Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT11 Search Results

    SF Impression Pixel

    SOT11 Price and Stock

    Nexperia 74AVC4T245GU,115

    Translation - Voltage Levels SOT1161-1 DUAL SUPPLY TRANS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVC4T245GU,115 Reel 128,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.38
    Buy Now

    Nexperia PMCPB5530X,115

    MOSFETs SOT1118 DUAL CHAN 20V
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PMCPB5530X,115 Reel 57,000 3,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.146
    Buy Now

    Nexperia PUSB3FR4Z

    ESD Protection Diodes / TVS Diodes PUSB3FR4/SOT1176/XSON10
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PUSB3FR4Z Reel 15,000 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.057
    Buy Now

    Nexperia 74AVC4T774GUX

    Translation - Voltage Levels 74AVC4T774GU/SOT1161/XQFN16
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVC4T774GUX Reel 12,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.307
    Buy Now

    Nexperia NXS0104GU12X

    Translation - Voltage Levels NXS0104GU12/SOT1174/XQFN12
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI NXS0104GU12X Reel 12,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.267
    Buy Now

    SOT11 Datasheets (147)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT110-1 NXP Semiconductors Plastic single in-line medium power package with fin; 9 leads Original PDF
    SOT1107-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 296 balls Original PDF
    SOT1108-1 NXP Semiconductors metal thin special-shape package; no leads; 4 terminals; resin based; body 4 x 3 x 1 mm Original PDF
    SOT1110A NXP Semiconductors Flanged LDMOST ceramic package; 2 mounting holes; 8 leads Original PDF
    SOT1113-1_118 NXP Semiconductors HVQFN44; reel pack; SMD; 13"; standard product orientation; Orderable part number ending, 118 or J; Orderable code (12NC) ending 118 Original PDF
    SOT1114-1 NXP Semiconductors Plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm Original PDF
    SOT1115 NXP Semiconductors extremely thin small outline package; no leads; 6 terminals Original PDF
    SOT1115_132 NXP Semiconductors Reversed product orientation 12NC ending 132 Original PDF
    SOT1116 NXP Semiconductors extremely thin small outline package; no leads; 8 terminals Original PDF
    SOT1118 NXP Semiconductors Footprint for reflow soldering SOT1118 Original PDF
    SOT1118 NXP Semiconductors Plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm Original PDF
    SOT1118_115 NXP Semiconductors DFN2020-6; reel pack; standard orientation; 12NC ending 115 Original PDF
    SOT1119-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 432 balls; heatsink Original PDF
    SOT1120A NXP Semiconductors Flanged LDMOST ceramic package; 2 mounting holes; 6 leads Original PDF
    SOT1120B NXP Semiconductors earless flanged LDMOST ceramic package; 6 leads Original PDF
    SOT1121A NXP Semiconductors Flanged LDMOST ceramic package; 2 mounting holes; 4 leads Original PDF
    SOT1121B NXP Semiconductors earless flanged ceramic package; 4 leads Original PDF
    SOT1121C NXP Semiconductors earless flanged ceramic package; 4 leads Original PDF
    SOT1122 NXP Semiconductors Footprint for reflow soldering SOT1122 Original PDF
    SOT1122 NXP Semiconductors Plastic extremely thin small outline package; no leads; 3 terminals Original PDF
    ...

    SOT11 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BGY67A

    Abstract: DIN45004B
    Text: BGY67A 200 MHz, 24 dB gain reverse amplifier Rev. 04 — 14 March 2005 Product data sheet 1. Product profile 1.1 General description Hybrid high dynamic range amplifier module in a SOT115J package operating at a voltage supply of 24 V DC . CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken


    Original
    BGY67A OT115J MSC895 BGY67A DIN45004B PDF

    CGD942C

    Abstract: No abstract text available
    Text: CGD942C 870 MHz, 23 dB gain power doubler amplifier Rev. 01 — 7 June 2007 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V DC , employing Hetero Field Effect Transistor (HFET) GaAs dies.


    Original
    CGD942C OT115J CGD942C PDF

    sot1138

    Abstract: No abstract text available
    Text: Package outline HSOP4F: plastic, heatsink small outline package; 4 leads flat SOT1138-1 B D A E X c y v HE A D1 D2 e 4 3 E2 E1 A A2 A1 pin 1 index Q1 detail X 1 2 w b B 10 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A A1 3.9 0.2


    Original
    OT1138-1 OT1138-1 sot1138- sot1138-1 sot1138 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1194-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm


    Original
    OT1194-1 sot1194-1 PDF

    HVSON12

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-1 Gx D 0.105 P C SPx nSPx SPy Hy Gy SLy nSPy By Ay SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit


    Original
    HVSON12 OT1179-1 sot1179-1 PDF

    hxqfn60u

    Abstract: SOT1134-1 sot1134
    Text: Package outline HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 x 6 x 0.5 mm B D SOT1134-1 A terminal 1 index area E A A1 detail X e2 e1 1/2 e e C A B C v w L1 D2 D6 A11 B8 B10 A16 D7 A10 L eR


    Original
    HXQFN60U: OT1134-1 sot1134-1 hxqfn60u sot1134 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU 11x 0.32 CU (1×) 0.45 (1×) 2.55 1 CU 2.05 2.3 CU 0.4 (7×) 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper


    Original
    XQFN12 OT1174-1 sot1174-1 PDF

    catv amplifier

    Abstract: CATV amplifier transistor 6-32UNC-2A BGY687 SC16 5965
    Text: DISCRETE SEMICONDUCTORS DATA SHEET BGY687 CATV amplifier module Product specification Supersedes data of February 1995 File under Discrete Semiconductors, SC16 1995 Sep 11 Philips Semiconductors Product specification CATV amplifier module FEATURES BGY687 PINNING - SOT115J


    Original
    BGY687 OT115J MSA319 catv amplifier CATV amplifier transistor 6-32UNC-2A BGY687 SC16 5965 PDF

    Untitled

    Abstract: No abstract text available
    Text:        CGD942C 870 MHz, 23 dB gain power doubler amplifier Rev. 4 — 25 June 2014 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V DC , employing Hetero Field Effect Transistor (HFET) GaAs dies.


    Original
    CGD942C OT115J PDF

    CGD1044H

    Abstract: No abstract text available
    Text: CGD1044H 1 GHz, 25 dB gain high output power doubler Rev. 3 — 29 September 2010 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V DC , employing Hetero junction Field Effect Transistor (HFET) GaAs dies.


    Original
    CGD1044H OT115J CGD1044H PDF

    BGR269

    Abstract: DIN45004B
    Text: BGR269 200 MHz, 35 dB gain reverse amplifier Rev. 6 — 5 August 2010 Product data sheet 1. Product profile 1.1 General description High performance amplifier in a SOT115J package, operating at a voltage supply of 24 V DC . CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken


    Original
    BGR269 OT115J BGR269 DIN45004B PDF

    TFBGA-296

    Abstract: No abstract text available
    Text: Package outline TFBGA296: plastic thin low profile fine-pitch ball grid array package; 296 balls A B D SOT1107-1 ball A1 index area E A2 A A1 detail X e1 e Y V T P M K H F D B 1/2 e ∅v ∅w b M M C C A B C y1 C y W U R e N L e2 J 1/2 e G E C A ball A1 index area


    Original
    TFBGA296: OT1107-1 TFBGA-296 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads SOT115V D N2 E S2 Z N1 N3 p M M1 M3 M2 A2 1 2 3 4 5


    Original
    OT115V PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w


    Original
    HTSSOP28: OT1172-2 MO-153 sot1172-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HSOP4F: OMP 4 leads flat SOT1138 B D A E C X y E1 HE w A D1 D2 H1 w B e1 E3 A2 E2 Q1 detail X w b B e 5 Dimensions Unit(1) 10 mm scale A2 b c D D1 D2 e e1 E E1 E2 E3 HE H1 Q1 w v 10.01 9.83 8.18 5.89 19.68 12.77 1.6 max 3.86 5.92 0.27 20.62 19.00 16.05


    Original
    OT1138 sot1138 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline DFN2626-10: plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals; body 2.6 x 2.6 x 0.5 mm SOT1197-1 X A B D A E A1 A3 terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y y1 C L k


    Original
    DFN2626-10: OT1197-1 sot1197-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN32R: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based; body 7 x 7 x 0.8 mm B D SOT1152-1 A terminal 1 index area A E detail X e1 e ∅v ∅w b C A B C C 1/2 e L1 9 y y1 C 16 L 8 17 e Eh e2 1/2 e


    Original
    HVQFN32R: OT1152-1 sot1152-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HSOP14F: plastic, heatsink small outline package; 14 leads flat SOT1186-1 A E E2 D c X y HE v A D1 e2 bp2 (2x) w 14 D2 13 E1 A A2 A1 pin 1 index Q detail X 1 12 z w bp1 (12×) e1 e (10×) 5 Dimensions Unit mm 10 mm scale A max 3.50 nom 3.25


    Original
    HSOP14F: OT1186-1 sot1186-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HWQFN32: plastic thermal enhanced very very thin quad flat package; no leads; 32 terminals; 3 x 6 x 0.75 mm A B D SOT1180-1 terminal 1 index area E A A1 c detail X e e1 12 16 C C A B C v w b y y1 C L 17 11 e e2 Eh 27 1 terminal 1 index area


    Original
    HWQFN32: OT1180-1 sot1180-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.2 x 2.5 x 0.5 mm SOT1158-1 X A B D E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 6 C C A B C y1 C y L k E2


    Original
    HXSON12: OT1158-1 sot1158-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D252 BGE787B CATV amplifier module Preliminary specification 2000 Oct 03 Philips Semiconductors Preliminary specification CATV amplifier module BGE787B PINNING - SOT115J FEATURES • Excellent linearity PIN


    Original
    M3D252 BGE787B OT115J OT115J 603518/01/pp6 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.0 x 1.7 x 0.5 mm SOT1177-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L1 k L 10 5 1 Dimensions Unit 1


    Original
    XSON10: OT1177-1 sot1177-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-1 X A B D E A A1 c terminal 1 index area detail X terminal 1 index area e1 e v w b 1 8 C C A B C y1 C y L k Eh 16


    Original
    HUSON16: OT1168-1 sot1168-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-2 X A B D A E A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L K Eh 12


    Original
    HVSON12: OT1179-2 MO-229 sot1179-2 PDF