K1S3216B1C-FI70
Abstract: K1S3216B1C K1S3216B1C-I
Text: Preliminary K1S3216B1C UtRAM Document Title 2Mx16 bit Uni-Transistor Random Access Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 16, 2003 Advanced 0.1 Revised - Changed Package Type from 48 TBGA into 48 FBGA 6.0 x 8.0
|
Original
|
PDF
|
K1S3216B1C
2Mx16
100uA
55/Typ.
35/Typ.
K1S3216B1C-FI70
K1S3216B1C
K1S3216B1C-I
|
I-CUBE
Abstract: OCX256
Text: Technical Note OCX256 Layout Guidelines 1.0 Introduction The OCX256 is packaged in a 792-ball plastic TBGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 667Mb/s and registered data modes of 333MHz. The 128 Inputs and 128 Outputs are each configured as dedicated differential ports. The
|
Original
|
PDF
|
OCX256
792-ball
667Mb/s
333MHz.
I-CUBE
|
K6F8016R6A-EF70
Abstract: No abstract text available
Text: K6F8016R6A Family CMOS SRAM Document Title 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft August 21, 2000 Preliminary 0.1 Revise - Change package type from FBGA to TBGA
|
Original
|
PDF
|
K6F8016R6A
48-TBGA
58/Typ.
32/Typ.
K6F8016R6A-EF70
|
Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Technical Data Document Number: MPC8360EEC Rev. 5, 09/2011 MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a
|
Original
|
PDF
|
MPC8360EEC
MPC8360E/MPC8358E
MPC8360E/58E
|
Motorola multimeter
Abstract: multimeter probes MPC8260 digital multimeter diagram digital multimeter circuit
Text: Application Note AN2271/D Rev. 0, 3/2002 MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the MPC8260 is a 480 ball, 37.5x37.5mm TBGA (tape ball grid array) that provides excellent
|
Original
|
PDF
|
AN2271/D
MPC8260
Motorola multimeter
multimeter probes
digital multimeter diagram
digital multimeter circuit
|
M28335
Abstract: OC48 TBR24 ch9i
Text: M28335 Twelve Port T3/E3/STS-1 Line Interface Unit Data Sheet 500020D December 2001 Ordering Information Model Number Package Description Operating Temperature M28335-11p 580-pin 35 mm TBGA Twelve Port T3/E3/STS-1 LIU –40 °C to +85 °C Revision History
|
Original
|
PDF
|
M28335
500020D
M28335-11p
580-pin
101487B
500020B.
M28335
Reser-NWT-000253)
TR-TSY-000191,
TBR24
OC48
ch9i
|
K6F1008V2C-LF55
Abstract: K6F1008V2C-LF70 K6F1008V2C K6F1008V2C-F K6F1008V2C-YF55 K6F1008V2C-YF70 32-STSOP1
Text: K6F1008V2C Family CMOS SRAM Document Title 128Kx8 bit Super Low Power and Low Voltage CMOS Static RAM Revision History Revision No. History Draft Data Remark 0.0 Initial Draft November 27, 2001 Preliminary 0.1 Revise - Changed Package Type : 48 36 -TBGA-6.00x7.00 to 32-TSOP1-0813.4F
|
Original
|
PDF
|
K6F1008V2C
128Kx8
32-TSOP1-0813
K6F1008V2C-LF55
K6F1008V2C-LF70
K6F1008V2C-F
K6F1008V2C-YF55
K6F1008V2C-YF70
32-STSOP1
|
K9K1208D0C
Abstract: K9K1208Q0C K9K1208U0C K9K1208U0C-HCB0 K9K1216D0C K9K1216Q0C K9K1216U0C
Text: K9K1208Q0C K9K1208D0C K9K1208U0C K9K1216Q0C K9K1216D0C K9K1216U0C FLASH MEMORY Document Title 64M x 8 Bit , 32M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark Advance 0.0 Initial issue. Sep. 12th 2002 1.0 1.Pin assignment of TBGA dummy ball is changed.
|
Original
|
PDF
|
K9K1208Q0C
K9K1208D0C
K9K1208U0C
K9K1216Q0C
K9K1216D0C
K9K1216U0C
20mA--
30mry
K9K1208D0C
K9K1208Q0C
K9K1208U0C
K9K1208U0C-HCB0
K9K1216D0C
K9K1216Q0C
K9K1216U0C
|
K9F1208D0A
Abstract: K9F1208Q0A K9F1208Q0A-HCB0 K9F1208U0A K9F1208U0A-FCB0 K9F1216D0A K9F1216U0A K9F1216U0A-HCB0 K9F1216U0A-PCB0 Maker
Text: K9F1208Q0A K9F1208D0A K9F1216D0A K9F1208U0A K9F1216U0A FLASH MEMORY Document Title 64M x 8 Bit , 32M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial issue. Apr. 25th 2002 0.1 TBGA K9F12XXX0A-DCB0/DIB0 size information is changed.
|
Original
|
PDF
|
K9F1208Q0A
K9F1208D0A
K9F1216D0A
K9F1208U0A
K9F1216U0A
K9F12XXX0A-DCB0/DIB0)
K9F1208Q0A
K9F1208Q0A-HCB0
K9F1208U0A-FCB0
K9F1216D0A
K9F1216U0A
K9F1216U0A-HCB0
K9F1216U0A-PCB0
Maker
|
6152
Abstract: PLX Technology
Text: . Version 1.1 2004 PCI 6152 Connectivity PCI 6152 PCI 6152-xx33BC 32-bit, 33MHz Synchronous operation 5V signal tolerance 15mm x 15mm TBGA Transparent Bridge Function PCI Bus Types Support for 4 Bus Masters PCI 6152 (PCI 6152-xx66BC) AGP 2X Port Compatible
|
Original
|
PDF
|
6152-xx33BC)
32-bit,
33MHz
6152-xx66BC)
66MHz
6152-xx33PC)
160-pin
6152
PLX Technology
|
BGA 8 x 8 tray
Abstract: tray datasheet bga S576N7
Text: Mounting Pad Packing Name JEDEC Tray TBGA 40x40 576 pin T-BGA H/Sp (40 × 40) A A B Q A1 R S T BW A2 D X C Y Index mark J S A H B G F L M P M M E S A B *1 S *2 detail of A part (Z) detail of B part K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of
|
Original
|
PDF
|
S576N7-H6
BGA 8 x 8 tray
tray datasheet bga
S576N7
|
FCS-32
Abstract: CX28560 fcs32
Text: 500335A April 22, 2002 CX28560 Product Bulletin Product Affected: CX28560-11P, 680-pin TBGA package 40 mm This document describes conditions that may cause the operation of the above device to deviate from published specifications. TSLP Channel Status Register Always Reads Zero
|
Original
|
PDF
|
00335A
CX28560
CX28560-11P,
680-pin
0x128800
0x10C84
FCS-16
FCS-32
0x129000
40-byte
CX28560
fcs32
|
hsp35
Abstract: C0016
Text: Packing Name Mounting Pad JEDEC Tray TBGA 35x35 352 pin T-BGA H/Sp (35 × 35) A A B Q A1 R S T BW A2 D X C Index mark Y J H S A G B K φM φP L S M M F E S A B S ∗2 detail of A part ∗1 detail of B part (Z) N ITEM MILLIMETERS INCHES A 35.00±0.20 1.378±0.008
|
Original
|
PDF
|
S352N7-F6-1
hsp35
C0016
|
tray datasheet bga
Abstract: No abstract text available
Text: Packing Name Mounting Pad JEDEC Tray TBGA 40x40 500 pin T-BGA H/Sp (40 × 40) A A B Q A1 R ST D BW A2 X C Y Index mark J A S H B G F L M P M M E S A B *1 S *2 ITEM A MILLIMETERS 40.00±0.20 INCHES 1.575±0.008 A1 23.00 MAX. 0.906 MAX. A2 23.00 MAX. 0.906 MAX.
|
Original
|
PDF
|
S500N7-H6
tray datasheet bga
|
|
|
IPC-9702
Abstract: BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C
Text: Freescale Semiconductor Tape Ball Grid Array TBGA Overview TM Revision 0 – 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale
|
Original
|
PDF
|
30C/60%
125degC.
IPC-9702
BGA PACKAGE thermal resistance Freescale
JESD51-9
Freescale Tape Ball Grid Array Overview
freescale 352 tbga
ipc 9702
motherboard ga
151C
C151C
181C
|
Untitled
Abstract: No abstract text available
Text: K1S321615M UtRAM Document Title 2Mx16 bit Uni-Transistor Random Access Memory Revision History Revision No. History Draft Date 0.0 Initial Draft - Design target 0.1 Revised - Change package type from FBGA to TBGA. - Improve operating current from 30mA to 25mA.
|
Original
|
PDF
|
K1S321615M
2Mx16
70/85ns
100ns.
YOON-000831
|
K6F1016U4C
Abstract: No abstract text available
Text: K6F1016U4C Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft May 17, 2001 1.0 Finalize - Changed 48-TBGA vertical dimension
|
Original
|
PDF
|
K6F1016U4C
48-TBGA
58/Typ.
32/Typ.
|
K6F1616U6M
Abstract: K6F1616U6M-F
Text: Preliminary K6F1616U6M Family CMOS SRAM Document Title 1M x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft August 22, 2000 Preliminary 0.1 Revise - Change package type : from FBGA to TBGA
|
Original
|
PDF
|
K6F1616U6M
55/Typ.
35/Typ.
K6F1616U6M-F
|
"network interface cards"
Abstract: No abstract text available
Text: Freescale Semiconductor Technical Data Document Number: MPC8360EEC Rev. 2, 12/2007 MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications This document provides an overview of the MPC8360E/58E PowerQUICC™ II Pro processor revision 2.x TBGA
|
Original
|
PDF
|
MPC8360EEC
MPC8360E/MPC8358E
MPC8360E/58E
20Parts
"network interface cards"
|
Samsung NAND
Abstract: K9K1216U0C
Text: K9K1208Q0C K9K1208D0C K9K1208U0C K9K1216Q0C K9K1216D0C K9K1216U0C FLASH MEMORY Document Title 64M x 8 Bit , 32M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark Advance 0.0 Initial issue. Sep. 12th 2002 1.0 1.Pin assignment of TBGA dummy ball is changed.
|
Original
|
PDF
|
K9K1208Q0C
K9K1208D0C
K9K1208U0C
K9K1216Q0C
K9K1216D0C
K9K1216U0C
20mA--
Samsung NAND
K9K1216U0C
|
Untitled
Abstract: No abstract text available
Text: K6F2016R4E Family CMOS SRAM Document Title 128K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft February 22, 2001 1.0 Finalize - Change 48-TBGA vertical dimension
|
Original
|
PDF
|
K6F2016R4E
48-TBGA
32/Typ.
58/Typ.
|
K9F5608U0C-PCB0
Abstract: No abstract text available
Text: K9F5608Q0C K9F5608D0C K9F5608U0C K9F5616Q0C K9F5616D0C K9F5616U0C FLASH MEMORY Document Title 32M x 8 Bit , 16M x 16 Bit NAND Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial issue. Apr. 25th 2002 Advance 1.0 1.Pin assignment of TBGA dummy ball is changed.
|
Original
|
PDF
|
K9F5608Q0C
K9F5608D0C
K9F5608U0C
K9F5616Q0C
K9F5616D0C
K9F5616U0C
20mA--
K9F5608U0C-PCB0
|
nec 2565
Abstract: tray bga 576 tray datasheet bga
Text: TRAY CONTAINER HEAT PROOF 7 150°C MAX PPE 40.25 84.6 42.30 A' 25.65 A TBGA 40x40 3×7=21 135.9 Unit : mm 40.25 42.30 253.8 30.60 315.0 322.6 SECTION A – A' 5.82 7.62 (6.35) 40.25 Applied Package 500-pin • Plastic BGA 40×40 576-pin • Plastic BGA 40×40
|
Original
|
PDF
|
500-pin
576-pin
SSD-A-H6757-1
nec 2565
tray bga 576
tray datasheet bga
|
M33 thermal
Abstract: QUICC Engine for mpc8360 8 port Gigabit ethernet switch at25 dc cbc no "network interface cards" AL667
Text: Freescale Semiconductor Technical Data Document Number: MPC8360EEC Rev. 5, 09/2011 MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a
|
Original
|
PDF
|
MPC8360EEC
MPC8360E/MPC8358E
MPC8360E/58E
M33 thermal
QUICC Engine for mpc8360
8 port Gigabit ethernet switch
at25 dc cbc no
"network interface cards"
AL667
|
