M2S050-1FG484I
Abstract: AMBA AXI dma controller designer user guide M2S050-VF400 M2S025-1FG484I d flip flop 7475 M2S010T-1VF400 M2S050-1VF400 M2S025-1VF400I M2S050-1FG896I M2S050
Text: Revision 0 SmartFusion2 System-on-Chip FPGAs Microsemi’s SmartFusion 2 SoC FPGAs integrate fourth generation flash-based FPGA fabric, an ARM® Cortex -M3 processor, and high performance communications interfaces on a single chip. The SmartFusion2 family is the industry’s lowest power, most
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Abstract: No abstract text available
Text: Revision 1 SmartFusion2 System-on-Chip FPGAs Microsemi’s SmartFusion 2 SoC FPGAs integrate fourth generation flash-based FPGA fabric, an ARM® Cortex -M3 processor, and high performance communications interfaces on a single chip. The SmartFusion2 family is the industry’s lowest power, most
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flashpro3 schematic
Abstract: TTL XOR2 LVCMOS15 kt 501
Text: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP
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B 834 Y
Abstract: uA 741 NC 2N2222 ADG839 LVCMOS15 RAM51 KT 907 ST 1076
Text: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP
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Abstract: LVCMOS15
Text: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP
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F5 DIODE
Abstract: class AB2 push pull power amplifier
Text: Advanced v0.9 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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130-nm,
32-Bit
12-Bit
F5 DIODE
class AB2 push pull power amplifier
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equivalent ZO 607
Abstract: JESD 201 class 1A crystal k 1058 mosfet
Text: Advanced v0.8 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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130-nm,
32-Bit
12-Bit
equivalent ZO 607
JESD 201 class 1A crystal
k 1058 mosfet
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k 1058 mosfet
Abstract: proton rx 3000 2n3904 h16 yc 428 transistor cx 472
Text: Advanced v0.8 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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130-nm,
32-Bit
12-Bit
k 1058 mosfet
proton rx 3000
2n3904 h16
yc 428 transistor
cx 472
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Core8051
Abstract: U1AFS600-FG256 FlashPro3 flashpro3 schematic AES-128 FG256 PQ208 gaa 716 kt 501 PUSH PULL MOSFET DRIVER dip
Text: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)
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8051-Based
130-nm,
32ost
Core8051
U1AFS600-FG256
FlashPro3
flashpro3 schematic
AES-128
FG256
PQ208
gaa 716
kt 501
PUSH PULL MOSFET DRIVER dip
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Abstract: No abstract text available
Text: Advanced v0.1 Actel Fusion Programmable System Chips for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits On-Chip Clocking Support Targeted to Advanced Mezzanine Card AdvancedMC Designs Designed in Partnership with MicroBlade 8051-Based Module Management Controller (MMC)
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8051-Based
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actel smart fusion
Abstract: No abstract text available
Text: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)
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8051-Based
actel smart fusion
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Abstract: No abstract text available
Text: November 10, 2008 LMH6517 Multi Standard, IF and Baseband, Dual, DVGA General Description Features The LMH6517 contains two high performance digitally controlled variable gain amplifiers DVGA . It has been designed for use in narrowband and broadband IF sampling applications. Typically the LMH6517 drives a high performance ADC
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TBD 234 V12
Abstract: ACM 944 motor IG 2200 19 X 000 15 R
Text: Advanced v1.2 Actel Fusion Programmable System Chips Mixed-Signal Family with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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TBD 234 V12
ACM 944
motor IG 2200 19 X 000 15 R
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zo 103 ma 75 607
Abstract: No abstract text available
Text: Advanced v1.6 Actel Fusion Mixed-Signal FPGAs ® with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program when Powered Off
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Abstract: No abstract text available
Text: Advanced v1.3 Actel Fusion Programmable System Chips ® Mixed-Signal Family with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process
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TRANSISTOR KT 838
Abstract: transistor part number 2N2222A 338 2N2222A 2n2222 -331 2n2222 h 331 datasheet
Text: Revision 0 Actel Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • •
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32-Bit
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TRANSISTOR KT 838
transistor part number 2N2222A 338
2N2222A
2n2222 -331
2n2222 h 331 datasheet
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Abstract: No abstract text available
Text: XC2018B Military Logic CelTArray £ XILINX Product Specification. See Note 1. Part Number FEATURES • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array XC2018 • Low power CMOS static memory technology Logic
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XC2018B
MIL-STD-883
XC2018
TSC0026
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Abstract: No abstract text available
Text: XC3042B Military Logic Cell Array Product Specification. See Note 1. FEATURES Part Number • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array XC3042 • Low power CMOS static memory technology Logic Capacity
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XC3042B
MIL-STD-883
XC3042
TSC0117
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XC3042B
Abstract: XC3042-PG84 Enplas fpq Enplas 64 pin
Text: XC3042B Military Logic Cell "Array Product Specification. See Note 1. FEATURES Part Number Logic Capacity gates XC3042 4200 • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array • Low power CMOS static memory technology
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XC3042B
MIL-STD-883
TSC0117
XC3042-PG84
Enplas fpq
Enplas 64 pin
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Untitled
Abstract: No abstract text available
Text: XC2018B Military Logic Cell Array £ X !U N X Product Specification. See Note 1. FEATURES Part Number • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array • Low power CMOS static memory technology Logic Capacity
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XC2018B
MIL-STD-883
XC2018
memory10
TSC0026
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Untitled
Abstract: No abstract text available
Text: Y p o n o n o H XILINX Military Logic Cell Array Product Specification. See Note 1. FEATURES Part Number Logic ConflgCapacity urable gates Logic Blocks User I/Os XC3090 9000 144 • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array
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XC3090
MIL-STD-883
TSC0097
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LCA-MEK01
Abstract: 2064 ram
Text: Military CMOS Programmable Gate Array Logic Cell Array M 2064/M 2018 Conforms to MIL-STD-883, Class B* Ordering Information Benefits Features CM OS • Low power • T T L or CM OS input threshold levels PROGRAM ABLE • Programmable Logic functions • Programmable I/O blocks
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2064/M
MIL-STD-883,
M2018
M2064
M2018
-55CC
-125aC
A0-A15
LCA-MEK01
2064 ram
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Abstract: No abstract text available
Text: Military CMOS Programmable Gate Array Logic Cell Array M 2 0 6 4 /M 2 0 1 8 Conforms to MIL-STD-883, Class B* Ordering Information Benefits Features CMOS • Low power • TTL or CMOS Input threshold levels PROGRAMABLE • Programmable Logic unctions • Programmable I/O blocks
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MIL-STD-883,
M2018
M2064
M2018
A0-A15
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BUS 61555
Abstract: No abstract text available
Text: QQQ BUS-61555 ILC DATA DEVICI CORPORATION— MIL-STD-1553 ADVANCED INTEGRATED MUX AIM HYBRID FEATU RES PLEASE REFERENCE BUS-61553 DATA SHEET FOR TIMINQ SPECIFICATIONS DESCRIPTION D D C ’s B U S -61 5 5 5 A d va nce d Integrated M ux (A IM ) H y b rid is a c o m p le te MILS T D -1 5 5 3 Bus C on tro lle r (BC), R em ote
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BUS-61555
MIL-STD-1553
BUS-61553
MIL-STD-1750
BUS 61555
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