SIL-13P
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline SIL13P: plastic single in-line power package; 13 leads SOT193-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 13 e Z Q w M bp 5 10 mm scale DIMENSIONS mm are the original dimensions
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SIL13P:
OT193-2
SIL-13P
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Untitled
Abstract: No abstract text available
Text: Package outline SIL13P: plastic single in-line power package; 13 leads SOT193-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 13 e Z Q w M bp 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A1 max. A2 b
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SIL13P:
OT193-2
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SIL-13P
Abstract: sot193
Text: PDF: 1999 Dec 17 Philips Semiconductors Package outline SIL13P: plastic single in-line power package; 13 leads SOT193-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 13 e Z Q w M bp 5 10 mm scale DIMENSIONS mm are the original dimensions
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SIL13P:
OT193-2
SIL-13P
sot193
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SO20-300
Abstract: QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120
Text: CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting Rth j-a 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions
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OT111-1
OT157-2
DBS13P
OT141-6
DBS17P
OT243-1
DBS23P
OT411-1
HSOP20
OT418-2
SO20-300
QFP PACKAGE thermal resistance
SO14-150
MBK360
SOT411
QFP-80-14
die bond
diode handbook
MBK368
QFP120
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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