abstract: D150 D2240 D257 D412 E595
    Text: TflexTM 600 Series Thermal Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tflex 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a


    Original     		PDF A13512-00 D149 D150 D2240 D257 D412 E595

    D149

    Abstract: D150 D2240 D257 D412 E595 Outgassing
    Text: T-flex 300 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 300 Series Thermal Gap Filler Features and Benefits: Unique silicone gel offers compliancy, thermal resistance • Extreme compliancy allows material to “totally blanket” component s


    Original     		PDF 50psi, /m750 D149 D150 D2240 D257 D412 E595 Outgassing

    SoftFlex

    Abstract: No abstract text available
    Text: DATASHEET SOFTFLEX GAP FILLER LIGHT FLEXIBLE THERMAL GAP FILLING PADS The Aavid SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides


    Original     		PDF 400mm x8122 SoftFlex

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.7 W/m-K • High thermal performance, cost-effective solution • Un-reinforced construction for additional compliancy • Medium compliancy and conformability


    Original     		PDF E1269

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures • Highly conformable,“S-Class” softness


    Original     		PDF 3000S30 3000S30

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits • High thermal conductivity: 5 W/m-K • Highly conformable,“S-Class” softness TYPICAL PROPERTIES OF GAP PAD 5000S35 PROPERTY Color IMPERIAL VALUE


    Original     		PDF 5000S35 5000S35

    conductivity meter circuit

    Abstract: ASTM D5470 ASTM d792 ASTM D374 conductivity meter astm D150 ASTM D2240 ph meter circuit GP1500 D149
    Text: Gap Pad 1500 Thermally Conductive, Unreinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Unreinforced construction for additional compliancy • Conformable, low hardness


    Original     		PDF E1269 D2240 conductivity meter circuit ASTM D5470 ASTM d792 ASTM D374 conductivity meter astm D150 ASTM D2240 ph meter circuit GP1500 D149