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    SOT575

    Abstract: D 304 x MS-029
    Text: PDF: 1999 Dec 08 Philips Semiconductors Package outline SQFP304: plastic shrink quad flat package; 304 leads; lead length 1.3 mm , body 40 x 40 x 3.8 mm SOT575-1 c y X A 153 228 152 229 ZE e A E HE A2 A1 (A3) w M θ bp Lp L detail X pin 1 index 304 77 1 76


    Original     		PDF SQFP304: OT575-1 MS-029 SOT575 D 304 x MS-029

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package