SOT573 Search Results

SOT573 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Type	PDF
SOT573-1		NXP Semiconductors	Plastic quad flat package; 144 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm		Original	PDF
SOT573-1		NXP Semiconductors	Footprint for reflow soldering SOT573-1		Original	PDF

SOT573 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
BP 109 transistor Abstract: MS-022 QFP144 Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline QFP144: plastic quad flat package; 144 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm SOT573-1 c y X A 108 73 72 ZE 109 e E HE A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index 144 37 36 1 ZD wM bp e	Original	PDF	QFP144: OT573-1 MS-022 BP 109 transistor MS-022 QFP144
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP144 package SOT573-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land	Original	PDF	QFP144 OT573-1 OT573-1
BP 109 transistor Abstract: BP 109 QFP144 transistor BP 109 MS022 diode zd 22 ZD 2 36 ZD 22 MS-022 sot573 Text: PDF: 1999 Dec 08 Philips Semiconductors Package outline QFP144: plastic quad flat package; 144 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm SOT573-1 c y X A 108 73 72 ZE 109 e E HE A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index 144 37 36 1 ZD wM bp e	Original	PDF	QFP144: OT573-1 MS-022 BP 109 transistor BP 109 QFP144 transistor BP 109 MS022 diode zd 22 ZD 2 36 ZD 22 MS-022 sot573
Untitled Abstract: No abstract text available Text: Package outline QFP144: plastic quad flat package; 144 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm SOT573-1 c y X A 108 73 72 ZE 109 e E HE A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index 144 37 36 1 ZD wM bp e v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)	Original	PDF	QFP144: OT573-1 MS-022
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	PDF	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package