land pattern for TSOP
Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,
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OT-23
O-263
MA05A
land pattern for TSOP
TSOP 86 land pattern
land pattern for SOP
land pattern PQFP 208
land pattern for TSOP 2 86
land pattern for TSOP 2
land pattern for SSOP
land pattern PQFP 100
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land pattern for SSOP
Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for
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OT-23
O-263
MA05A
MS011811-1
land pattern for SSOP
TSOP 86 land pattern
land pattern for SOP
land pattern for TSOP
TSOP 48 Pattern
land pattern PQFP 208
land pattern for TSOP 2 86
tip 3035
land pattern PQFP 132
land pattern PQFP 100
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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PHD64
Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
Text: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle
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100MHz
PHD64
land pattern for vsop 8 pins
land pattern for vsop
DCA56
PFC80
PZT10
DED28
DFD64
DAP38
PWD14
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44-pin plcc pcb mount footprint
Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
Text: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1 2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories
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DS00104F-page
PIC12CXXX,
PIC14C000,
PIC16CXXX
PIC17CXXX
28C64ASO
28C64AK
PIC16C55SW
W9711
44-pin plcc pcb mount footprint
PIC16C71SO
pic16c57 PCB Circuit
27C64SO
PIC16C74P
adaptor 32 pin dil to 32 pin plcc
pic16c57 codes
data programmers DIP PLCC
Enplas
PIC17C76X
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MARKING T6C
Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
Text: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change
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PX10051EJ35V0TN
G0706
MARKING T6C
lga 1155
package Code T6S
M33 TRANSISTOR
14SSOP
QFN-36 LAND PATTERN
14LGA
36pin qfn
marking 6-PIN PLASTIC TSON
nec 44pin
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91185A558
Abstract: 8c210 SSOP 56 land pattern NC10 NC11 NC12 NC13 NC15 NC16 connector male 6 pin 1.27mm
Text: 5 4 3 2 1 Revision History Rev 0.1 Original D D Proton POD Schematic 24MLF VCC J1 P0_1 SMP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 P0_7 P0_5 P0_3 P0_1 OCD_DE OCD_DO SMP P1_7 P1_5 C P1_3 P1_1 VDD P0_6 P0_4 P0_2 P0_0 P2_6
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24MLF)
CY8C21xxx
56-Pin
CY3250-21X23QFN
QFN24
EA-8C21023-Q24-01
91185A558
8c210
SSOP 56 land pattern
NC10
NC11
NC12
NC13
NC15
NC16
connector male 6 pin 1.27mm
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land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS
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c6822
Abstract: pdcr 22 91185A558 transistor c6822 land pattern for SSOP56 CY8C21002-24PVXI pdcr9 SSOP20 LAND PATTERN transistor c3845 J1-0603
Text: PROPRIETARY INFORMATION: Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in
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21X23
91185A558
CY8C21002-24PVXI
CY3250-21X23
SSOP56
CY8C21002-24PVXI)
XT-PSoC-15-20H-10-01
20-Pin
PDCR-9323
121R-32400
c6822
pdcr 22
91185A558
transistor c6822
land pattern for SSOP56
CY8C21002-24PVXI
pdcr9
SSOP20 LAND PATTERN
transistor c3845
J1-0603
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marking 6-PIN PLASTIC TSON
Abstract: MARKING M53 MARKING CODE T5E RENESAS marking code 30SSOP Renesas 30SSOP marking code lga 1155 M33 TRANSISTOR Microwave Devices QFN-52 p5 6pin
Text: PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Common Information www.renesas.com Rev.2.00 Oct 2010 Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
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R50ZZ0001EJ0200
marking 6-PIN PLASTIC TSON
MARKING M53
MARKING CODE T5E
RENESAS marking code 30SSOP
Renesas 30SSOP marking code
lga 1155
M33 TRANSISTOR
Microwave Devices
QFN-52
p5 6pin
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ansi y14.5m-1982 decimal
Abstract: CD 4039 AE ansi y14.5m-1982 decimal .xxxx SSC 9500 MAA 723 pj 299 IC 4033 pin configuration IC CD 4033 pin configuration IC CD 4033 pin diagram tsop 48 PIN
Text: PACKAGE s o ie DIAGRAM O U T L IN E S PACKAGE SOIC DIAGRAM O U T L IN E S C o n tin u ed REVISIONS DWG § NOM N MAX T E S 0 18- -1 DWG § JEDEC VARIATION □ AA MIN DWG § S016- JEDEC VARIATION □ AB MIN NOM MAX S020- 2 JEDEC VARIATION T E NOM MAX T E
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s016-1
s018-1
s020-2
s024-2
s028-2
MO-153,
PSC-4056
ansi y14.5m-1982 decimal
CD 4039 AE
ansi y14.5m-1982 decimal .xxxx
SSC 9500
MAA 723
pj 299
IC 4033 pin configuration
IC CD 4033 pin configuration
IC CD 4033 pin diagram
tsop 48 PIN
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CHN 725 diode
Abstract: No abstract text available
Text: 20-BIT BUS SWITCH IDT7 4 FST32X L384 In te g r a te d D e v i z e T e c h n o lo g y , î i c . isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external
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20-BIT
FST32X
FST32XL384
MIL-STD-883,
200pF,
48-Pin
56-Pin
CHN 725 diode
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chn 810
Abstract: chn 825
Text: 20-BIT BUS SWITCH IDT74 FST32X L2384 In te g r a te d D e v i z e T e c h n o lo g y , î i c . isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external
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20-BIT
IDT74
FST32X
L2384
FST32XL2384
MIL-STD-883,
200pF,
48-Pin
56-Pin
chn 810
chn 825
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Untitled
Abstract: No abstract text available
Text: 24-BIT BUS SWITCH IDT74FST163211 life In te g r a te d D e v i c e T e c h n o lo g y , î i c . FEATURES: lating two ports without providing any inherent current sink or source capability. They generate little or no noise of their own while providing a low resistance path for an external driver.
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24-BIT
IDT74FST163211
FST163xxx
2000v
MIL-STD-883,
200pF,
FST163211
48-Pin
56-Pin
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Untitled
Abstract: No abstract text available
Text: 18-BIT BUS SWITCH/ 4 PORT BUS EXCHANGER FEATURES: Bus switches provide zero delay paths Extended commercial range of -4 0 ° C to +85°C Low switch on-resistance: TTL-compatible input and output levels ESD >2000v per MIL-STD-883, Method 3015; > 200V using machine model C = 200pF, R = 0
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18-BIT
IDT74FST163209
2000v
MIL-STD-883,
200pF,
FST163209
48-Pin
56-Pin
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O FEATURES: - Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP and 0.40mm pitch TVSOP packages
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16-BIT
250ps
MIL-STD-883,
200pF,
635mm
LVC16540A:
IDT74LVC16540A
16-bit
48-Pin
56-Pin
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O FEATURES: - Typical - ESD > 2000V per MIL-STD-883, Method 3015; tsK o (Output Skew) < 250ps > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP and 0.40mm pitch TVSO P packages
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16-BIT
MIL-STD-883,
250ps
200pF,
635mm
16-bit
48-Pin
56-Pin
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chn 627
Abstract: chn 810 CHN 725 diode chn 610 chn 630 b244a k 3511 CHN 420 CHN 727
Text: 16-BIT SYNCHRONOUS 2:1 MUX/DEMUX SWITCH IDT74FST163232 ADVANCE INFORMATION In te g ra te d D evice T echnology, Inc. driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and
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16-BIT
IDT74FST163232
FST163xxx
MIL-STD-883,
200pF,
FST163232
48-Pin
56-Pin
chn 627
chn 810
CHN 725 diode
chn 610
chn 630
b244a
k 3511
CHN 420
CHN 727
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS AND 5 VOLT TOLERANT I/O FEATURES: - Typical - ESD > 2000V per MIL-STD-883, Method 3015; - 0.635mm pitch SSOP, 0.50mm pitch TSSOP tsK o (Output Skew) < 250ps > 200V using machine model (C = 200pF, R = 0)
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16-BIT
MIL-STD-883,
635mm
250ps
200pF,
IDT74LVC16373A
16373A16-bit
TheLVC16373Acanbeusedforimplementing
48-Pin
56-Pin
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 18-BIT REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O FEATURES: - power 18-bit registered bus transceiver combines D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes. Data flow in each direction is
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18-BIT
250ps
MIL-STD-883,
200pF,
635mm
IDT74LVC162501A
LVC162501
48-Pin
56-Pin
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 20-BIT BUFFER WITH 5 VOLT TOLERANT I/O AND BUS-HOLD BE D E S C R IP TIO N FEATURES: - Typical - ESD > 2000V per MIL-STD-883, Method 3015; tsK o (Output Skew) < 250ps > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP
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20-BIT
IDT74L
VCH16827A
250ps
MIL-STD-883,
200pF,
635mm
LVCH16827A:
BS771
DDSb231
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Untitled
Abstract: No abstract text available
Text: 3.3 V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS FEATURES: - 0.5 MICRON CMOS Technology Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) - 0.635mm pitch SSOP, 0.50mm pitch TSSOP,
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18-BIT
250ps
MIL-STD-883,
200pF,
635mm
ALVC162834:
IDT74ALVC162834
48-Pin
56-Pin
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Untitled
Abstract: No abstract text available
Text: 3.3V CMOS 20-BIT BUFFER WITH 5 VOLT TOLERANT I/O BE :888í:i8fí¡ FEATURES: - Typical tsK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.635mm pitch SSOP, 0.50mm pitch TSSOP and 0.40mm pitch TVSOP packages
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20-BIT
250ps
MIL-STD-883,
200pF,
635mm
LVC162827A:
IDT740
48-Pin
56-Pin
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Untitled
Abstract: No abstract text available
Text: 24-BIT BUS EXCHANGE SWITCH IDT74FST163212 life Integrated D evice Technology, î ic . FEATURES: source capability. They generate little or no noise of their own while providing a low resistance path for an external driver. These devices connect input and output ports through an nchannel FET. When the gate-to-source junction of this FET
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24-BIT
IDT74FST163212
FST163xxx
2000v
MIL-STD-883,
200pF,
FST163212
48-Pin
56-Pin
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