Untitled
Abstract: No abstract text available
Text: A1 thru A7 Surface Mount Glass Passivated Standard Rectifier Reverse Voltage 50~1000V Forward Current 1A Features • • • • • • • • Glass passivated Standard Rectifiers Very low profile - typical height of 1.0 mm Low forward voltage drop Low leakage current
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J-STD-020
AEC-Q101
123FL)
03-Rev
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Kemet Flex Solutions
Abstract: capacitor 476 a700 A700D107M 476 6K tantalum
Text: New Product Release A700 Series – AO-CAP – Aluminum Organic Capacitor Low ESR Surface Mount Aluminum Capacitor with Polymer Cathode KEMET enters the world of aluminum capacitors with the introduction of the AO-CAP, designated the A700 Series, which has been targeted for power management applications. The structure of the AO-CAP uses aluminum as the anode material,
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D/7343-31
X/7343-43
T491D/47
A700/47
A700V476M006
T491D/47uF
A700/47uF
T491D476M006
Kemet Flex Solutions
capacitor 476
a700
A700D107M
476 6K tantalum
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capacitor 47uF TANTALUM
Abstract: T491D
Text: New Product Release A700 Series – AO-CAP – Aluminum Organic Capacitor Low ESR Surface Mount Aluminum Capacitor with Polymer Cathode KEMET enters the world of aluminum capacitors with the introduction of the AO-CAP, designated the A700 Series,which has been targeted for power management applications. The structure of the AO-CAP uses aluminum as the anode material,
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Original
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D/7343-31
X/7343-43
T491D/47
A700/47
A700V476M006
T491D/47uF
A700/47uF
T491D476M006
capacitor 47uF TANTALUM
T491D
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T491D
Abstract: A700 dc a700
Text: AO-CAP Data Sheet A700 Series – AO-CAP – Aluminum Organic Capacitor Low ESR Surface Mount Aluminum Capacitor with Polymer Cathode KEMET’s AO-CAP, designated the A700 Series, has been targeted for power management applications. The structure of the AO-CAP
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Original
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D/7343-31
X/7343-43
T491D/47
A700/47
A700V476M006
T491D/47uF
A700/47uF
T491D476M006
T491D
A700
dc a700
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PDF
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parallax
Abstract: PBX32A-D40 24LC2561 24LC256 rs232 on db9 socket RS232 insulator DB9 connector screwdriver EA transistor transistor Voltmeter propeller
Text: Gnd +Vin 123 Gnd restarting your program. Removing the PropSTICK from a solderless breadboard is a little tricky. Be sure to use the "extractor" provided and not a metal implement like a screwdriver. Working from the sides, as shown in the photo below, gently pry a little bit at a time on alternate
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PBX32A-D40
Abstract: making voltmeter PEEL programming 32310 cap 104 a26 transistor cap103
Text: Gnd +Vin 123 Gnd restarting your program. Removing the PropSTICK from a solderless breadboard is a little tricky. Be sure to use the "extractor" provided and not a metal implement like a screwdriver. Working from the sides, as shown in the photo below, gently pry a little bit at a time on alternate
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2SC4602
Abstract: 2SC4602A
Text: Ordering number: EN 3148 2SC4602 No.3148 NPN Triple Diffused Planar Silicon Transistor Switching Regulator Applications Features . Surface mount type device making the following possible -Reduction in the number of manufacturing processes for 2SC4602-applied equipment
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2SC4602
2SC4602-applied
2SC4602
2SC4602A
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Untitled
Abstract: No abstract text available
Text: 42 "MiniSpring"AirCoieInductors These surface mount air core “spring” inductors provide extremely high Q over a wide frequency range. They’re jacketed with a high temperature material which assures mechanical stability and very close tolerance. It also forms a flat top, making them
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Untitled
Abstract: No abstract text available
Text: □PM DPS256X16A3 Dense-Pac Microsystems, Ina O CERAMIC 256K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS256X16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC mounted on a
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DPS256X16A3
DPS256X16A3
A0-A16
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Untitled
Abstract: No abstract text available
Text: -g -ffjfjñ p » U " DPS256X16AA3 I V l D ense-Pac Microsystems, Inc. ^ HIGH SPEED CERAM IC 256K X 16 C M O S SR A M M O D U L E ADVANCED INFORMATION D ESC R IP T IO N : The DPS256X16AA3 "DEN SE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'
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DPS256X16AA3
DPS256X16AA3
30A04S01
A0-A16
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM DPS1MS8A3 Dense-Pac M ic r o s y s te m s jn ç ^ 1024K X 8 BUFFERED/DECODED C M O S SRAM M O D U LE PRELIMINARY DESCRIPTION: The DPS1MS8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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1024K
I/05B
30A04001
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM DPS512X16AA3 Dense-Pac Microsystems, Inc. HIGH SPEED CERAMIC 512K X 16 C M O S SRAM M ODULE O ADVANCED INFORMATION DESCRIPTION: The DPS512X16AA3 "DEN SE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac M icrosystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired
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DPS512X16AA3
DPS512X16AA3
30A045-11
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DPS128X16AA3
Abstract: Dense-Pac Microsystems DPS128X16A
Text: CDPM ETSTMIS QGQGHME M • DPC EÒE D DENSE-PAC MICROSYSTEMS DPS128X16AA3 Dense-Pac Microsystems, Inc. ^ HIGH SPEED CERAMIC 128K X 16 CM OS SRAM MODULE ADVANCED INFORMATION “ 7= ^-2^ D ESCRIPTIO N; The DPS128X16AA3 "DENSE-STACK" module is a revolutionary new
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DPS128X16AA3
DPS128X16AA3
A0-A16
I/00-I/015
30a045-21
X-46-23-H
Dense-Pac Microsystems
DPS128X16A
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM DPS256X16AA3 Dense-Pac Microsystems, Inc. HIGH SPEED CERAMIC 256K X 16 CMOS SRAM MODULE O ADVANCED INFORMATION DESCRIPTION: The DPS256X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a
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DPS256X16AA3
DPS256X16AA3
30A04WJ1
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DPS128X16A
Abstract: No abstract text available
Text: CERAMIC 128KX 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS128X16A3 "DENSE-STACK" module is a re vo lu tio n ary n ew m e m o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC m ounted on a co-fired ceram ic substrate. The module packs
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128KX
DPS128X16A3
30A045-20
DPS128X16A
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256K STACK RAM
Abstract: 9000-098J making A10
Text: DENSE-PAC MICROSYSTEMS 2ÛE D • 575^415 OODQSOb i* M D P C DPS256X16AA3 HIGH SPEED CERAMIC 256K X 16 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS256X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'
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DPS256X16AA3
DPS256X16AA3
A0-A16
I/00-I/015
30A045-01
9000-098J?
E7ST41S
T-46-23-14
256K STACK RAM
9000-098J
making A10
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PDF
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Untitled
Abstract: No abstract text available
Text: □; pm DPS512S8A3 D ense-Pac Microsystems. Inc. 512K X 8 BUFFERED/DECODED C M O S SRAM M O D U LE PRELIMINARY DESCRIPTION: The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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DPS512S8A3
DPS512S8A3
I/07A
I/07B
I/07B
30A04000
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PDF
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Dense-Pac Microsystems
Abstract: making A10
Text: DENSE-PAC MICROSYSTEMS C Û P M 2ÖE » • 275^15 0000352 O » » P C DPS512X16AA3 Dense-Pac Microsystems, Inc. ^ HIGH SPEED CERAMIC 512K X 16 CMOS SRAM MODULE ADVANCED INFORMATION 7 ^ 6 -2 3 -7 4 DESCRIPTION: The DPS512X16AA3 "DENSE-STACK" module is a revolutionary new
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00Q0SS2
DPS512X16AA3
DPS512X16AA3
30A045-11
27S14Ã
DQ0Q553
T-46-23-14
Dense-Pac Microsystems
making A10
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PDF
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Untitled
Abstract: No abstract text available
Text: □P M DPS256X16A3 Dense-Pac Microsystems, Inc. CERAMIC 256K X 16 C M O S SRAM MODULE O PRELIMINARY DESCRIPTION: The D PS256X16A 3 "D E N S E -S T A C K " module is a revo lutio n ary new m em ory subsystem usin g D e n se -P a c M ic ro s y s te m s ' ceram ic Stackable
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DPS256X16A3
PS256X16A
A0-A16
30A045-00
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM DPS512X16AA3 Dense-Pac Microsystems. Inc. HIGH SPEED CERAMIC 512K X 16 CMOS SRAM MODULE O ADVANCED INFORMATION DESCRIPTION: The DPS512X16AA3 "DEN SE-STACK" module is a revolutionary new high speed mem ory subsystem using Dense-Pac M icrosystem s' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired
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DPS512X16AA3
PS512X16AA3
102Chip
30A045-11
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PDF
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Untitled
Abstract: No abstract text available
Text: ► DPS512X16AA3 Dense-Pac Microsystems, Inc. 0 HIGH SPEED CERAMIC 512K X 16 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS512X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired
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OCR Scan
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DPS512X16AA3
DPS512X16AA3
1024K
30A045-11
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PDF
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making A10
Abstract: DPS512S8AA3
Text: DENSE-PAC MICROSYSTEMS CDPM EñE D • 275^415 0000534 T ■ DPC DPS512S8AA3 HIGH SPEED CERAMIC 512K X 8 BUFFERED/DECODED CMOS SRAM MODULE Dense-Pac Microsystems, Inc. ^ ADVANCED INFORMATION _ 7^6-23-/V DESCRIPTION: The DPS512S8AA3 "DENSE-STACK" module is a revolutionary new high
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DPS512S8AA3
DPS512S8AA3
I/04A
I/03A
I/02A
1/01A
I/07A
I/06A
1/01B*
making A10
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PDF
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Untitled
Abstract: No abstract text available
Text: DPS1MS8AA3 f t } □PM Dense-Pac Microsystems, Inc. H IG H SPEED CERAMIC 1024K X 8 BUFFERED/DECODED C M O S SRAM M O D U LE O ADVANCED INFORMATION DESCRIPTION: The DPS1MS8AA3 "DENSE-STACK" module is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceramic
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OCR Scan
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1024K
30A040-11
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PDF
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Untitled
Abstract: No abstract text available
Text: H Q DPS512S8A3 . . # Dense-Pac Microsystems, Inc. 0 512K X 8 BUFFERED/DECODED C M O S SR A M M O D U L E PRELIMINARY DESCRIPTION: The DPS512S8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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DPS512S8A3
DPS512S8A3
I/07A,
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