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Abstract: No abstract text available
Text: Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1 20 w M bp e ZD v M A D B
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HTQFP80:
OT513-1
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HTQFP80
Abstract: sot513
Text: PDF: 1999 Nov 23 Philips Semiconductors Package outline HTQFP80: plastic, heatsink thin quad flat package; 80 leads; body 14 x 14 x 1.0 mm SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1
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HTQFP80:
OT513-1
HTQFP80
sot513
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HTQFP80
Abstract: No abstract text available
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X
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HTQFP80:
OT513-1
HTQFP80
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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Text: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
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HTQFP32
OT547-2
HTQFP48
OT545-2
HTQFP80
OT513-1
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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