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    SOT589 Search Results

    SOT589 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT589-1 NXP Semiconductors Footprint for reflow soldering SOT589-1 Original PDF
    SOT589-1 NXP Semiconductors Plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA553 package SOT589-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF BGA553 OT589-1 OT589-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline SOT589-1 BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 AJ AG AE AC AA W U R N L J G E C A ∅v ∅w b e M M C A B C AH AF AD AB e Y V T e2 P M K H F D B


    Original     		PDF OT589-1 BGA553: MS-034

    sot589

    Abstract: No abstract text available
    Text: PDF: 2000 Apr 13 Philips Semiconductors Package outline BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm SOT589-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AJ AG AE AC AA W U R N


    Original     		PDF BGA553: OT589-1 sot589