SOT607 Search Results

SOT607 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT607-1		NXP Semiconductors	Plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm		Original	PDF

SOT607 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
TSSOP30 Abstract: No abstract text available Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A 3 A2 A A1 pin 1 index θ Lp L 1 15 bp e detail X w M 2.5 5 mm	Original	PDF	TSSOP30: OT607-1 MO-153 TSSOP30
Untitled Abstract: No abstract text available Text: Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A2 pin 1 index A 3 A1 A θ Lp L 1 15 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).	Original	PDF	TSSOP30: OT607-1 MO-153
tssop30 Abstract: sot607 Text: PDF: 2000 Feb 07 Philips Semiconductors Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A2 A 3 A A1 pin 1 index θ Lp L 1 15 bp e detail X w M 2.5 5 mm	Original	PDF	TSSOP30: OT607-1 MO-153 tssop30 sot607
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	PDF	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package