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Catalog Datasheet	Type	Document Tags	PDF
MS-026 Abstract: HLQFP44 sot792 Text: PDF: 2002 Nov 15 Philips Semiconductors Package outline HLQFP44: plastic thermal enhanced low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm; heatsink SOT792-1 c y heatsink X A Dh 33 23 34 22 ZE e E HE Eh A A2 A 3 A1 w M θ bp pin 1 index 44	Original	HLQFP44: OT792-1 MS-026 MS-026 HLQFP44 sot792	PDF

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MS-026

Abstract: HLQFP44 sot792
Text: PDF: 2002 Nov 15 Philips Semiconductors Package outline HLQFP44: plastic thermal enhanced low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm; heatsink SOT792-1 c y heatsink X A Dh 33 23 34 22 ZE e E HE Eh A A2 A 3 A1 w M θ bp pin 1 index 44

Original

HLQFP44: OT792-1 MS-026 MS-026 HLQFP44 sot792

PDF