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    2000S40 Search Results

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    2000S40 Price and Stock

    Nextgen Components XY27M12000S408

    CRYSTAL 27.12MHZ 10ppm, 8pF 4 Pa
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    DigiKey XY27M12000S408 Reel 600,000 3,000
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    Nextgen Components YG27M12000S408

    CRYSTALS 27.12MHZ 20PPM 8PF SMD
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    DigiKey YG27M12000S408 Reel 600,000 3,000
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    STMicroelectronics EVLSRK2000-S-40

    BOARD EVAL FOR SRK2000S
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    Avnet Americas EVLSRK2000-S-40 Bulk 15
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    Newark EVLSRK2000-S-40 Bulk 15
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    Orbel Corporation GRVC-2000S4000-0200X

    COVER RF SHIELD GROOVE LOC 2 "
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    DigiKey GRVC-2000S4000-0200X Box 100
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    The Bergquist Company GP2000S40-0.080-02-0816

    GAP PAD
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    Mouser Electronics GP2000S40-0.080-02-0816 4
    • 1 $137.18
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    2000S40 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    C351

    Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures


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    PDF 2000S40 C351 D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very


    Original
    PDF 2000S40 2000S40

    D149

    Abstract: D575 ASTM D5470 D150 D2240 D257 D374 D792 ASTM d792 astm D150
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very


    Original
    PDF 2000S40 2000S40 D149 D575 ASTM D5470 D150 D2240 D257 D374 D792 ASTM d792 astm D150

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


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    PDF

    74 hc 59581

    Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
    Text: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .


    Original
    PDF element-14 74 hc 59581 b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16