SOT824 Search Results

SOT824 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT824-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm		Original	PDF

SOT824 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA320: plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm SOT824-1 B D A ball A1 index area E A A2 A1 detail X C e1 e 1/2 e y ∅w M C AD AC AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area	Original	LFBGA320: OT824-1	PDF
LFBGA320 Abstract: LFBGA-320 sot824 Text: PDF: 2003 Jul 10 Philips Semiconductors Package outline LFBGA320: plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm SOT824-1 B D A ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v M b AD AC AB AA Y W V U T R P	Original	LFBGA320: OT824-1 LFBGA320 LFBGA-320 sot824	PDF
INS16Cx50 Abstract: cea f23 rtc 1301 cea g22 matrix m21 ARM926EJ-S LPC3180 LPC3180FEL320 PL080 difference between arm7 and arm9 Text: LPC3180 16/32-bit ARM microcontroller; hardware floating-point coprocessor, USB On-The-Go, and SDRAM memory interface Rev. 01 — 2 June 2006 Preliminary data sheet 1. General description The LPC3180 is an ARM9-based microcontroller for embedded applications requiring	Original	LPC3180 16/32-bit LPC3180 ARM926EJ-S INS16Cx50 cea f23 rtc 1301 cea g22 matrix m21 LPC3180FEL320 PL080 difference between arm7 and arm9	PDF
PCB layout guidelines for NXP MCUs in BGA packages Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,	Original	AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern	PDF
LPC2468 reflow solder profile Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,	Original	AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross	PDF
INS16Cx50 Abstract: cea g22 cea f23 rtc 1301 cea F21 difference between arm7 and arm9 matrix m21 ARM926EJ-S LPC3180 LPC3180FEL320 Text: LPC3180 16/32-bit ARM microcontroller; hardware floating-point coprocessor, USB On-The-Go, and SDRAM memory interface Rev. 02 — 15 February 2007 Preliminary data sheet 1. General description The LPC3180 is an ARM9-based microcontroller for embedded applications requiring	Original	LPC3180 16/32-bit LPC3180 ARM926EJ-S INS16Cx50 cea g22 cea f23 rtc 1301 cea F21 difference between arm7 and arm9 matrix m21 LPC3180FEL320	PDF