SN63PB37
Abstract: No abstract text available
Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product
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EM907
EM828
SN63PB37
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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stencil tension
Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning
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AN-1112
stencil tension
IPC-SM-785
PT100 bridge
AN-1112
GENERAL SEMICONDUCTOR MARKING UM
Solder paste stencil life
WLCSP stencil design
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IPC-SM-785
Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
Text: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning
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AN-1112
IPC-SM-785
GENERAL SEMICONDUCTOR MARKING UM
micro solder ball
AN-1112
WLCSP stencil design
BGA and CSP
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BGA-3000
Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste
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sot89 stencil
Abstract: sot89 land pattern Loctite 218 RG200 substrate 5989-0810EN LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun
Text: SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins Figure 1 package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm
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5989-0810EN
sot89 stencil
sot89 land pattern
Loctite 218
RG200 substrate
LOCTITE-96sc
Getek
LOCTITE 384
RG200
laser gun
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Teradyne connector
Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight
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TB-2082
Teradyne connector
470-2075-100
470-2105-100
337 BGA footprint
471-2045-100
471-1045-100
471-1025-100
470-2235-100
BGA PROFILING
Teradyne
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IPC-7527
Abstract: IPC-7525 koki solder paste IPC7527
Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single
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101752C
01049A
an100p
AN100-10
434-0507CAwww
IPC-7527
IPC-7525
koki solder paste
IPC7527
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LGA voiding
Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.
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101752C
01049A
an100fc
AN100-14
LGA voiding
IPC-7527
IPC7525 lga material
koki solder paste
LTM4600
an100fc
AN100
IPC7525
reflowing profiles lga
Water soluble flux
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IPC-7527
Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single
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101752C
01049A
an100fb
AN100-10
434-0507CAwww
IPC-7527
LGA voiding
koki solder paste
LTM4600
IPC-7525
reflow profile FOR LGA COMPONENTS
LGA land pattern
IPC7525 for lga
LGA 32 land pattern
Solder Paste, Indium 5.1 AT
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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IPC-7525
Abstract: ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS
Text: AN-9036 Guidelines for Using Fairchild's Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal
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AN-9036
Power56
Power56
FDMS8460,
FDMS8660AS,
FDMS8660S,
FDMS8662,
FDMS8670AS,
IPC-7525
ipc 7525
IPC-9502
AN-9036
IPC9502
FDMS8660S
JESD22-102D
Soldering guidelines pin in paste
JESD22-102
FDMS8660AS
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solder joint
Abstract: PNC0106A stencil tension
Text: AND8455/D Board Level Application Note for SOD-923 Two Pin Diode Package Prepared by: Steve St. Germain ON Semiconductor http://onsemi.com APPLICATION NOTE Introduction Board Mounting Process ON Semiconductor’s SOD-923 represents the latest in small surface mount two pin Diode package technology.
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AND8455/D
OD-923
solder joint
PNC0106A
stencil tension
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hot air gun
Abstract: stencil tension LPCC stencil
Text: LPCC 3 x 3 Package Application Note 5073 Introduction The Avago Technologies LPCC 3 x 3 package platform has 16 I/O pins as shown in Figure 1. The LPCC 3 x 3 is lead free, halogen free and has a dimension of 3.0 mm L x 3.0 mm (W) x 0.90 mm (H). The following
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5989-1225EN
hot air gun
stencil tension
LPCC
stencil
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landing
Abstract: AN-19 AN-20 16 QSOP pcb footprint qsop 16 pcb footprint
Text: AN-20 Q QUALITY SEMICONDUCTOR, INC. Board Assembly Techniques for 0.4mm Pin Pitch Surface Mount Packages The need for higher performance systems continues to push both silicon and packaging technologies to new advances. As an example, in 1991 Quality Semiconductor QSI introduced the QSOP (Quarter
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AN-20
150-mil)
25-mil
MAPN-00020-00
landing
AN-19
AN-20
16 QSOP pcb footprint
qsop 16 pcb footprint
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IPC-7525
Abstract: IPC-9502 IPC9502 IPC7525 FDS7066N7 defect analysis to-220 Solder paste stencil life FDS7066N3 J-STD-020B 96SC
Text: www.fairchildsemi.com Application Note 7006 Guidelines for Using Fairchild’s SO-8 FLMP Dennis Lang, Applications Engineer Introduction Board Layout The Flip chip in Leaded Molded Package FLMP SO-8 minimizes both Printed Circuit Board (PCB) space and RDS(ON) in a convenient, familiar SO-8 sized package,
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0201-size
Abstract: Tyco SESD raychem trace heating tape 5b smd
Text: APPLICATION GUIDE Surface-mount 0201-size SESD Devices This document was written to serve as a guideline for developing the proper printed circuit board PCB design and surface mount processes for Tyco Electronics’ 0201size Silicon ESD (SESD) devices. Actual studies may be
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0201-size
0201size
0201-sized
RCP0067E
Tyco SESD
raychem trace heating tape
5b smd
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slua271a
Abstract: SON PCB Attachment IPC-7525 qfn Substrate design guidelines ipc 7525 DUAL ROW QFN leadframe Service Manual smd rework station IPC7525 IPC7711 JESD51-7
Text: Application Report SLUA271A – June 2002 – Revised September 2007 QFN/SON PCB Attachment Steve Kummerl, Bernhard Lange, Dominic Nguyen . ABSTRACT Quad flatpack no leads QFNs and small-outline no leads (SONs) are leadless
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SLUA271A
slua271a
SON PCB Attachment
IPC-7525
qfn Substrate design guidelines
ipc 7525
DUAL ROW QFN leadframe
Service Manual smd rework station
IPC7525
IPC7711
JESD51-7
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SLUA271
Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface
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SLUA271
IPC-7527
IPC7527
DUAL ROW QFN leadframe
PCB design for very fine pitch csp package
nozzle heater
qfn Substrate design guidelines
IPC-SM-782
qfn 28 land pattern
Service Manual smd rework station
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AN-772
Abstract: EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp
Text: AN-772 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com A Design and Manufacturing Guide for the Lead Frame Chip Scale Package LFCSP by Gary Griffin Table of Contents
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AN-772
EM-2000-011)
TM-00-11)
AN05425
AN-772
EM-99
C7025
IPC-SM-782
JESD51-5
MO220
MO-220
MO229
tssop 16 exposed pad stencil
20-lead lfcsp
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Sofix
Abstract: Machine Vision Hardware pin in paste rectangular connector sofix connector
Text: COMMUNICATION, DATA AND CONSUMER DIVISION Pin-in-Paste Application Guide www.fciconnect.com CDC-PIPGUIDE-02/07-E FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries, FCI ia a leading manufacturer of connectors. Our 13.500 employees are committed to providing
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CDC-PIPGUIDE-02/07-E
Sofix
Machine Vision Hardware
pin in paste
rectangular connector
sofix connector
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PNC0106A
Abstract: No abstract text available
Text: ESD5484FCT5G Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD5484 is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are
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ESD5484FCT5G
ESD5484
ESD5484/D
PNC0106A
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Video Transistors and Modules for Monitors General MOUNTING AND SOLDERING Stencilling Mounting methods In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste that is deposited on the
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Indium Tac Flux 020
Abstract: CU-106A CU-106A shelf life of BGAS DALE SOMC k type thermocouple utl USR(pet) gold embrittlement
Text: APPENDIX A Surface Tension and the Self-Centering of BGAs ITS PHYSICS ARE REVIEWED T O G E TH E R W I T H SOLDER TYPE, TEM PERATURE A N D THE PRESENCE OF C O N T A M I N A T E S A N D H O W THEY IN F LU E N C E By Steve G r e a t h o u s e THE S E L F - A L I G N I N G M O V E M E N T OF DEVICES D U R I N G
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