LFBGA64
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B y y1 C ∅w M b e v M A H e G F E e1 D C
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LFBGA64:
OT534-1
LFBGA64
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LFBGA64
Abstract: No abstract text available
Text: PDF: 2003 Feb 05 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm D SOT534-1 A B ball A1 index area A A2 E A1 detail X C e1 ∅v M C A B b 1/2 e y1 C y ∅w M C e H e G F
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LFBGA64:
OT534-1
LFBGA64
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sot534
Abstract: No abstract text available
Text: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm SOT534-1 D ball A1 index area A2 A E A1 detail X A ∅w M b y v A ZD e ZE H G F e E D C B A 1 2 3 4 5 6
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LFBGA64:
OT534-1
sot534
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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TSB41AB2E
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS PDI1394P23 2-port/1-port 400 Mbps physical layer interface Preliminary data Philips Semiconductors 2001 Jul 18 Philips Semiconductors Preliminary data 2-port/1-port 400 Mbps physical layer interface 1.0 FEATURES • Fully supports provisions of IEEE 1394–1995 Standard for high
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PDI1394P23
P1394a
TSB41AB2E
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PDI1394P25BD
Abstract: PDI1394L40 PDI1394L41 PDI1394P25 PDI1394P25EC TSB41AB1 268US
Text: INTEGRATED CIRCUITS PDI1394P25 1-port 400 Mbps physical layer interface Preliminary data Supersedes data of 2001 Jul 18 Philips Semiconductors 2001 Sep 06 Philips Semiconductors Preliminary data 1-port 400 Mbps physical layer interface 1.0 FEATURES • Fully supports provisions of IEEE 1394–1995 Standard for high
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PDI1394P25
P1394a
P1394ao
PDI1394P25BD
PDI1394L40
PDI1394L41
PDI1394P25
PDI1394P25EC
TSB41AB1
268US
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS PDI1394P25 1-port 400 Mbps physical layer interface Preliminary data Philips Semiconductors 2001 Jul 18 Philips Semiconductors Preliminary data 1-port 400 Mbps physical layer interface 1.0 FEATURES • Fully supports provisions of IEEE 1394–1995 Standard for high
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PDI1394P25
P1394a
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SV01073
Abstract: PD1394P11ABD
Text: INTEGRATED CIRCUITS PDI1394P11A 3-port physical layer interface Preliminary specification Philips Semiconductors 1999 Mar 10 Philips Semiconductors Preliminary specification 3-port physical layer interface PDI1394P11A 1.0 FEATURES 2.0 DESCRIPTION • 3 cable interface ports
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PDI1394P11A
PDI1394P11A
100Mb/s
200Mb/s
1394a
IEEE1394-1995
OT314
SV01073
PD1394P11ABD
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PDI1394L40
Abstract: PDI1394L41 PDI1394P23 PDI1394P23BD PDI1394P23EC philips lps 100
Text: INTEGRATED CIRCUITS PDI1394P23 2-port/1-port 400 Mbps physical layer interface Preliminary data Supersedes data of 2001 Jul 18 Philips Semiconductors 2001 Sep 06 Philips Semiconductors Preliminary data 2-port/1-port 400 Mbps physical layer interface 1.0 FEATURES
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PDI1394P23
P1394a
PDI1394L40
PDI1394L41
PDI1394P23
PDI1394P23BD
PDI1394P23EC
philips lps 100
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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TSB41LV02AE
Abstract: No abstract text available
Text: 34 .80 7IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. ● Company name - Philips Semiconductors is replaced with ST-NXP Wireless.
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807IRELESS
TSB41LV02AE
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PDI1394L40
Abstract: PDI1394L41 PDI1394P25 PDI1394P25BD PDI1394P25EC TSB41AB1
Text: 34 .80 7IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. ● Company name - Philips Semiconductors is replaced with ST-NXP Wireless.
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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PDI1394P23BD
Abstract: PDI1394L40 PDI1394L41 PDI1394P23 PDI1394P23EC
Text: INTEGRATED CIRCUITS PDI1394P23 2-port/1-port 400 Mbps physical layer interface Preliminary data Supersedes data of 2001 Jul 18 Philips Semiconductors 2001 Sep 06 Philips Semiconductors Preliminary data 2-port/1-port 400 Mbps physical layer interface 1.0 FEATURES
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PDI1394P23
P1394a
PDI1394P23BD
PDI1394L40
PDI1394L41
PDI1394P23
PDI1394P23EC
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