LFBGA324
Abstract: MO-205
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm A B D SOT571-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y1 C y ∅w M C V U
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LFBGA324:
OT571-1
MO-205
LFBGA324
MO-205
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LFBGA324
Abstract: MO-205 SOT571 LFBGA-324
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm B D SOT571-1 A ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A V U T e R P N
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LFBGA324:
OT571-1
MO-205
LFBGA324
MO-205
SOT571
LFBGA-324
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ISO10918
Abstract: TDA9991 sdram controller smd transistor A1 3 PIN usb ccd controller ic FXA1022 LFBGA324 PR3001 SAA8122A SAA8122AEL
Text: SAA8122A Digital Still Camera Processor ImagIC family Rev. 01 — 20 April 2000 Objective specification 1. Description The DSC SAA8122A is a high performance, low power, single-chip Million Instructions Per Second (MIPS) based signal processor, part of the ImagIC family,
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SAA8122A
SAA8122A
FXA1022,
TDA9991)
TDA9952)
ISO10918
TDA9991
sdram controller
smd transistor A1 3 PIN
usb ccd controller ic
FXA1022
LFBGA324
PR3001
SAA8122AEL
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TDA9952
Abstract: sdram controller FXA1022 LFBGA324 PR3001 SAA8122A SAA8122AEL TDA9991
Text: SAA8122A Digital Still Camera Processor ImagIC family Rev. 03 — 22 November 2000 Objective specification 1. Description The DSC SAA8122A is a high performance, low power, single-chip Million Instructions Per Second (MIPS) based signal processor, part of the ImagIC family,
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SAA8122A
SAA8122A
FXA1022,
TDA9991)
TDA9952)
TDA9952
sdram controller
FXA1022
LFBGA324
PR3001
SAA8122AEL
TDA9991
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BAYER COLOUR PATTERN
Abstract: No abstract text available
Text: SAA8122A Digital Still Camera Processor ImagIC family Rev. 02 — 2 October 2000 Objective specification 1. Description The DSC SAA8122A is a high performance, low power, single-chip Million Instructions Per Second (MIPS) based signal processor, part of the ImagIC family,
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PDF
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SAA8122A
SAA8122A
FXA1022,
TDA9991)
TDA9952)
BAYER COLOUR PATTERN
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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