SWR201 Search Results

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2003 INITIAL RELEASE 7/17/2009 JH F F E E 2.00±0.10 .079±.004 A±0.20[.008] 4.70±0.25 .185±.010 SWR201-NREN-S_ _-SB-WH SWR201-NREN-S_ _-SA-WH 1.80±0.20 .071±.008 B±0.25[.010] D D A±0.10[.004]

Contextual Info: _ Sulllns Wafers S W H 2 0 1 S e rie s H o u s in g 2 .0 m m [.0 7 9 "] C C SPECIFICATIO N S • Insulator Material: Nylon 66, UL 94V-0 Color: White. • Contact Resistance: 20m OHMs Max. • Current Rating: 1 AMP per contact • Dielectric Withstanding: 800 V AC.

wh 02

Abstract: UL 94v-0 board
Contextual Info: M S Sullins W afers ic r o P l a s t ic s u l l in s SW R201 Series Single Row Wafer 2.0mm [.079"] CC, SM T SPECIFICATIONS - Insulator Material: Nylon 66, UL 94V-0 • Contact Resistance: 20m O H M s Max. • Contact Plating: .000020" Min. Nickel Underplate,

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2235 INITIAL RELEASE 05/25/2011 LH F F A 2.00 .079 6.00 .236 E E 0.80±0.05 .031±.002 RECOMMENDED PCB LAYOUT P.C. BOARD THICKNESS: 0.80mm ~ 1.60mm[.031" ~ .063"] D D B 4.80 .189 C C 3.40 .134 0.50 .020

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2235 INITIAL RELEASE 05/25/2011 LH F F E E A 6.00 .236 2.00 .079 3.40 .134 0.80±0.05 .031±.002 D 2.00 .079 TYP 0.50 .020 D RECOMMENDED PCB LAYOUT P.C. BOARD THICKNESS: 0.80 ~ 1.60mm[.031" ~ .063"]

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2003 INITIAL RELEASE 7/17/2009 JH F F 0.50 .020 E E VIEW FROM FRONT VIEW FROM BOTTOM D D 2.00±0.10 .079±.004 A±0.10[.004] 6.25±0.20 .246±.008 A±0.20[.008] 2.00±0.05 .079±.002 5.00±0.25 .197±.010

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2003 INITIAL RELEASE 7/17/2009 JH F F A 2.00±0.05 .079±.002 A±0.20[.008] E 2.00±0.10 .079±.004 E 1.00±0.05 .039±.002 1.60 .063 5.50 .217 3.00 .118 D D 1.60 .063 CIRCUIT 1 RECOMMENDED PCB LAYOUT

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2003 INITIAL RELEASE 7/17/2009 JH F F 3.40 .134 5.70 .224 E E 1.50 .059 9.20 .362 1.00±0.05 .039±.002 CIRCUIT 1 2.00±0.10 .079±.004 D 2.00±0.05 .079±.002 A 1.60 .063 D RECOMMENDED PCB LAYOUT

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2235 INITIAL RELEASE 05/25/2011 LH F F A A E 2.00 .079 1.10 .043 1.00 .039 E 2.00 .079 TYP. 0.50±0.05 .020±.002 1.60 .063 7.50 .295 3.00 .118 1.00 .039 EDGE OF WAFER COMPONENT D D 1.00 .039 RECOMMENDED PCB LAYOUT

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2235 INITIAL RELEASE 05/25/2011 LH F F A 1.60 .063 2.00 .079 1.00 .039 E E 3.50 .138 5.60 .220 5.50 .217 1.50 .059 1.40 .055 3.40 .134 2.95 .116 D D C RECOMMENDED PCB LAYOUT B 2.35 .093 6.00 .236

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2235 INITIAL RELEASE 05/25/2011 LH F F A 2.00 .079 TYP E E 0.70±0.10 .028±.004 0.70±0.10 .028±.004 D D B 3.50±0.20 .138±.008 C C 6.35 .250 4.50 .177 B A B NOTES: 1. SUITABLE FOR SWT201 SERIES TERMINAL.