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    SOT871 Search Results

    SOT871 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT871-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN52: plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm D SOT871-1 A B terminal 1 index area E A A1 c detail X C e1 e 13 v w b 1/2 e 14 25 26 M M y y1 C C A B C L 27 12 LC e e2 Eh 1/2 e eg


    Original     		PDF HVQFN52: OT871-1

    HVQFN52

    Abstract: DF-39 sot871 HVQFN-52 DF 39 DF 085 l2712
    Text: Package outline Philips Semiconductors HVQFN52: plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm A B D SOT871-1 terminal 1 index area E A A1 c detail X C e1 e 13 v w b 1/2 e 14 25 M M y1 C C A B C y 26 L 27


    Original     		PDF HVQFN52: OT871-1 HVQFN52 DF-39 sot871 HVQFN-52 DF 39 DF 085 l2712