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Abstract: No abstract text available
Text: Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions UNIT A
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OT732-1
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Untitled
Abstract: No abstract text available
Text: PDF: 2002 Mar 19 Philips Semiconductors Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 0.3 35.2 34.8 For unspecified dimensions see FCP2-drawing given in the subpackage code.
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OT732-1
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underfill
Abstract: FCP2 SOT732-1 sot732
Text: Package outline Philips Semiconductors FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions
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OT732-1
underfill
FCP2
SOT732-1
sot732
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Q8031
Abstract: ISL9504 U7500 SLG8LP436 ISL9504 macbook "board view" macbook 820-1889 c5966 U6200 PP3V42G3H
Text: 8 6 7 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 2 3 4 5 1 CK APPD M42C MLB REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE C 474680 PRODUCTION RELEASED
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ITP700FLEX
LIP-SM-M42
Q8031
ISL9504 U7500
SLG8LP436
ISL9504
macbook
"board view" macbook
820-1889
c5966
U6200
PP3V42G3H
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RTL8211E
Abstract: ISL6258A 88E1116R Marvell 88E1116R ISL6258 RTL8211 L6703 u9701 MCP79-B01 Q7055
Text: 8 6 7 2 3 4 5 1 CK APPD 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. REV SCHEM,MBP 15"MLB ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE ? ? ? ? DATE ?
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ISL10
ISL11
RTL8211E
ISL6258A
88E1116R
Marvell 88E1116R
ISL6258
RTL8211
L6703
u9701
MCP79-B01
Q7055
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RTL8211E
Abstract: Marvell 88E1116R TC7SZ08AFEAPE TLA-6T213HF C5855 88E1116R 57B8 PP3V42 NTC 15D-7 u9701
Text: 8 6 7 REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE M97A MLB SCHEMATIC C 681298 PRODUCTION RELEASED DATE 03/11/09 ? REFERENCED FROM T18 03/11/2009 D .csa Date Page TABLE_TABLEOFCONTENTS_HEAD TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM
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ISL6259
Abstract: transistor C3229 ISL6258AHRTZ transistor c6074 ISL9504BCRZ of transistor c2570 transistor c3300 c3228 transistor transistor c3150 c2570 transistor
Text: 8 7 6 5 4 3 2 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 1 REV ECN DESCRIPTION OF REVISION C 0000813234 CK APPD DATE PRODUCTION RELEASED 2009-11-01
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ISO-11785
Abstract: No abstract text available
Text: HTMS1x01; HTMS8x01 HITAG µ transponder IC Rev. 3.2 — 3 July 2012 152932 Product data sheet COMPANY PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various
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HTMS1x01;
HTMS8x01
ISO-11785
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IC 742
Abstract: HITAG 2 coding algorithm hitag s256 HITAG s HITAG 2 PROTOCOL HTSH4801ETK HITAG 2 command CRC 8 transponder nxp HITAG PROTOCOL
Text: HTSICH56; HTSICH48 HITAG S transponder IC Rev. 3.0 — 12 October 2011 210330 Product short data sheet COMPANY PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various
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HTSICH56;
HTSICH48
IC 742
HITAG 2 coding algorithm
hitag s256
HITAG s
HITAG 2 PROTOCOL
HTSH4801ETK
HITAG 2 command
CRC 8
transponder nxp
HITAG PROTOCOL
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FCS20
Abstract: SL2ICS20 12NC ordering code philips SL2FCS2001DV SL2ICS2001 12NC philips philips application notes sot732bb1 sot732aa1 sot732
Text: INTEGRATED CIRCUITS ADDENDUM SL2 FCS20 I-CONNECT SLI Flip Chip Package Specification Product Specification Revision 3.0 Public Philips Semiconductors January 2003 Philips Semiconductors Product Specification Rev 3.0 I-CONNECT Specification January 2003 SL2 FCS 20
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FCS20
SCA74
FCS20
SL2ICS20
12NC ordering code philips
SL2FCS2001DV
SL2ICS2001
12NC philips
philips application notes
sot732bb1
sot732aa1
sot732
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ISL9504
Abstract: "board view" macbook macbook C4130 k20 apple PP3V42G3H PP3V42 U6200 58A-6 p66 apple
Text: 8 6 7 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 2 3 4 5 1 CK APPD M42C MLB REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE C 474680 PRODUCTION RELEASED
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ITP700FLEX
ISL9504
"board view" macbook
macbook
C4130
k20 apple
PP3V42G3H
PP3V42
U6200
58A-6
p66 apple
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ISO-11785
Abstract: HITAG 2 algorithm timing HITAG S SOT732-1 HITAG PROTOCOL 11785 crc HTMS1X01 AF MARKING
Text: HTMS1x01; HTMS8x01 HITAG µ transponder IC Rev. 3.2 — 3 July 2012 152932 Product data sheet COMPANY PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various
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HTMS1x01;
HTMS8x01
ISO-11785
HITAG 2 algorithm timing
HITAG S
SOT732-1
HITAG PROTOCOL
11785 crc
HTMS1X01
AF MARKING
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Philips MF1 IC S50
Abstract: Philips Mifare 1 S50 mf1 s50 Mifare MF1 S50 Specification FCP2 Flip Chip Package FCP2 Philips Mifare 1 S50 specifications MF1 IC S50 mifare s50 mifare s50 MIFARE
Text: INTEGRATED CIRCUITS ADDENDUM MF1 FCP2 S50 Flip Chip Package Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.1 October 2004 Flip Chip Package Specification MF1 FCP2 S50
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SCA74
Philips MF1 IC S50
Philips Mifare 1 S50
mf1 s50
Mifare MF1 S50
Specification FCP2 Flip Chip Package
FCP2
Philips Mifare 1 S50 specifications
MF1 IC S50
mifare s50
mifare s50 MIFARE
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MCP79MXT-B3
Abstract: ISL6258A ti c3931 u9701 rtl8211* Reference design L6703 C3931 88E1116R FW643E CS4206A
Text: 8 6 7 2 3 4 5 1 CK APPD 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. REV SCHEM,CORNHOLE,K19 ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE ? ? ? ? DATE
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ISL10
ISL11
MCP79MXT-B3
ISL6258A
ti c3931
u9701
rtl8211* Reference design
L6703
C3931
88E1116R
FW643E
CS4206A
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MF0 IC U1X
Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Text: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1
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SCA74
MF0 IC U1X
philips 22c
Specification FCP2 Flip Chip Package
SOT732CA2
12NC ordering code philips
MF0ICU10
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RTL8211E
Abstract: RTL8211CL reference Design MCP79 HS82117 rtl8211cl RTL8211 u9701 ISL6258A C5855 TC7SZ08AFEAPE
Text: 8 6 7 REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE M97 MLB SCHEMATIC A 625211 PRODUCTION RELEASED DATE 08/29/08 ? REFERENCED FROM T18 08/27/2008 D .csa Date Page TABLE_TABLEOFCONTENTS_HEAD TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM
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HITAG PROTOCOL
Abstract: HITAG 2 datasheet ISO-11785 11785 crc ic 931 HITAG 2 protocol HITAG command BU 508 AF HITAG s transponder chip
Text: HITAG µ Transponder IC Rev. 3.1 — 21 January 2010 152931 Product data sheet PUBLIC 1. General description The HITAG product line is well known and established in the contactless identification market. Due to the open marketing strategy of NXP Semiconductors there are various
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS ADDENDUM SL2 FCS20 I-CONNECT SLI Flip Chip Package Specification Preliminary Specification Revision 2.1 Public Philips Semiconductors October 2002 Philips Semiconductors Preliminary Specification Rev 2.1 I-CONNECT Specification October 2002
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FCS20
SCA74
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Specification FCP2 Flip Chip Package
Abstract: MF0 IC U1X 12NC ordering code nxp sot732ca2
Text: MF0 FCP2 U1 Flip chip package Rev. 3.1 — 8 February 2007 Product data sheet 073631 PUBLIC 1. General description 1.1 Scope This document specifies the products MF0FCP2U10 and MF0FCP2U11: • The MF0FCP2U10/DH is the integrated circuit MF0ICU10 in the package
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MF0FCP2U10
MF0FCP2U11:
MF0FCP2U10/DH
MF0ICU10
OT732CA2.
MF0FCP2U11/DH
MF0ICU11
Specification FCP2 Flip Chip Package
MF0 IC U1X
12NC ordering code nxp
sot732ca2
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EEPROM 71005
Abstract: HITAG 2 coding algorithm hitag s256 HITAG s transponder antenna design guide form passive enter philips hts HITAG command HITAG 2 algorithm timing hitags256 Hitag S256 Philips Semiconductors
Text: INTEGRATED CIRCUITS DATA SHEET HITAG S HTS IC H32/HTS IC H56/HTS IC H48 Transponder IC Product Specification Revision 3.0 PUBLIC INFORMATION 2003 November 12 079230 Philips Semiconductors Product Specification Revision 3.0 2003 November 12 HITAG S HTS IC H32/HTS IC H56/HTS IC H48
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H32/HTS
H56/HTS
SCA74
EEPROM 71005
HITAG 2 coding algorithm
hitag s256
HITAG s
transponder antenna design guide form passive enter
philips hts
HITAG command
HITAG 2 algorithm timing
hitags256
Hitag S256 Philips Semiconductors
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h48 diode
Abstract: HITAG s hitag s256 Car security system block diagram HITAG PROTOCOL EEPROM 71005 diode H48 HITAG 2 algorithm timing Transponder ID 48 HITAG 2 coding algorithm
Text: INTEGRATED CIRCUITS DATA SHEET HITAG S HTS IC H32/HTS IC H56/HTS IC H48 Transponder IC Product Specification Revision 3.1 PUBLIC INFORMATION 2006 July 18 079231 Philips Semiconductors Product Specification Revision 3.1 2006 July 18 HITAG S HTS IC H32/HTS IC H56/HTS IC H48
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H32/HTS
H56/HTS
SCA74
h48 diode
HITAG s
hitag s256
Car security system block diagram
HITAG PROTOCOL
EEPROM 71005
diode H48
HITAG 2 algorithm timing
Transponder ID 48
HITAG 2 coding algorithm
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