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    SOT31 Search Results

    SOT31 Datasheets (22)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT310-1 NXP Semiconductors Plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 20 x 3.0 mm Original PDF
    SOT313-2 NXP Semiconductors Footprint for reflow soldering SOT313-2 Original PDF
    SOT313-2 NXP Semiconductors Plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm Original PDF
    SOT313-2_118 NXP Semiconductors LQFP48; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT313-2_128 NXP Semiconductors LQFP48; Reel pack; SMD, 13", TurnedQ2/T3 Standard product orientationOrderable part number ending ,128 or HPOrdering code (12NC) ending 128 Original PDF
    SOT314-2 NXP Semiconductors Plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm Original PDF
    SOT314-2 NXP Semiconductors Footprint for reflow soldering SOT314-2 Original PDF
    SOT314-2_118 NXP Semiconductors LQFP64; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT315-1 NXP Semiconductors Plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm Original PDF
    SOT315-1 NXP Semiconductors Footprint for reflow soldering SOT315-1 Original PDF
    SOT315-1_118 NXP Semiconductors LQFP80; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118 Original PDF
    SOT316-1 NXP Semiconductors Footprint for reflow soldering SOT316-1 Original PDF
    SOT316-1 NXP Semiconductors Plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height Original PDF
    SOT317-1 NXP Semiconductors Plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height Original PDF
    SOT317-2 NXP Semiconductors Footprint for reflow soldering SOT317-2 Original PDF
    SOT317-2 NXP Semiconductors Plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm Original PDF
    SOT317-3 NXP Semiconductors Plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm Original PDF
    SOT317-3 NXP Semiconductors Footprint for reflow soldering SOT317-3 Original PDF
    SOT318-1 NXP Semiconductors Plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height Original PDF
    SOT318-2 NXP Semiconductors Plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm Original PDF

    SOT31 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP100 package SOT317-3 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF QFP100 OT317-3 OT317-3

    Untitled

    Abstract: No abstract text available
    Text: 8 LQ FP 4 SOT313-2 LQFP48; Reel pack; SMD, 13", Turned Q2/T3 Standard product orientation Orderable part number ending ,128 or HP Ordering code 12NC ending 128 Rev. 1 — 24 April 2013 Packing information 1. Packing method Printed plano box Barcode label


    Original     		PDF OT313-2 LQFP48; 001aak603 OT313-2

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of LQFP48 package SOT313-2 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area


    Original     		PDF LQFP48 OT313-2 sot313-2

    Untitled

    Abstract: No abstract text available
    Text: 64 LQ FP SOT314-2 LQFP64; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape


    Original     		PDF OT314-2 LQFP64; 001aak603 OT314-2

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SQFP208 package SOT316-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF SQFP208 OT316-1 OT316-1

    LQFP80

    Abstract: LQFP-80
    Text: Philips Semiconductors Package outlines LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm 1997 Jul 15 1 SOT315-1


    Original     		PDF LQFP80: OT315-1 LQFP80 LQFP-80

    Untitled

    Abstract: No abstract text available
    Text: Package outline QFP80: plastic quad flat package; 80 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT318-2 c y X 64 A 41 40 65 ZE e E HE A A2 (A 3) A1 wM pin 1 index θ Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF QFP80: OT318-2 MO-112

    MO-112

    Abstract: QFP100
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-3 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD


    Original     		PDF QFP100: OT317-3 MO-112 MO-112 QFP100

    MO-112

    Abstract: QFP100
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-2 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD


    Original     		PDF QFP100: OT317-2 MO-112 MO-112 QFP100

    MS-022

    Abstract: QFP80
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3 mm SOT310-1 c y X A 64 41 65 40 ZE e A A2 E HE (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A


    Original     		PDF QFP80: OT310-1 134E14 MS-022 MS-022 QFP80

    SOT314-2

    Abstract: LQFP64 MS-026 136E10
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 A 3 A1 wM θ bp pin 1 index 64 Lp L 17 1 detail X 16 ZD e v M A wM bp D B HD


    Original     		PDF LQFP64: OT314-2 136E10 MS-026 SOT314-2 LQFP64 MS-026 136E10

    QFP80

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm 1995 Feb 04 5-24 SOT310-1


    Original     		PDF QFP80: OT310-1 QFP80

    Al21

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm SOT315-1 c y X A 60 41 40 Z E 61 e E HE A A2 A 3 A1 w M θ bp L pin 1 index 80 Lp 21 detail X 20 1 ZD e v M A w M bp D


    Original     		PDF LQFP80: OT315-1 OT315-1 Al21

    sot311

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines SOT311 44-pin square plastic quad flat pack B package NOTE: SOT311 replaced by SOT307-2. SOT311 no longer available. 1


    Original     		PDF OT311 44-pin OT311 OT307-2. sot311

    Untitled

    Abstract: No abstract text available
    Text: PDF: 1999 Dec 15 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT317-3 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD


    Original     		PDF QFP100: OT317-3 OT317-3 MO-112

    Untitled

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT318-2 c y X 64 A 41 40 65 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A


    Original     		PDF QFP80: OT318-2 OT318-2

    MS-029

    Abstract: SQFP208
    Text: PDF: 2000 Jan 26 Philips Semiconductors Package outline SQFP208: plastic shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT316-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) wM θ Lp bp L pin 1 index


    Original     		PDF SQFP208: OT316-1 MS-029 MS-029 SQFP208

    MO-112

    Abstract: QFP100
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP100: plastic quad flat package; 100 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT317-1 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X


    Original     		PDF QFP100: OT317-1 MO-112 MO-112 QFP100

    LQFP48

    Abstract: SOT313-2 MS-026
    Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 25 A 37 24 ZE e E HE A A2 A 3 A1 w M pin 1 index θ bp Lp L 13 48 detail X 12 1 ZD e v M A w M bp D B HD


    Original     		PDF LQFP48: OT313-2 136E05 MS-026 LQFP48 SOT313-2 MS-026

    QFP80

    Abstract: jedec QFP80 MO-112
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT318-1 c y X 64 A 41 65 40 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 25 80 detail X


    Original     		PDF QFP80: OT318-1 MO-112 QFP80 jedec QFP80 MO-112

    MO-112

    Abstract: QFP64
    Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT319-1 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM Lp pin 1 index bp L 20 64 detail X


    Original     		PDF QFP64: OT319-1 MO-112 MO-112 QFP64

    QFP64 package

    Abstract: QFP64
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.8 mm SOT319-3 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM Lp pin 1 index bp L 20 64 detail X 19 1 w M bp e ZD v M A


    Original     		PDF QFP64: OT319-3 QFP64 package QFP64

    LQFP80

    Abstract: No abstract text available
    Text: LQ FP 80 SOT315-1 LQFP80; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape


    Original     		PDF OT315-1 LQFP80; 001aak603 OT315-1 LQFP80

    DVD player with usb port circuit diagram

    Abstract: ISP1181BDGG .118 UM10056 ISP1760 ISP1181BBS CP2147BE isp1563BM portable dvd player block diagram ISP1520BD portable dvd player video line driver IC
    Text: USB USB 283 Transceivers Hi-Speed USB transceiver HI-SPEED USB TRANSCEIVER Type number Package Remarks Clock frequency speed modes # of bits main supply voltage digital I/O I/F voltage CP2147BE SOT313-2 LQFP48 host, peripheral 12 MHz high-speed, fullspeed


    Original     		PDF CP2147BE OT313-2 LQFP48) ISP1504ABS OT617-1 HVQFN32) ISP1504CBS ISP1505ABS DVD player with usb port circuit diagram ISP1181BDGG .118 UM10056 ISP1760 ISP1181BBS CP2147BE isp1563BM portable dvd player block diagram ISP1520BD portable dvd player video line driver IC